• September 27, 2023

2023 Mid-Autumn Festival and National Day Holiday Notice -RO4003C 20mil Rogers PCB: High Performance and Reliability Dear valued customers and partners, We are pleased to announce that Bicheng Company will be taking a 7-day holiday break in celebration of the Mid-Autumn Festival and National Day from September 29th to October 5th, 2023. During this time, our office will be closed, and normal operations will resume on October 6th, 2023. The Mid-Autumn Festival, also known as the Moon Festival, is one of the most important traditional Chinese festivals, symbolizing family reunion and harvest. It falls on the 15th day of the eighth lunar month, which this year coincides with September 30th, 2023. This festival is celebrated by gathering with family and friends, appreciating the full moon, and indulging in delicious mooncakes. Following the Mid-Autumn Festival, China's National Day, which commemorates the founding of the People's Republic of China, is celebrated on October 1st, 2023. This holiday marks a significant period of national pride and unity. During this holiday break, we encourage you to take this opportunity to spend quality time with your loved ones and create precious memories. We sincerely apologize for any inconvenience caused by the temporary closure and appreciate your understanding. Should you have any enquiry during the holidays, pls feel free to email to j.shi@bichengpcb.com. Best regards, Shenzhen Bicheng Electronics Technology Co., Ltd In addition to our holiday announcement, we would like to take this opportunity to introduce our new product, the PCB Material. This cutting-edge material offers exceptional performance and reliability, making it an excellent choice for a wide range of applications. Here are some key features and benefits: RO4003C 20mil Rogers PCB: High Performance and Reliability Experience the power of advanced technology with our newly shipped RO4003C 20mil Rogers PCB. Engineered with precision and designed for performance-sensitive, high-volume applications, this PCB is a game-changer in the world of electronic circuitry. Let's delve into the remarkable features and benefits that make this PCB stand out from the rest. 1. PCB Material: Crafted from Rogers RO4003C Hydrocarbon Ceramic woven glass, our PCB boasts unparalleled quality. With a 4003C Dielectric Constant (DK) of 3.38 at 10 GHz and a Dissipation Factor of 0.0027 at 10GHz, it ensures low dielectric tolerance and low loss. The impressive Tg (>280 °C) and Td (>425°C) ratings enable reliable operation in temperature ranges from -40℃ to +85℃. 2. Features and Benefits: A) Reinforced Hydrocarbon/Ceramic Laminates: Our RO4003C Rogers material is a hydrocarbon/ceramic laminate, distinct from PTFE alternatives. This unique composition offers exceptional electrical performance and stability, making it perfect for high-frequency applications. B) Excellent Electrical Performance: With its low dielectric tolerance and low loss, our PCB delivers outst...

• September 22, 2023

Introducing the Game-Changing RO3203 PCB, Redefining the High-Frequency PCB Industry In the rapidly evolving world of high-frequency PCBs, a groundbreaking announcement has been made with the introduction of the revolutionary RO3203 PCB. This state-of-the-art technology is set to redefine performance and reliability standards in the industry, catering to the growing demands of various sectors such as 5G, aerospace, and automotive. The Rogers RO3203 PCB boasts a meticulously engineered design, combining ceramic-filled PTFE reinforced with woven fiberglass material. With an impressive dielectric constant (DK) of 3.02 at 10 GHz/23°C, it ensures flawless signal integrity and minimal loss. Its low dissipation factor of 0.0016 at the same frequency and temperature range allows for efficient transmission of high-frequency signals. This PCB also offers extraordinary thermal stability, withstanding temperatures up to 500°C, making it ideal for demanding applications. The construction of the RO3203 PCB showcases exceptional durability and reliability. Its 2-layer rigid structure features copper layers on both sides and utilizes a 0.762 mm 30mil RO3203 substrate. The well-engineered stackup ensures optimal performance, while the 1 oz (1.4 mils) outer layer copper weight enhances conductivity. With a finished board thickness of 0.89mm, green solder masks on both sides, and an immersion gold surface finish, the RO3203 PCB combines both aesthetic appeal and functionality. To ensure top-notch quality, rigorous testing and comprehensive quality control measures are implemented. Each 30mil RO3203 material PCB undergoes a thorough 100% electrical test before shipment, meeting stringent industry standards. Exceeding expectations in terms of durability, longevity, and performance, this PCB complies with the IPC-Class-2 standard. It offers a wide range of connectivity options with its various through-hole pads, SMT pads, vias, and nets, catering to diverse industry needs. The demand for high-frequency PCBs is projected to surge due to the rapid growth of 5G technology, IoT applications, and the automotive sector. The introduction of the Rogers 3203 PCB addresses these emerging needs by providing exceptional performance and reliability. Its advanced features and specifications make it an ideal choice for high-frequency electronic designs. As the industry continues to evolve, it is essential to stay informed about the latest trends and advancements. The RO3203 high frequency PCB represents a monumental step forward for the high-frequency PCB industry, offering unmatched performance and reliability. For more information and technical support regarding the RO3203 PCB, reach out to the dedicated sales team at the provided contact address. In conclusion, the Rogers RO3203 PCB is a game-changer in the high-frequency PCB industry. Its cutting-edge technology, superior materials, and meticulous design set new benchmarks for performance and reliability. With its exceptional fe...

