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High-End Production Capacity: The Game-Changer for PCB Industry Upgrade Currently, the global PCB (Printed Circuit Board) industry is undergoing profound structural transformation. Growth in traditional low-end products is slowing down, while high-end products such as high-density interconnect (HDI) boards and high-layer count boards have become the core engines driving industry growth. On April 9, Sihui Fuji Electronics Technology Co., Ltd. (hereinafter referred to as "Sihui Fuji") unveiled a new investment plan to build high-end PCB production capacity. In addition, companies including Victory Giant Technology (HuiZhou) Co., Ltd. (hereinafter referred to as "Victory Giant"), Wus Printed Circuit (Kunshan) Co., Ltd. (hereinafter referred to as "Wus Printed Circuit"), and Avary Holding (Shenzhen) Co., Ltd. (hereinafter referred to as "Avary Holding") have also recently disclosed large-scale investment plans or full-year investment blueprints. Zheng Lei, Chief Economist at Samoyed Cloud Technology Group, said in an interview with Securities Daily: "Keeping pace with the direction of industrial transformation and upgrading and optimizing product structure are key measures for PCB enterprises to gain a foothold in the new round of industrial upgrading. Meanwhile, A-share listed companies in the industry are leveraging their advantages to increase investment in technological innovation and high-end capacity layout, which will accelerate industrial upgrading and enhance the global position of China's PCB industry." Specifically, on April 9, Sihui Fuji released its 2026 private placement plan for A-shares to specific investors. The total amount of funds raised from this private placement will not exceed 950 million yuan (inclusive). After deducting relevant issuance expenses, the net proceeds are planned to be fully used for the new construction project of 5.58 million square meters of high-reliability circuit boards per year - the 600,000 square meters per year high-layer count and HDI circuit board project (Phase I). A relevant person in charge of Sihui Fuji told Securities Daily: "To become a core supplier in the AI (Artificial Intelligence) field, the company needs to have large-scale high-end production capacity and certified stable manufacturing processes. Our current production capacity mainly meets sample and small-batch demands. The fund-raising project will enhance our ability to produce large batches of high-layer count boards and HDI boards, which is crucial for us to become a core supplier in the AI sector. This investment project is expected to further consolidate the foundation for the company's future development." In addition to Sihui Fuji,multiple PCB enterprises are increasing their investment in high-end capacity layout. On April 2, Wus Printed Circuit announced that it plans to invest approximately 6.8 billion yuan to build a printed circuit board production project and its su...
AI Demand Surge Opens Window for Domestic High-End Materials Recently, the copper clad laminate (CCL) sector has been showing sustained strength in the stock market. Data shows that since April 1, the share price of Fangbang Electronics (688020) has risen nearly 100%; the share prices of several other CCL-listed companies, including Shengyi Technology (600183) and Nanya New Material (688519), have also continued to climb. Behind the stock price increases, the rapidly growing demand for AI servers and high-speed switches is pushing the CCL industry into a supply shortage cycle. A Shanghai Securities News reporter learned that delivery times for some high-end CCL products have already been extended to more than two weeks. At the same time, key raw materials such as HVLP copper foil and low-dielectric electronic glass fabric are facing persistent supply tightness, and the supply shortage of overseas high-end materials is opening a window for domestic raw material suppliers to enter the high-end supply chain. Delivery times for high-end CCL continue to lengthen Multiple industry chain sources told reporters that compared to traditional servers, AI servers have higher requirements for signal transmission speed, loss control, and heat dissipation capability, which has led to rapidly growing demand for high-end CCL. Against this backdrop, delivery times for high-end CCL have begun to lengthen. Xiong Yiyu, a senior electronics analyst at Huachuang Securities, said in an interview that delivery times for standard CCL products remain around 7 to 10 days, while delivery times for AI-related and high-speed high-grade materials have generally been extended to more than two weeks. "Currently, delivery times for mainstream M8 high-speed materials are 3 to 4 weeks, and delivery times of more than 6 weeks are mainly concentrated on certain special grades and substrate materials," Xiong said. A board secretary of a CCL listed company told reporters that the industry's average delivery time has generally lengthened from the normal level of about 7 days to 15–20 days, and some manufacturers have extended delivery times to as long as 20–30 days. The secretary said that current orders related to high-end AI are growing rapidly, and the production processes for these products are more complex and take longer, occupying significantly more capacity than ordinary products, further exacerbating the supply shortage. In Xiong's view, the core reasons for the extended delivery times are: on the one hand, CCL manufacturers currently have relatively high overall capacity utilization; on the other hand, delivery times for upstream core raw materials such as electronic glass fabric and copper foil are also significantly lengthening, forcing CCL manufacturers to passively extend their delivery cycles. A research report from Shanxi Securities shows that the AI-driven super-cycle will remain in a ...
