• December 31, 2025

Holiday Notice: New Year 2026   Dear Valued Customers and Partners,   Wishing you a joyful and prosperous New Year!   Please be informed that our office will be closed for the New Year holiday from January 1st to January 3rd, 2026. Regular business operations will resume on Monday, January 4th, 2026.   Should you have any urgent inquiries during this period, please feel free to email us at info@bichengpcb.com, and we will reply as soon as possible upon our return.   Thank you for your continued trust and cooperation. We look forward to serving you with renewed energy in the coming year.   Warm regards, Shenzhen Bicheng Electronics Technology Co., Ltd

• December 25, 2025

The Deepening Millimeter-Wave Revolution: High-Performance Materials Become the PCB Industry's Watershed   December 19, 2025—As 5G-Advanced smoothly evolves towards 6G and low-earth orbit satellite internet constellations enter a phase of dense deployment, the industry's news focus in the final two months of 2025 has shifted from "whether millimeter-wave technology is needed" to "how to achieve higher-performance, more stable and reliable millimeter-wave hardware." This shift focuses the industry chain's attention on a core link: the high-performance PCB substrates used for millimeter-wave frequency bands and their corresponding processing capabilities. For specialized manufacturers with over twenty years of deep expertise in the high-frequency PCB field, this is precisely the moment when the value of their technological moat becomes clearly evident.   Spotlight: The Dual Challenges of Performance and Supply Chain Security Recently, several leading communication equipment and satellite manufacturers have indicated in their financial reports and technical forums that the research, development, and mass production of their new-generation millimeter-wave products are facing two specific challenges:   Performance Bottlenecks: As operating frequencies extend to higher bands (such as E-band and beyond), the dielectric loss and stability of traditional high-performance materials are beginning to constrain system link budgets. This imposes Almost rigorous requirements for phase consistency, insertion loss, and temperature stability.   Demand for Supply Chain Diversification: To ensure the delivery security and cost control of critical infrastructure projects, implementing a "multi-source supply" strategy for core raw materials has become an industry consensus. Identifying high-end domestic or regional substrate materials that offer performance comparable to international top-tier brands and stable supply is a joint core mission for both procurement and R&D departments.   Industry Response: The Industrial Application of Next-Generation Materials The industry's response to these challenges is directly reflected in the rapid validation and adoption of new materials. Recently, a new generation of polytetrafluoroethylene composite materials employing special formulations and processes is gaining widespread attention. Taking theF4BM220 series material from a leading domestic brand as an example, its technical specifications directly target the pain points of millimeter-wave applications:   Exceptionally Stable Electrical Performance: At 10GHz, the dielectric constant (Dk) can be stably controlled at 2.20±0.04, with a dissipation factor (Df) as low as 0.001. This provides superior insertion loss control and phase prediction accuracy for millimeter-wave circuit design.   Outstanding Mechanical and Environmental Stability: The X/Y axis coefficient of thermal expansion (CTE) is as low as 25/34 pp...

• November 22, 2025

NEV & IIoT Dual Drive: PCB Industry Enters Specialized Growth Phase   The global PCB market has witnessed a pivotal shift over the past two months: the "specialized segment"—led by new energy vehicle (NEV) on-board PCBs and industrial IoT (IIoT) ruggedized PCBs—has emerged as the fastest-growing engine, outpacing even the high-profile AI server PCB sector in regional demand diversity. With Q4 2025 data now available, this article unpacks how NEV electrification and industrial digitalization are reshaping PCB requirements, and the tailored solutions driving value for global partners across automotive and industrial sectors.   NEV Electrification: On-Board PCB Demand Hits Record High   October-November 2025 marked a milestone for the global NEV industry: the International Energy Agency (IEA) reported that NEV sales accounted for 38% of global new car sales in Q4, up 7 percentage points year-on-year. This surge has directly fueled demand for high-reliability on-board PCBs, with three key segments leading growth:   Battery Management System (BMS) PCBs: As NEV battery capacities expand to 150kWh+, BMS requires PCBs with 12-20 layers, thick copper (3oz+), and extreme temperature resistance (-40°C to 125°C). According to CITIC Securities, the global BMS PCB market size will reach $8.2 billion in 2025, with a 45% Q4 growth rate. Key requirements include high-temperature resin (Tg≥180°C) and laser direct imaging (LDI) processes to ensure stability under harsh operating conditions.   Automotive Radar PCBs: The adoption of 4D imaging radar (for autonomous driving L3+) has driven demand forHDI PCBs with 8-12 layers and ultra-low loss (Df≤0.003 at 28GHz). In November, Tesla announced it would equip all 2026 Model Y vehicles with 4D radar, creating an immediate need for 100,000+ radar PCBs monthly. Market demand centers on boards with 50μm line width/spacing, optimized for high-frequency signal transmission.   In-Vehicle Infotainment (IVI) PCBs: The shift to 8K touchscreens and multi-display systems requires PCBs with high-speed signal transmission (10Gbps+). Southeast Asian NEV startups and established automakers alike are ramping up orders for 6-layer IVI PCBs, reflecting strong growth in emerging and mature NEV markets.   IIoT Digitalization: Ruggedized PCBs Conquer Industrial Environments   While NEV demand grabs headlines, IIoT’s expansion into harsh industrial settings (mining, oil & gas, smart manufacturing) is driving a boom in "ruggedized PCBs." Key trends from Oct-Nov 2025 include:   Environmental Resistance Requirements: Industrial PCBs now need to withstand corrosion, vibration (up to 500Hz), and extreme voltages (1000V+). In November, Siemens released its new industrial control system (S7-1500 Advanced), specifying PCBs with IP67 protection and tin-nickel plating. Market solutions leverage immersion silver (ImAg) surface finishes and reinforced base materials to meet thesestrict standa...