• September 14, 2023

PCB in 2024 or Will Resume Growth   According to analyst Zhang Yuansong from the Industrial Technology Research Institute (ITRI), the PCB industry is expected to resume growth in 2024. While the strength of the third-quarter peak season is still uncertain, the continuous destocking of consumer products and the ongoing momentum in the EV, AI server, and satellite communication sectors are expected to drive PCB output, with a potential rebound in 2024. ABF substrates will benefit from the expansion of advanced packaging, and the supply-demand gap is expected to widen in the next two years.   Zhang Yuansong attended an IEK expert symposium organized by Yuanta Securities on August 28th. He believes that the automotive industry will be the only PCB terminal application with a year-on-year growth this year, especially with electric vehicles accounting for 14% to 15% of the overall automotive market. The increasing adoption of EVs will drive the demand and area of PCBs. If they can penetrate the supply chain of companies like Tesla and BYD, there will be a noticeable increase in orders in the next one to two years.   Although multilayer boards accounted for 60% of the overall automotive PCB production value in the first half of this year, the increasing electrification and widespread adoption of ADAS will drive the application of HDI PCB boards in automotive radar and camera module systems. HDI and flexible boards will become the most promising segments in the automotive PCB market. Supply chain companies such as Kinwong, Unimicron, Dingying, and Jingpeng are expected to benefit from this trend.   In the short term, Zhang Yuansong believes that the third quarter will see a peak season effect due to the launch of new Apple products. However, with the situation of high inflation and the recovery of mainland China not meeting expectations, the strength of the peak season remains to be observed.   In 2022, the PCB industry achieved high growth, creating a higher base year for comparison. Therefore, the overall PCB output is expected to decline by 16.8% in 2023, reaching NT$769.3 billion. In 2024, driven by the synchronous recovery of mobile phones, laptops, and semiconductors, as well as the continued momentum in EVs, AI servers, and satellite communication, the overall PCB output is expected to return to growth, with an estimated annual growth rate of 8.1%.   In particular, for ABF substrates, in order to meet the demand for advanced computing, chiplet heterogeneous integration packaging technology is the future trend. It can integrate chips from different fabs, different process nodes, and different properties into a single chip. This will drive the increase in the number of layers, area, and circuit density of ABF substrates, raising the manufacturing threshold. The demand for ABF substrates will be driven by advanced packaging spreading to various fields. From a situation of oversupply of 5% this year, it is expected t...

• September 06, 2023

RO4003C Rogers 12mil High Frequency PCB-PCB Industry Experiences Rapid Growth in High-Frequency Applications Demand    With the continuous advancement of technology, the demand for high-frequency applications has rapidly expanded across various industries. This unprecedented growth presents significant opportunities for the Printed Circuit Board (PCB) industry. High-frequency applications have become crucial technological requirements in fields such as communication, electronics, automotive, aerospace, and more, driving the rapid rise of the PCB industry.   Meeting the demands of high-frequency applications requires PCB design, manufacturing, and performance to meet higher standards. Consequently, many PCB suppliers and technology providers have introduced solutions tailored for high-frequency applications.In order to change this situation, BICHENG also provide a new shipped 12mil Rogers RO4003C PCB Material for High-Frequency Applications.   Here is our new shipped 12mil RO4003C PCB detailed information: Material Advancements: Rogers RO4003C stands out as a highly regarded Rogers PCB material for high-frequency applications. It utilizes woven glass reinforced hydrocarbon ceramic material, offering excellent signal integrity and low loss coefficients. With a dielectric constant of 3.38 at 10 GHz/23°C and a loss factor of just 0.0027, it effectively reduces signal attenuation. Additionally, RO4003C exhibits exceptional high-temperature resistance, ensuring stable operation across a wide temperature range.   Rogers RO4003C PCB 12mil Material for High-Frequency Applications: Experience superior performance with our hydrocarbon ceramic woven glass material Processed with DK 3.38 at 10 GHz/23°C, ensuring optimal signal integrity Low dissipation factor of 0.0027 at 10 GHz/23°C for minimal signal loss Withstands high temperatures, boasting a Tg >280°C and Td >425°C Suitable for operation in a wide temperature range of -40℃ to +85℃   Boost Your RF Design with our12mil RO4003C2-layer Rigid PCB Stackup Utilizes Rogers 4003C substrate with a thickness of 0.305mm Copper layer thickness of 35μm on both the top and bottom layers Achieve precise trace and space requirements with a minimum of 4/4 mils Accommodates 0.25mm minimum hole size for various component needs Finished board thickness of 0.43mm for compact and lightweight designs   Unveiling the Construction Details of our High-Quality PCB Board dimensions of 170.53mm x 180.35mm, offering flexibility for different applications A total of 115 components and 217 pads for comprehensive functionality Includes 112 through-hole pads and 105 top SMT pads for versatile component placement Vias totaling 168 for efficient signal routing and connection Adheres to IPC-Class-2 standard to ensure reliable and consistent quality   Trustworthy Quality and Global Availability Each board undergoes a 100% electrical test before shipment, ensuring reliability Supplied wi...

