AI Servers, Robotics, and Cutting-Edge HDI Technology Drive Demand

The printed circuit board (PCB) industry is undergoing a transformative phase, driven by the rapid advancements in artificial intelligence (AI), robotics, and high-performance computing. As global demand for advanced PCBs surges, companies are racing to innovate and deliver solutions that meet the stringent requirements of next-generation technologies. Among these, HDI (High-Density Interconnect) PCBs have emerged as a critical enabler, particularly in AI servers, robotics, and telecommunications.

Our company is proud to announce the successful shipment of our latest 8-layer HDI PCB, manufactured using TU-883 material, a high-performance laminate designed for high-speed, low-loss applications. This product exemplifies our commitment to pushing the boundaries of PCB technology, catering to the ever-evolving needs of the electronics industry.

AI Servers and High-Performance Computing: A Catalyst for PCB Growth

The AI revolution is reshaping the PCB landscape, with AI servers demanding PCBs that offer unparalleled performance, reliability, and density. According to recent industry reports, the global AI server PCB market is projected to grow from 5.8 billion in 2024 to 14.5 billion by 2028, driven by the exponential growth in AI workloads and data center expansions.

One of the key drivers of this growth is the increasing adoption of NVIDIA’s GB200 NVL72 architecture, which requires PCBs with advanced capabilities, including high-layer counts (24-40 layers) and sophisticated HDI technology. Our company has been at the forefront of this trend, achieving a significant milestone by becoming one of the first manufacturers globally to mass-produce 28-layer accelerator card PCBs using 5th and 6th-order HDI technology.

In the latest quarter, our AI server PCB shipments, including products designed for NVIDIA’s GB200, exceeded $2 billion, with high-layer count andHDI boards accounting for 75% of the total revenue. Looking ahead, NVIDIA’s GB200 is expected to ship over 1 million units by 2025, representing nearly 40-50% of its high-end GPU shipments. This surge in demand underscores the critical role of advanced PCBs in enabling the next wave of AI innovation.

Next-Generation Materials: PTFE and TU-883 Leading the Way

As AI and high-performance computing push the limits of PCB technology, material innovation is becoming increasingly important. NVIDIA’s upcoming GB300 architecture is expected to adopt PTFE (Polytetrafluoroethylene) hybrid PCB, which offer superior dielectric properties, including a dielectric constant of 2.1 and a dissipation factor of <5×10⁻⁴. These characteristics make PTFE an ideal choice for high-frequency and high-speed applications.

In parallel, our newly shipped 8-layer HDI PCB leverages TU-883 material, a high-performance laminate renowned for its low dielectric constant (3.39 @ 10GHz) and low dissipation factor (0.0045 @ 10GHz). TU-883, also known as ThunderClad 2, is engineered for high-speed, low-loss applications, making it an excellent fit for AI servers, telecommunications, and robotics. Key features of TU-883 include:

• High Tg (TMA) of 170°C: Ensures thermal stability in demanding environments.
• Halogen-Free and Lead-Free Compatibility: Aligns with environmental regulations and sustainability goals.
• Anti-CAF Capability: Enhances reliability by preventing conductive anodic filament formation.
• Excellent Moisture Resistance: Ensures consistent performance in humid conditions.

This combination of advanced materials and cutting-edge manufacturing techniques positions our 8-layer HDI PCB as a game-changer for high-performance applications.

Robotics: A New Frontier for PCB Innovation

Beyond AI servers, the robotics industry is emerging as a significant growth driver for the PCB market. Humanoid robots, such as Tesla’s Optimus, require highly reliable and dense PCBs for their control systems, sensors, and actuators. Each robot typically incorporates PCBs valued at 80−120, with demand expected to skyrocket as robotics adoption accelerates.

Our 8-layer HDI PCB is ideally suited for robotics applications, offering:

• Blind and Buried Vias: Enable complex interconnections in compact designs.
• Impedance Control: Ensures signal integrity in high-frequency applications.
• Edge Plating and Counterholes: Enhance durability and mechanical stability.

With the robotics market poised for exponential growth, our advanced PCB solutions are well-positioned to meet the industry’s evolving needs.

Our 8-Layer HDI PCB: A Technical Marvel

The newly shipped 8-layer HDI PCB is a testament to our engineering prowess and commitment to quality. Key specifications include:

• Board Type: 8 layers
• Material: TU-883
• Surface Finish: ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
• Board Thickness: 1.45mm±10%
• Minimum Trace Width/Spacing: 150µm/160µm
• Blind Vias: L1-L2, L7-L8
• Buried Vias: L2-L7
• Back-Drilled Vias: L1-L6
• Impedance Control: 100Ω, 90Ω, and 50Ωdifferential pairs

This wholesale HDI PCB is designed for high-speed, high-reliability applications, making it an ideal choice for AI servers, robotics, and telecommunications equipment.

The Future of PCBs: Opportunities and Challenges

As the global PCB industry continues to evolve, several trends are shaping its future: 

1.  AI and High-Performance Computing: The demand for advanced PCBs will continue to grow, driven by AI workloads and data center expansions.
2.  Material Innovation: PTFE, TU-883, and other high-performance materials will play a pivotal role in enabling next-generation applications.
3.  Robotics and IoT: The proliferation of robotics and IoT devices will create new opportunities for PCB manufacturers.
4.  Sustainability: Environmental regulations and consumer preferences are driving the adoption of halogen-free and lead-free materials. 

Our company is committed to staying ahead of these trends, investing heavily in R&D to develop innovative solutions that meet the needs of our customers. In 2024 alone, we have allocated $198 million for research in areas such as PCIe 6.0, 1.6T optical modules, and advanced materials.

Conclusion

The PCB industry is at the forefront of technological innovation, enabling breakthroughs in AI, robotics, and high-performance computing. Our newly shipped 8-layer HDI PCB, built with TU-883 material, represents a significant step forward in meeting the demands of these cutting-edge applications. As we look to the future, we remain committed to delivering high-quality, innovative PCB solutions that empower our customers to achieve their goals.

For more information about our products and capabilities, please visit our website or contact our sales team. Together, we can shape the future of technology.

About Us

We are a globalsupplier of high-performance PCBs, specializing in HDI, high-layer count, and advanced material solutions. With a focus on innovation, quality, and customer satisfaction, we are proud to serve industries ranging from AI and telecommunications to robotics and automotive.