• March 23, 2026

LEO Satellite Boom Sparks High-End "Arms Race" in PCB Supply Chain   The market for low Earth orbit (LEO) satellite boards is gaining momentum, with leading PCB manufacturers racing to secure key positions. Recently, multiple companies in the industry chain have successively disclosed their progress, spanning technology reserves, capacity construction, and product supply—all signaling strong confidence in the sector's prospects.   Regarding the current development of PCBs in LEO satellite applications, Zhang Yi, CEO and Chief Analyst at iiMedia Consulting, told Cailianshe reporters that the industry is transitioning from customized development to mass production on assembly lines. Leading companies have also achieved breakthroughs in technical bottlenecks, integrating into core supply chains such as Starlink and China StarNet. PCB industrial clusters for aerospace applications have emerged in the Pearl River Delta and Yangtze River Delta regions, offering robust support in terms of intelligent production lines, batch manufacturing, and delivery lead times.   A senior executive from a listed PCB company told Cailianshe reporters that PCBs for LEO satellites have stringent requirements regarding high frequency and insertion loss. The company produces such products, which are expected to gradually ramp up production this year. To meet these demanding specifications, the supply chain has begun adopting high-performance materials.   At Bicheng, we address these challenges with advanced material solutions. A typical 2-layer Rogers PCB stackup consists of 35μm copper layers on both sides of an AD300D substrate measuring 1.016 mm (40mil). Rogers AD300D is a ceramic-filled, glass-reinforced PTFE-based laminate engineered for today’s wireless antenna markets. It delivers a controlled dielectric constant (DK 2.94 at 10 GHz/23°C), low loss (dissipation factor 0.0021 at 10 GHz/23°C), and excellent passive intermodulation (PIM) performance as low as -159 dBc. With a CTE as low as 23-24 ppm/°C in the X and Y axes, outstanding dimensional stability, and UL 94 V-0 flammability rating, AD300D ensures reliable, repeatable circuit performance and improved manufacturing yields across applications such as base station antennas, automotive telematics, and commercial satellite radio systems.   Amidst the fervent industry-wide strategic positioning, continuous news emerges from the LEO satellite sector, drawing widespread attention to satellite constellation deployments by various nations. According to the International Telecommunication Union (ITU) website, at the end of 2025, China submitted an application for frequency and orbital resources for an additional 203,000 satellites, covering 14 satellite constellations, including medium and LEO satellites. Meanwhile, SpaceX plans to launch its second-generation Starlink system in 2027.   In Zhang Yi's view, with the accelerated network deployment of LEO constellations, the estimated PCB usage ...

• February 09, 2026

Holiday Notice: Chinese New Year Celebration   Dear Valued Customers and Partners,   Warm greetings from Shenzhen Bicheng Electronics Technology Co., Ltd.   Our company will be closed for the Chinese New Year holiday from February 13 to February 23, 2026. We will resume normal operations on February 24, 2026.   During this period, emails and inquiries may experience delays in response. Thank you for your understanding and support.   We sincerely appreciate your continued trust and support. Wishing you and your family good health, happiness, and prosperity in the Year of the Horse!   Sincerely, Shenzhen Bicheng Electronics Technology Co., Ltd

• January 27, 2026

CCL Industry Witnesses a Capacity Expansion Spree, Accelerating Localization Substitution of Core Materials   "Based on our recent insights, the copper-clad laminate (CCL) industry is entering a new phase of prosperity, with some enterprises operating non-stop even during the Spring Festival," a person in charge of a well-known domestic phenolic resin enterprise told the Securities Times reporter on January 25. "Amid the rise of China's domestic CCL industry, the localization substitution of core materials is expected to pick up speed."   Enterprises Ramp Up Investment in High-performance CCL   CCL is the primary application field of phenolic resin. The aforementioned phenolic resin enterprise interviewed by the reporter counts major CCL manufacturers among its downstream clients, including Taiwan Union Technology, Chin-Poon Industrial, Shengyi Technology (600183), Huazheng New Materials (603186), Kingboard Holdings (002636), and South Asia New Materials (688519).   "Driven by the surging demand for AI servers, automotive electronics (885545) and optical communications, CCL enterprises are embracing a recovery," the person said. "We just completed a research tour at a CCL enterprise, which is quite optimistic about the market situation in 2026. It even plans to keep production running through the Spring Festival due to tight delivery schedules requested by clients."   As a key upstream material for printed circuit boards (PCB, 884092), CCL is ultimately applied in communication equipment (881129), automotive electronics (885545), consumer electronics (881124), semiconductors (881121) and other sectors. Over the next 3-5 years, the growth of the PCB industry will be mainly driven by the dual engines of "AI computing infrastructure + intelligent automotive electronics (885545)". Meanwhile, advanced packaging (886009), edge-side AI hardware, high-frequency communications and other fields will bring structural growth opportunities, with the industry clearly trending toward high-end and high-value-added upgrading.   Recently, the explosive demand for AI servers has led to a shortage of high-end raw materials. Resonac, the global leader in the CCL industry, has announced a comprehensive price hike of over 30% for CCL and other materials starting from March 2026.   Boosted by the soaring demand for AI servers and new energy vehicles (850101), the global PCB market scale reached 88 billion US dollars in 2024. According to forecasts by consulting firm Prismark, the global PCB market output value will grow by approximately 6.8% in 2025 and maintain sustained growth in the coming years, reaching about 94.661 billion US dollars by 2029 with a compound annual growth rate (CAGR) of around 5.2%.   In terms of global production capacity distribution, China has become the absolute leader, accounting for about 50% of the world's total PCB production capacity. The Pearl River Delta (Guangdong Province contributes 40% of ...

