• June 11, 2025

What Are the Future Development Trends of Low-loss Materials?   Introduction As the demand for high-frequency, high-speed electronics continues to surge, the role of advanced PCB materials like Megtron 6 (M6) and FR408HR has become increasingly critical. These low-loss laminates are essential for applications in 5G communications, automotive radar, data centers, and aerospace systems, where signal integrity and thermal reliability are paramount.   This article explores the future trends of low-loss materials, the technological advancements driving their adoption, and how leading PCB manufacturers are leveraging these materials to push the boundaries of performance. Additionally, we highlight our latest 6-layer Megtron 6 PCB, engineered for high-frequency and high-speed applications, as a prime example of next-generation PCB solutions.   The Growing Importance of Low-Loss Materials Why Megtron 6 and FR408HR? Traditional FR-4 materials, while cost-effective, struggle with dielectric losses (Df) and signal degradation at high frequencies. In contrast, Panasonic Megtron 6 and Isola FR408HR offer superior electrical properties:   Ultra-low dissipation factor (Df): Megtron 6: 0.002 @ 1GHz (vs. ~0.020 for standard FR-4) FR408HR: 0.010 @ 1GHz (optimized for high-speed digital) Stable dielectric constant (Dk): Megtron 6: 3.34 @ 13GHz (minimal variation with frequency) FR408HR: 3.70 @ 10GHz (balanced for digital & RF)   Exceptional thermal performance:   High Tg (>185°C) and Td (410°C) for reliability in harsh environments These properties make them ideal for 5G mmWave, automotive radar (77GHz), and 400G/800G optical modules, where signal loss and heat dissipation are critical challenges.   Market Trends Driving Adoption 1) 5G & mmWave Expansion The rollout of 5G-Advanced and 6G will require even lower-loss materials to support higher frequencies (up to 300GHz). Megtron 6’s low Df (0.0037 @ 13GHz) makes it a top choice for mmWave antennas and RF front-ends.   2) AI & Data Center Boom AI servers demand ultra-high-speed interconnects (112Gbps+ SerDes). Megtron 6’s low insertion loss is crucial for PCIe 6.0 and 800G optical modules.   3) Automotive Radar & ADAS 77/79GHz radar PCBs require materials with minimal signal distortion. FR408HR offers a cost-effective alternative for mid-range ADAS applications.   4) Aerospace & Defense Satellite communications and phased-array radars need materials with stable Dk/Df across extreme temperatures.   Introducing Our Latest Megtron 6 PCB: A Benchmark in High-Speed Design To meet these evolving demands, we have developed a 6-layer Megtron 6 PCB material R-5775G (HVLP) PCB, optimized for high-frequency and high-speed digital applications.   Key Specifications: Parameter Details Base MaterialMegtron 6 (M6) R-5775G (HVLP) Layer Count6-layer rigid PCB Dimensions81.9 mm x 53.7 mm (±0.1...

• May 28, 2025

Dragon Boat Festival Holiday Notice & Cultural Introduction   Dear Valued Clients and Partners,   We would like to inform you that Shenzhen Bicheng Electronics Technology Co., Ltd will observe the Dragon Boat Festival holiday from May 31st to June 2nd, 2025. Normal business operations will resume on June 3rd.   During this period, our team will be unavailable for immediate responses, but urgent matters can still be directed to [Emergency Contact Email:j.shi@bichengpcb.com], and we will assist you as soon as possible. We appreciate your understanding and apologize for any inconvenience caused.     About the Dragon Boat Festival The Dragon Boat Festival (端午节, Duānwǔ Jié), celebrated on the 5th day of the 5th lunar month, is one of China’s most traditional festivals with over 2,000 years of history. It honors the patriotic poet Qu Yuan and promotes cultural heritage through:   Zongzi (Sticky Rice Dumplings)–Families enjoy pyramid-shaped glutinous rice wrapped in bamboo leaves, with sweet or savory fillings.   Dragon Boat Races–Vibrant competitions symbolize the rescue attempt of Qu Yuan, featuring rhythmic paddling and drumbeats.   Herbal Sachets & Realgar Wine–These customs ward off evil spirits and diseases, reflecting ancient health practices.   We wish you a joyful holiday filled with warmth and tradition! Thank you for your continued trust in Bicheng Electronics.   Shenzhen Bicheng Electronics Technology Co., Ltd  