2026 Labor Day Holiday Notice Dear Valued Customers and Partners, Greetings from Shenzhen Bicheng Electronics Technology Co., Ltd.! As the International Workers' Day approaches, we would like to express our sincere gratitude for your continuous trust and support. To help you plan your upcoming PCB orders and projects smoothly, please be informed of our 2026 Labor Day holiday schedule: Holiday Period: May 1st (Friday) to May 5th (Tuesday), 2026 We will resume normal business operations on Wednesday, May 6th, 2026. During the Holiday: While our office and factory will be closed, you can still reach us via email for any urgent matters or quotations. We will endeavor to check our inboxes periodically and respond to critical issues as promptly as possible. General Inquiries: info@bichengpcb.com For urgent technical support, feel free to reach out to your direct sales representative, and we will get back to you as soon as we can. We are astable PCBsupplierer in China, specializing in high-frequency boards, Rogers PCBs, F4B, and high-speed multilayer boards. With 18+ years of industry experience, we remain committed to providing you with high-quality PCBs and punctual delivery. Thank you for your understanding and patience. We wish you and your family a happy and restful Labor Day! Warmest regards, Shenzhen Bicheng Electronics Technology Co., Ltd. Web: www.bichengpcb.com | Email: info@bichengpcb.com
LEO Satellite Boom Sparks High-End "Arms Race" in PCB Supply Chain The market for low Earth orbit (LEO) satellite boards is gaining momentum, with leading PCB manufacturers racing to secure key positions. Recently, multiple companies in the industry chain have successively disclosed their progress, spanning technology reserves, capacity construction, and product supply—all signaling strong confidence in the sector's prospects. Regarding the current development of PCBs in LEO satellite applications, Zhang Yi, CEO and Chief Analyst at iiMedia Consulting, told Cailianshe reporters that the industry is transitioning from customized development to mass production on assembly lines. Leading companies have also achieved breakthroughs in technical bottlenecks, integrating into core supply chains such as Starlink and China StarNet. PCB industrial clusters for aerospace applications have emerged in the Pearl River Delta and Yangtze River Delta regions, offering robust support in terms of intelligent production lines, batch manufacturing, and delivery lead times. A senior executive from a listed PCB company told Cailianshe reporters that PCBs for LEO satellites have stringent requirements regarding high frequency and insertion loss. The company produces such products, which are expected to gradually ramp up production this year. To meet these demanding specifications, the supply chain has begun adopting high-performance materials. At Bicheng, we address these challenges with advanced material solutions. A typical 2-layer Rogers PCB stackup consists of 35μm copper layers on both sides of an AD300D substrate measuring 1.016 mm (40mil). Rogers AD300D is a ceramic-filled, glass-reinforced PTFE-based laminate engineered for today’s wireless antenna markets. It delivers a controlled dielectric constant (DK 2.94 at 10 GHz/23°C), low loss (dissipation factor 0.0021 at 10 GHz/23°C), and excellent passive intermodulation (PIM) performance as low as -159 dBc. With a CTE as low as 23-24 ppm/°C in the X and Y axes, outstanding dimensional stability, and UL 94 V-0 flammability rating, AD300D ensures reliable, repeatable circuit performance and improved manufacturing yields across applications such as base station antennas, automotive telematics, and commercial satellite radio systems. Amidst the fervent industry-wide strategic positioning, continuous news emerges from the LEO satellite sector, drawing widespread attention to satellite constellation deployments by various nations. According to the International Telecommunication Union (ITU) website, at the end of 2025, China submitted an application for frequency and orbital resources for an additional 203,000 satellites, covering 14 satellite constellations, including medium and LEO satellites. Meanwhile, SpaceX plans to launch its second-generation Starlink system in 2027. In Zhang Yi's view, with the accelerated network deployment of LEO constellations, the estimated PCB usage ...