• December 31, 2025

Holiday Notice: New Year 2026   Dear Valued Customers and Partners,   Wishing you a joyful and prosperous New Year!   Please be informed that our office will be closed for the New Year holiday from January 1st to January 3rd, 2026. Regular business operations will resume on Monday, January 4th, 2026.   Should you have any urgent inquiries during this period, please feel free to email us at info@bichengpcb.com, and we will reply as soon as possible upon our return.   Thank you for your continued trust and cooperation. We look forward to serving you with renewed energy in the coming year.   Warm regards, Shenzhen Bicheng Electronics Technology Co., Ltd

• December 25, 2025

The Deepening Millimeter-Wave Revolution: High-Performance Materials Become the PCB Industry's Watershed   December 19, 2025—As 5G-Advanced smoothly evolves towards 6G and low-earth orbit satellite internet constellations enter a phase of dense deployment, the industry's news focus in the final two months of 2025 has shifted from "whether millimeter-wave technology is needed" to "how to achieve higher-performance, more stable and reliable millimeter-wave hardware." This shift focuses the industry chain's attention on a core link: the high-performance PCB substrates used for millimeter-wave frequency bands and their corresponding processing capabilities. For specialized manufacturers with over twenty years of deep expertise in the high-frequency PCB field, this is precisely the moment when the value of their technological moat becomes clearly evident.   Spotlight: The Dual Challenges of Performance and Supply Chain Security Recently, several leading communication equipment and satellite manufacturers have indicated in their financial reports and technical forums that the research, development, and mass production of their new-generation millimeter-wave products are facing two specific challenges:   Performance Bottlenecks: As operating frequencies extend to higher bands (such as E-band and beyond), the dielectric loss and stability of traditional high-performance materials are beginning to constrain system link budgets. This imposes Almost rigorous requirements for phase consistency, insertion loss, and temperature stability.   Demand for Supply Chain Diversification: To ensure the delivery security and cost control of critical infrastructure projects, implementing a "multi-source supply" strategy for core raw materials has become an industry consensus. Identifying high-end domestic or regional substrate materials that offer performance comparable to international top-tier brands and stable supply is a joint core mission for both procurement and R&D departments.   Industry Response: The Industrial Application of Next-Generation Materials The industry's response to these challenges is directly reflected in the rapid validation and adoption of new materials. Recently, a new generation of polytetrafluoroethylene composite materials employing special formulations and processes is gaining widespread attention. Taking theF4BM220 series material from a leading domestic brand as an example, its technical specifications directly target the pain points of millimeter-wave applications:   Exceptionally Stable Electrical Performance: At 10GHz, the dielectric constant (Dk) can be stably controlled at 2.20±0.04, with a dissipation factor (Df) as low as 0.001. This provides superior insertion loss control and phase prediction accuracy for millimeter-wave circuit design.   Outstanding Mechanical and Environmental Stability: The X/Y axis coefficient of thermal expansion (CTE) is as low as 25/34 pp...

• November 22, 2025

NEV & IIoT Dual Drive: PCB Industry Enters Specialized Growth Phase   The global PCB market has witnessed a pivotal shift over the past two months: the "specialized segment"—led by new energy vehicle (NEV) on-board PCBs and industrial IoT (IIoT) ruggedized PCBs—has emerged as the fastest-growing engine, outpacing even the high-profile AI server PCB sector in regional demand diversity. With Q4 2025 data now available, this article unpacks how NEV electrification and industrial digitalization are reshaping PCB requirements, and the tailored solutions driving value for global partners across automotive and industrial sectors.   NEV Electrification: On-Board PCB Demand Hits Record High   October-November 2025 marked a milestone for the global NEV industry: the International Energy Agency (IEA) reported that NEV sales accounted for 38% of global new car sales in Q4, up 7 percentage points year-on-year. This surge has directly fueled demand for high-reliability on-board PCBs, with three key segments leading growth:   Battery Management System (BMS) PCBs: As NEV battery capacities expand to 150kWh+, BMS requires PCBs with 12-20 layers, thick copper (3oz+), and extreme temperature resistance (-40°C to 125°C). According to CITIC Securities, the global BMS PCB market size will reach $8.2 billion in 2025, with a 45% Q4 growth rate. Key requirements include high-temperature resin (Tg≥180°C) and laser direct imaging (LDI) processes to ensure stability under harsh operating conditions.   Automotive Radar PCBs: The adoption of 4D imaging radar (for autonomous driving L3+) has driven demand forHDI PCBs with 8-12 layers and ultra-low loss (Df≤0.003 at 28GHz). In November, Tesla announced it would equip all 2026 Model Y vehicles with 4D radar, creating an immediate need for 100,000+ radar PCBs monthly. Market demand centers on boards with 50μm line width/spacing, optimized for high-frequency signal transmission.   In-Vehicle Infotainment (IVI) PCBs: The shift to 8K touchscreens and multi-display systems requires PCBs with high-speed signal transmission (10Gbps+). Southeast Asian NEV startups and established automakers alike are ramping up orders for 6-layer IVI PCBs, reflecting strong growth in emerging and mature NEV markets.   IIoT Digitalization: Ruggedized PCBs Conquer Industrial Environments   While NEV demand grabs headlines, IIoT’s expansion into harsh industrial settings (mining, oil & gas, smart manufacturing) is driving a boom in "ruggedized PCBs." Key trends from Oct-Nov 2025 include:   Environmental Resistance Requirements: Industrial PCBs now need to withstand corrosion, vibration (up to 500Hz), and extreme voltages (1000V+). In November, Siemens released its new industrial control system (S7-1500 Advanced), specifying PCBs with IP67 protection and tin-nickel plating. Market solutions leverage immersion silver (ImAg) surface finishes and reinforced base materials to meet thesestrict standa...