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RF PCB Printed Board
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  • High Demand for HDI: Printed Circuit Board Industry Seizes New Opportunities
    High Demand for HDI: Printed Circuit Board Industry Seizes New Opportunities
    • June 19, 2024

    High Demand for HDI: Printed Circuit Board Industry Seizes New Opportunities   The global printed circuit board (PCB) industry is witnessing a surge in demand for high-density interconnect (HDI) boards, driven by the thriving development of artificial intelligence (AI). As companies embrace new opportunities in the AI sector, the demand for advanced PCBs that can meet the requirements of AI servers is on the rise. Leading PCB companies are strategically positioning themselves to seize these development opportunities and capitalize on the growing market.   HDI boards are characterized by their small size, light weight, high wiring density, and excellent electrical performance. They are particularly suited for AI servers, which demand efficient space utilization, heat dissipation, and high-speed signal transmission capabilities. Compared to traditional through-hole boards, HDI boards can achieve the same functionality with fewer layers, resulting in improved reliability and cost-effectiveness in mass production. These boards also offer advantages in terms of transmission speed and heat dissipation, making them ideal for the AI industry.   According to a research report by Founder Securities, the market size of HDI boards is projected to reach $14.58 billion by 2027, with a compound annual growth rate of 6.2% from 2023 to 2028. This growth rate surpasses the compound annual growth rate of the overall PCB industry, which stands at 5.4%.   In response to the increasing demand for HDI boards, several leading PCB companies have experienced significant stock price increases. Pengding Holdings (002938) saw a 56.97% increase in stock price, Shanghai Electric Power (002463) rose by 70.17%, and Shenghong Technology (300476) increased by 80.05% from January 1st to June 14th, 2024.   Pengding Holdings, a prominent PCB company, has focused its development efforts on AI servers and is currently engaged in mass production. The company has upgraded its production models to accommodate 16 to 20 layers, entering the supply chain of globally renowned server customers. Additionally, Pengding Holdings' PCB products are utilized in the field of AI consumer electronics, including AI smartphones.   Shenghong Technology has made significant investments in research and development, leading to breakthroughs in computing power and AI server fields. The company has introduced multi-stage HDI boards and high multi-layer products based on AI server acceleration modules. With certification and industrial operation for 5-stage 20-layer HDI board products, Shenghong Technology aims to meet the strong global demand for AI-related PCBs, driving the core business growth in the coming years.   Zhongjing Electronics (002579) has reported relatively full HDI board orders and plans to expand its capacity gradually through product architecture optimization and technological transformation. Shanghai Electric Power is actively seizing the structural demand ...

  • What Is the Dragon Boat Festival and Why Is It Celebrated?
    What Is the Dragon Boat Festival and Why Is It Celebrated?
    • June 05, 2024

    What Is the Dragon Boat Festival and Why Is It Celebrated?   The Dragon Boat Festival, also known as Duanwu Festival, is a traditional Chinese holiday that is celebrated on the 5th day of the 5th month of the lunar calendar, which usually falls in late May or early June in the Gregorian calendar. It is a significant cultural festival in China and is also observed by Chinese communities around the world.   The Dragon Boat Festival has a history of over 2,000 years and is celebrated to commemorate the Chinese poet and statesman Qu Yuan (c. 340–278 BCE). Qu Yuan was a patriotic poet during the Warring States period in ancient China. He was deeply devoted to his country and wrote many poems expressing his love for his homeland.   Legend has it that when Qu Yuan's kingdom was conquered, he drowned himself in a river out of despair. The local people admired Qu Yuan and were distraught over his death. To prevent fish and evil spirits from devouring his body, they beat drums, splashed the water with paddles, and threw sticky rice dumplings (known as zongzi) into the river to feed the fish. They also raced in boats to search for his body. These traditions have been passed down and are still practiced during the Dragon Boat Festival today.   The main activities of the Dragon Boat Festival include dragon boat races, eating zongzi, and hanging up pouches of herbs. Dragon boat races involve teams of rowers paddling in long, narrow boats, decorated like dragons, to the beat of a drum. Zongzi, pyramid-shaped glutinous rice dumplings wrapped in bamboo leaves, are a traditional food eaten during the festival. They can be filled with various ingredients like beans, meat, or nuts. Hanging up pouches of herbs, known as "xiong huang" or "mo xiang," is believed to ward off evil spirits and bring good luck.   Overall, the Dragon Boat Festival is a time for people to pay tribute to Qu Yuan's patriotism, enjoy festive activities, strengthen community bonds, and celebrate Chinese culture and traditions.   Our company will be observing a holiday break from 8th June. to 10th June. 2024 forDragon Boat Festival.   We will back on11th June. We are sorry for any convenience it may occur. Should you have anyinquiries for any high frequency PCBs during our holidays,Please feel free to email to    