• October 24, 2025

AI and Automotive Electronics Fuel PCB Industry Boom   As the global electronics industry accelerates its digital transformation, the printed circuit board (PCB) sector is experiencing an unprecedented growth spurt driven by AI computing and intelligent automotive innovation. October 2025 has witnessed remarkable milestones—from surging corporate earnings to technological breakthroughs—painting a vivid picture of an industry entering a high-value era. At Bicheng, we closely monitor these trends to deliver cutting-edge solutions to our global partners. Demand Surge: AI and Automotive Electronics as Dual Engines   The third-quarter performance reports of leading PCB enterprises have underscored the industry's robust momentum. Shengyi Electronics, a key player in high-precision PCBs, announced a staggering 476% to 519% year-on-year growth in net profit for the first three quarters, with Q3 net profit soaring by over 501% sequentially . This explosive growth stems primarily from the rising demand for high-value PCB products in AI and automotive electronics. According to Prismark forecasts, global PCB market value is projected to reach $79.128 billion in 2025, representing a 7.6% year-on-year increase, with AI servers and new energy vehicles (NEVs) as the primary growth drivers .   AI computing has become a game-changer for PCB value escalation. The proliferation of AI inference servers—accounting for over 60% of global AI server shipments in 2025—has pushed PCB requirements to new heights. A single AI inference server now demands PCBs worth 1,200 to 1,500, a fivefold premium compared to standard servers . This surge is fueled by cloud giants' expanded capital expenditures: overseas cloud providers are ramping up data center construction, creating sustained demand for high-multilayer PCB, high-frequency PCBs .   The automotive sector is equally transformative. With China's NEV penetration exceeding 50% and L3 autonomous driving adoption surpassing 25%, the PCB content per vehicle has jumped from 6-8㎡in traditional cars to 18-25㎡in smart electric vehicles, with value surging from 1,500 to over7,500 . ADAS radar systems, 800V high-voltage platforms, and intelligent cockpits are driving demand for specialized PCBs: The automotive-grade HDI boards, certified to AEC-Q100 Grade 0 (withstanding -40℃to 150℃), have become preferred choices for tier-one suppliers like Bosch and Continental .   Technological Leap: High-Value Innovation Takes Center Stage   October 2025 has seen significant advancements in PCB technology, with high-density and multifunctional designs becoming industry standards. HDI (High-Density Interconnect) technology, featuring microvias (<50µm) and fine line widths/spacings (<40µm), is now ubiquitous in AI chips and 5G base stations . At Bicheng, we have enhanced our Any-layer HDI production capacity, reducing signal transmission loss to 0.002dB/cm@10GHz using modified polyimi...