• August 23, 2023

New High-Frequency PCB Material Enhances Wireless Communication System Performance In recent days, the high-frequency PCB industry has captured the attention of professionals, as a breakthrough product has been launched that promises significant advancements in the performance of wireless communication systems. This innovative new product utilizes cutting-edge material solutions to deliver a more efficient and reliable communication experience for users. The high-frequency PCB incorporates 30mil Rogers RO4350B hydrocarbon ceramic laminates, renowned for their excellent thermal conductivity and stability. With a lead-free process, the product meets environmental standards and addresses the growing consumer demand for eco-friendly materials. Furthermore, the operating temperature range of -40℃ to +85℃ ensures its suitability for a wide range of complex environments. Regarding construction details, the stackup of this high-frequencyRO4350B PCB involves a base copper layer of 17um, a 30mil RO4350B dielectric layer, and another 17um base copper layer. This design ensures the stability and reliability of high-frequency signals during transmission. Precise control over these construction details guarantees the quality of communication for users. In addition, the Rogers 4350B PCB boasts several outstanding features. The board dimensions measure 52.00mm x 38.00mm, with an accuracy of +/- 0.15mm, meeting the requirements for precise dimensions. With a minimum trace/space of 8/6 mils and a minimum hole size of 0.5mm, it fulfills the demands of high-density circuit designs. The product employs 1 oz (1.4 mils) finished copper weight across all layers, 1 mil via plating thickness, and an ENEPIG surface finish, further enhancing its quality and reliability. Notably, the high-frequency material PCB is equipped with a top and bottom solder mask of Matt Black, 0.5mm via copper paste filled and capped, and requires edge plating. These carefully implemented manufacturing processes contribute to exceptional electrical performance and stability. Impedance matching, accurate within +/- 10%, is achieved to ensure signal stability and consistency. Additionally, the product provides comprehensive statistics, including 15 components, 53 pads, 45 vias, and 3 nets, offering valuable reference information for users. For any technical inquiries regarding this high-frequency PCB technology, customers are encouraged to contact Jane, the sales manager, at sales20@bichengpcb.com, who will provide technical support and consultation services. The introduction of this groundbreaking 30mil RO4350B high-frequency PCB material will undoubtedly propel the development of wireless communication systems. Its outstanding performance and reliability will enhance the speed, stability, and reliability of wireless communication, delivering an exceptional communication experience for users. Looking ahead, we anticipate further innovations in the high-frequency PCB industry, unlocking mo...

• August 17, 2023

2024 Will Return to the Growth Track CCL ITEQ Optimistic About the Future Market of Vehicles   ITEQ, a leading manufacturer of copper foil substrates (CCL), is making strides in the high-end automotive electronics sector as the demand for electric bikes and self-driving cars continues to grow. The company is positioning itself for success in this sector and remains optimistic about its operational performance.   In the first half of 2023, ITEQ expects a slow recovery in consumer electronics demand due to destocking. Additionally, the transition period between new and old platforms for servers poses operational challenges. However,ITEQ anticipates that its high-end automotive electronics business will remain resilient, with double-digit revenue growth and a revenue proportion exceeding 20% in 2023.   ITEQ is well-positioned to benefit from the increasing penetration rate of electric vehicles (EVs) and self-driving cars. The company expects a surge in production volume for HDI boards and high-speed materials used in autonomous driving systems, EVs, and Vehicle Computing-related applications in the coming years. This growth in the automotive business is expected to contribute to an increase in gross profit margin.   Furthermore,ITEQ has successfully passed certification for materials used in multiple AI GPU servers, aligning with the increasing demand for high-end high-speed computation materials in data centers. With major cloud service providers accelerating their AI-related capital expenditures, there is a growing need for circuit boards with more layers and high-speed materials. This sustained demand is expected to support the long-term upgrading of the server industry.   While the revenue recovery in the third quarter may be limited due to the delayed ramp-up of the Intel Eagle Stream platform,ITEQ is confident in its long-term growth plans. The company is committed to developing next-generation HDI/SLP materials and has partnered with leading Japanese material manufacturers to meet the future demand of the IC carrier board market.   ITEQ expects to regain its growth trajectory in 2024 and remains optimistic about the future demand for high-end electronic materials. The company is prepared to adapt to changes in the global supply chain and has plans to expand its production facilities in China and Thailand. With its focus on innovation and meeting customer needs, Unimicron is poised to maintain its position as a leader in the high-end electronics industry.   As part of its ongoing commitment to innovation,BICHENG is proud to announce its newly shipped product, the 20mil RO4350B material PCB. This advanced PCB material is designed for high-performance applications and offers a lead-free process and operation in a wide temperature range of -40℃ to +85℃. With a 2-layer rigid PCB stackup, the RO4350B Hydrocarbon Ceramic Laminates PCB provides excellent performance ...