Holiday Notice: Chinese New Year Celebration Dear Valued Customers and Partners, Warm greetings from Shenzhen Bicheng Electronics Technology Co., Ltd. Our company will be closed for the Chinese New Year holiday from February 13 to February 23, 2026. We will resume normal operations on February 24, 2026. During this period, emails and inquiries may experience delays in response. Thank you for your understanding and support. We sincerely appreciate your continued trust and support. Wishing you and your family good health, happiness, and prosperity in the Year of the Horse! Sincerely, Shenzhen Bicheng Electronics Technology Co., Ltd
CCL Industry Witnesses a Capacity Expansion Spree, Accelerating Localization Substitution of Core Materials "Based on our recent insights, the copper-clad laminate (CCL) industry is entering a new phase of prosperity, with some enterprises operating non-stop even during the Spring Festival," a person in charge of a well-known domestic phenolic resin enterprise told the Securities Times reporter on January 25. "Amid the rise of China's domestic CCL industry, the localization substitution of core materials is expected to pick up speed." Enterprises Ramp Up Investment in High-performance CCL CCL is the primary application field of phenolic resin. The aforementioned phenolic resin enterprise interviewed by the reporter counts major CCL manufacturers among its downstream clients, including Taiwan Union Technology, Chin-Poon Industrial, Shengyi Technology (600183), Huazheng New Materials (603186), Kingboard Holdings (002636), and South Asia New Materials (688519). "Driven by the surging demand for AI servers, automotive electronics (885545) and optical communications, CCL enterprises are embracing a recovery," the person said. "We just completed a research tour at a CCL enterprise, which is quite optimistic about the market situation in 2026. It even plans to keep production running through the Spring Festival due to tight delivery schedules requested by clients." As a key upstream material for printed circuit boards (PCB, 884092), CCL is ultimately applied in communication equipment (881129), automotive electronics (885545), consumer electronics (881124), semiconductors (881121) and other sectors. Over the next 3-5 years, the growth of the PCB industry will be mainly driven by the dual engines of "AI computing infrastructure + intelligent automotive electronics (885545)". Meanwhile, advanced packaging (886009), edge-side AI hardware, high-frequency communications and other fields will bring structural growth opportunities, with the industry clearly trending toward high-end and high-value-added upgrading. Recently, the explosive demand for AI servers has led to a shortage of high-end raw materials. Resonac, the global leader in the CCL industry, has announced a comprehensive price hike of over 30% for CCL and other materials starting from March 2026. Boosted by the soaring demand for AI servers and new energy vehicles (850101), the global PCB market scale reached 88 billion US dollars in 2024. According to forecasts by consulting firm Prismark, the global PCB market output value will grow by approximately 6.8% in 2025 and maintain sustained growth in the coming years, reaching about 94.661 billion US dollars by 2029 with a compound annual growth rate (CAGR) of around 5.2%. In terms of global production capacity distribution, China has become the absolute leader, accounting for about 50% of the world's total PCB production capacity. The Pearl River Delta (Guangdong Province contributes 40% of ...
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