• September 16, 2025

Navigating the Future: Key PCB Industry Trends Shaping H2 2025   The global Printed Circuit Board (PCB) industry in the second half of 2025 is defined by rapid technological advancement and shifting global supply chains. For OEMs and designers, staying ahead means understanding the key trends that are currently dominating industry news and technical discussions. Here’s an analysis of the high-frequency themes for August and September 2025.   1. The AI Boom: Driving Unprecedented Demand for Advanced Substrates The relentless expansion of Artificial Intelligence continues to be the primary driver of innovation. The rollout of next-generation AI accelerators and edge AI applications is fueling demand for highly sophisticated PCBs that offer superior signal integrity and thermal management.   High-Density Interconnect (HDI)  PCB and Substrate-Like PCBs (SLP): AI servers require PCBs with incredibly high layer counts and ultra-fine lines and spaces. The market is seeing a sustained surge in orders for 20+ layer HDI boards and SLPs that are essential for managing the data throughput of advanced GPUs and TPUs.   Advanced Materials: The need for speed and minimal signal loss is pushing the adoption of next-generation, low-loss laminates. A key development in this space is the introduction of new materials like the F4BTMS220 high frequency PCB, an advanced ceramic-filled PTFE composite.   This material represents a significant technological breakthrough, engineered to meet the extreme demands of RF and microwave applications within AI infrastructure, such as data transmission systems. Its key properties include:   Exceptionally Stable Dielectric Constant (Dk): 2.20±0.02 @ 10 GHz.  Ultra-Low Dissipation Factor (Df): 0.0009 @ 10 GHz, ensuring minimal signal loss at high frequencies. Superior Thermal and Mechanical Performance: Low CTE, stable Dk over a wide temperature range (-55°C to 150°C), and UL 94 V-0 rating with extremely low moisture absorption (0.02%). This makes it an ideal solution for aerospace, military radar, satellite communications, and other high-reliability applications demanding peak performance.   2. Sustainability and Regulatory Compliance: From Niche to Necessity Discussions throughout Q3 2025 are dominated by the practical implementation of environmental regulations. The European Union’s Carbon Border Adjustment Mechanism (CBAM) has made ESG reporting a core operational requirement, not a voluntary guideline.   Green Manufacturing: There is a pronounced shift towards lead-free, halogen-free, and high-recyclability PCBs. Companies are now required to provide detailed carbon footprint data for their products and processes.   Supply Chain Due Diligence: Transparency in raw material sourcing and ethical labor practices is strictly enforced, making compliance a key differentiator for market access, particularly in Europe and North America.   3. Supply Chain Resilience and Regi...

• August 22, 2025

High-Frequency PCB Industry Sees Explosive Growth Driven by 5G and Satellite Internet The global digital transformation is accelerating, and high-frequency printed circuit boards (PCBs), serving as the core carriers for wireless communication, high-speed transmission, and signal processing, have become one of the most dynamic growth areas in the electronics information industry. With the comprehensive commercialization of 5G, large-scale deployment of low-earth orbit (LEO) satellite internet constellations, and the proliferation of automotive millimeter-wave radar, the demand for high-frequency, low-loss, and high-reliability PCBs is growing exponentially. This trend is also driving rapid iterations in upstream materials, processes, and manufacturing technologies. 5G-Advanced and 6G R&D Drive Upgrades in High-Frequency Materials The construction of 5G networks is transitioning from widespread coverage to precise optimization and performance enhancement. 5G-Advanced technology is further upgrading base station antennas and radio frequency front-ends. The continuous increase in Massive MIMO antenna channels demands higher integration, better heat dissipation, and improved signal integrity from base station PCBs. Meanwhile, 6G research and development has commenced globally, with the terahertz (THz) frequency band becoming a key focus. This implies thathigh-frequency PCBsmust evolve toward higher frequency bands and lower transmission losses. In response to this trend, traditional hydrocarbon and PTFE (polytetrafluoroethylene) substrates can no longer fully meet future requirements. Ceramic-filled modified PTFE composite materials, with their adjustable dielectric properties, stable temperature coefficients, and excellent high-frequency characteristics, are gradually becoming the industry’s mainstream choice. For example, the F4BTME series high-frequency laminates achieve a stable dielectric constant (Dk) of 3.2±0.06 and a loss factor (Df) as low as 0.002 at 10GHz through a scientific formulation of nano-ceramic fillers and PTFE. Its Z-axis coefficient of thermal expansion (CTE) is as low as 58 ppm/°C, significantly improving the reliability of metallized hole interconnections, making it highly suitable for high-frequency multilayer board structures. LEO Satellite Constellation Development Fuels Demand for Aerospace-Grade High-Frequency PCBs Companies such as SpaceX, OneWeb, and China SatNet are fiercely competing in the LEO satellite internet sector. Plans to manufacture tens of thousands of satellites are creating a massive incremental market for high-frequency PCBs. Satellite communication payloads and phased array antennas need to operate in high-frequency bands such as Ka and Ku, requiring PCB materials with extremely low loss, excellent passive intermodulation (PIM) performance, and resistance to radiation and extreme temperature variations. For aerospace applications, high-frequency PCB materials must maintain performance stability in vac...