  • What Are Some Other Challenges That PCB Manufacturers Face When Working with High-Frequency PCBs?
    What Are Some Other Challenges That PCB Manufacturers Face When Working with High-Frequency PCBs?
    • May 22, 2024

    What Are Some Other Challenges That PCB Manufacturers Face When Working with High-Frequency PCBs?   In the rapidly evolving world of electronics, the demand for high-performance, high-frequency printed circuit boards (PCBs) is on the rise. These specialized circuit boards are essential components in a wide range of applications, from high-power RF and microwave amplifiers to advanced radar and military electronics. However, the fabrication of high-frequency PCBs poses unique challenges that PCB manufacturers must overcome to ensure reliability and consistent performance.   One such challenge is the use of specialized materials. The Rogers RT/duroid 6035HTC high-frequency circuit material is a prime example of the advanced materials required for these applications. This ceramic-filled PTFE composite offers exceptional thermal conductivity, nearly 2.4 times that of standard RT/duroid 6000 products, enabling improved heat dissipation and lower operating temperatures for high-power circuits. Additionally, the material's low dielectric constant (3.5 ± 0.05 at 10 GHz/23°C) and low dissipation factor (0.0013 at 10 GHz/23°C) contribute to excellent high-frequency performance, with minimal signal distortion and attenuation.   Alongside material selection, PCB manufacturers must also navigate the intricacies of precise impedance control. Maintaining a consistent, controlled impedance across high-frequency signal paths is crucial to prevent reflections and impedance mismatches that can degrade signal integrity. This requires specialized design techniques, such as careful trace width and spacing calculations, as well as advanced manufacturing processes like uniform copper plating and laser trimming.   PCB manufacturers utilize a variety of specialized techniques and processes to ensure the reliability of high-frequency printed circuit boards in harsh operating environments:   Impedance Control Maintaining precise, consistent impedance along high-speed transmission lines is critical for signal integrity at microwave and millimeter-wave frequencies. Even slight variations in trace width, copper thickness, or dielectric thickness can cause reflection and distortion issues. Specialized impedance control techniques, such as uniform conductor plating and laser trimming, are required.   Crosstalk Mitigation The close trace spacing and high frequencies involved make high-frequency PCBs highly susceptible to crosstalk between adjacent signals. Design strategies like increased trace spacing, shielding planes, and specialized trace routing are necessary to isolate sensitive RF/microwave traces.   Test and Measurement Verifying the performance of high-frequency PCBs requires advanced test equipment and measurement techniques. Traditional benchtop multimeters and scopes are insufficient - PCB manufacturers must utilize vector network analyzers, spectrum analyzers, and other specialized instrumentation capable of operating at m...

  • Researchers Have Developed New PCB Materials That Can Achieve Over 90% Raw Material Recovery
    Researchers Have Developed New PCB Materials That Can Achieve Over 90% Raw Material Recovery
    • May 16, 2024

    Researchers Have Developed New PCB Materials That Can Achieve Over 90% Raw Material Recovery     The University of Washington research and development team recently announced that it has successfully developed a new type of PCB called vPCB.   vPCB is made of Vitrimer-like polymer (Vitrimer) material, which has comparable electrical properties to traditional PCBS, while achieving a raw material recovery rate of over 90%.    The left side is vPCB, the middle is glass fiber layer, and the right side is recycled vitreous polymer material. Photo source University of Washington official website, the samepicturebelow   Traditional PCBS are usually composed of glass fiber reinforced epoxy resin laminates covered with copper foil. After PCB waste, it is difficult to separate the epoxy resin from the glass fiber. This hinders the recycling of PCB materials and increases the difficulty of e-waste reuse.   The team at the University of Washington has successfully developed a vitreous polymer material. The material can replace the epoxy resin in the PCB, and at the same time, it can be converted into a jelly-like substance by a special solvent, which can be separated and recycled from the PCB.    ▲ Vitreous polymer material removed with tweezers   The team claims to have achieved 98% recovery of vitreous polymer, 100% recovery of glass fiber and 91% recovery of solvent.   Less than a decade old, this class of vitreous polymers, first developed in 2015, have "dynamic covalent bonds" that reversibly crack and recombine when exposed to specific environments.   In addition to the ease of recycling, VPCBS using vitreous polymer-like polymers have other unique advantages: due to their reconfigurable properties, VPCBS that bend or crack can be repaired in specific environments.   The University of Washington said in a related article that the production of VPCBS does not require major adjustments to the PCB manufacturing process.

  • RO4360G2 PCB 20mil: Empowering the Growing Demand in the PCB Industry
    RO4360G2 PCB 20mil: Empowering the Growing Demand in the PCB Industry
    • April 17, 2024

    RO4360G2 PCB 20mil: Empowering the Growing Demand in the PCB Industry   As the backbone of electronic products, PCBs play a pivotal role in various consumer electronics, such as computers and mobile phones. With the surge in digital economy, 6G technology, and artificial intelligence applications, the industry anticipates a significant boom in PCB demand.   The Importance of PCBs in the Electronics Industry PCBs serve as crucial components for establishing electrical connections within electronic circuits. The vast array of downstream applications includes communication systems, computers, and automotive electronics, which collectively account for over 70% of PCB consumption. In fact, every aspect of information generation, processing, transmission, and application heavily relies on PCBs.   According to industry insiders, the order visibility for PCB and IC substrate production equipment has been extended to 2024. Founder Securities highlights that the continuous growth of capital expenditures in global data centers has intensified the demand for PCBs. The rapid advancement of technology has led to the constant upgrading of traditional server PCBs, while the increasing deployment of artificial intelligence servers has propelled the demand for high-value single-machine PCBs. It is projected that the server PCB market size will reach an impressive US$16 billion by 2026.   Market Growth and Future Prospects The research report by East Asia Qianhai Securities suggests that the demand for PCBs in the communication sector will remain stable in the long term. Additionally, the data center and automotive fields are expected to witness high demand. Consequently, the global PCB market is projected to experience an average annual compound growth rate of 4.8% from 2023 to 2026. By 2026, the global PCB market's output value is estimated to reach a staggering US$101.5 billion.   Introducing RO4360G2 PCB 20mil Bicheng Company proudly presents the RO4360G2 PCB 20mil, a state-of-the-art solution designed to meet the ever-increasing demands of the PCB industry. The RO4360G2 high frequency laminates are low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that offer an optimal balance of performance and processing capability. This groundbreaking innovation represents the first high dielectric constant (Dk) thermoset laminate that can be processed similarly to FR-4.   Key Features of RO4360G2: Dielectric Constant: The RO4360G2 boasts a dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C, ensuring excellent signal integrity and electrical performance.   Dissipation Factor: With a dissipation factor of 0.0038 at 10 GHz/23°C, this laminate minimizes energy loss and ensures efficient signal transmission.   High Thermal Conductivity: The RO4360G2 offers a high thermal conductivity of 0.75 W/mK, facilitating effective heat dissipation and thermal management.   Superior Dimensional Stability: It exhibits a l...

  • Global PCB Industry Shows Resilience Amidst Challenging Times
    Global PCB Industry Shows Resilience Amidst Challenging Times
    • April 16, 2024

      Global PCB Industry Shows Resilience Amidst Challenging Times   Despite the challenges faced by the global PCB industry, the Prismark report reveals promising trends and growth prospects. In 2023, the industry experienced a 15.0% year-on-year decrease in output value in U.S. dollars. However, experts project a steady growth trajectory in the medium to long term. The compound annual growth rate for global PCB output value from 2023 to 2028 is expected to reach 5.4%.   Regional Growth and Product Structure: The PCB industry's growth is not limited to a specific region but spans all corners of the globe. Mainland China has emerged as a significant player, with a compound growth rate of 4.1%. Looking at the product structure, packaging substrates, high-multilayer boards with 18 layers and above, and HDI boards are set to experience substantial growth in the next five years. These segments are projected to achieve compound growth rates of 8.8%, 7.8%, and 6.2%, respectively.   Driving Factors for Packaging Substrate Products: Packaging substrate products are witnessing increased demand due to two primary factors. Firstly, the technological advancements and expanding application scenarios, such as artificial intelligence, cloud computing, smart driving, and the Internet of Everything, are driving the electronics industry's need for high-end chips and advanced packaging. This sustained growth is particularly notable in high-computing power and integration scenarios. Secondly, the government's increased support for the semiconductor industry, coupled with additional investments, is accelerating the development of the domestic packaging substrate industry. As terminal manufacturers' semiconductor inventories normalize, the global semiconductor market is predicted to grow by 13.1% in 2024, according to the World Semiconductor Trade Statistics Organization (WSTS).   Growth Drivers for PCB Products:  PCB products are propelled by the demand from various markets, including servers and data storage, communications, new energy and smart driving, and consumer electronics. The rapid evolution of artificial intelligence and the increasing need for high computing power and high-speed networks in the ICT industry are fueling the demand for large-size, high-level, high-frequency, high-speed, high-end HDI, and high-heat dissipation PCB products. The application of AI in mobile phones, PCs, smart wearables, IoT, and other products is driving the explosive growth of edge computing capabilities and high-speed data exchange. Consequently, terminal electronic equipment requires high-frequency, high-speed, integrated, miniaturized, light and thin, and high heat dissipation PCB products.   Introducing the Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm: To meet the growing demand for high-frequency applications,Bichengpresents the Hybrid PCB RO4003C High Tg FR-4 6-layer 2.24mm. This innovative product combines Tg170 FR-4 and 20mil RO4003C m...

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