• April 24, 2025

AI Computing Revolution Drives Unprecedented Transformation in High-Frequency PCB Market The global printed circuit board industry is experiencing its most significant technological and financial transformation in decades, as explosive demand for artificial intelligence computing power reshapes market dynamics and technical requirements. This comprehensive report examines the current market landscape, financial impacts on leading manufacturers, evolving technical specifications, and howBicheng's newly shipped RT/duroid 5880 high-frequency PCBs are positioned to address these industry changes. Section 1: Unprecedented Market Growth Driven by AI Computing The PCB sector is witnessing extraordinary financial performance across the board, with Chinese manufacturers leading the charge: Record-Breaking Financial Results: Shengyi Technology (300476) reported Q1 2025 net profits between 780-980 million yuan, representing staggering year-over-year growth of 272-367% - a historic high for the company since its establishment Wus (002463) posted expected profits of 720-820 million yuan, reflecting healthy growth of 40-59% YoY Industry-wide data shows 96% of listed electronics companies have projected positive Q1 earnings Analyst Perspectives: "The AI industry's high-growth phase is still in its early stages," emphasizes Li Qiusuo, Chief Domestic Strategist at China International Capital Corporation (CICC). "We're observing profitability gradually materialize across the entire value chain from computing infrastructure to application layers, with PCB manufacturers being the first beneficiaries." This sentiment is supported by market data showing the global high-performance PCB market is projected to grow at a CAGR of 12.3% from 2025-2030, significantly outpacing traditional PCB segments. Section 2: Technical Revolution Reshaping PCB Standards The AI computing boom is fundamentally transforming PCB requirements and manufacturing standards: Key Technical Shifts: Layer Count Revolution: AI server applications now routinely require 16+ layer boards, compared to 8-12 layers for conventional servers Precision Demands: Impedance control tolerances have tightened from±10% to±3% in critical applications Thermal Challenges: Power densities in AI processors are driving need for advanced thermal management solutions Signal Integrity: Ultra-low loss materials are becoming critical for high-frequency performance Reliability Requirements: Mean time between failures (MTBF) expectations have increased by 3-5x for data center applications "AI servers require PCBs with unprecedented performance characteristics," explains Kuai Jian, Senior Electronics Analyst at Orient Securities. "The market is driving demand for higher density designs, faster transmission speeds exceeding 112Gbps, and more sophisticated thermal solutions that can handle 500W+ GPU modules." Section 3:Bicheng's Strategic Response with RT/duroid 5880 Solutions In direct response to these industry developments,Bich...

• March 21, 2025

AI Servers, Robotics, and Cutting-Edge HDI Technology Drive Demand   The printed circuit board (PCB) industry is undergoing a transformative phase, driven by the rapid advancements in artificial intelligence (AI), robotics, and high-performance computing. As global demand for advanced PCBs surges, companies are racing to innovate and deliver solutions that meet the stringent requirements of next-generation technologies. Among these, HDI (High-Density Interconnect) PCBs have emerged as a critical enabler, particularly in AI servers, robotics, and telecommunications.   Our company is proud to announce the successful shipment of our latest 8-layer HDI PCB, manufactured using TU-883 material, a high-performance laminate designed for high-speed, low-loss applications. This product exemplifies our commitment to pushing the boundaries of PCB technology, catering to the ever-evolving needs of the electronics industry.   AI Servers and High-Performance Computing: A Catalyst for PCB Growth The AI revolution is reshaping the PCB landscape, with AI servers demanding PCBs that offer unparalleled performance, reliability, and density. According to recent industry reports, the global AI server PCB market is projected to grow from 5.8 billion in 2024 to 14.5 billion by 2028, driven by the exponential growth in AI workloads and data center expansions.   One of the key drivers of this growth is the increasing adoption of NVIDIA’s GB200 NVL72 architecture, which requires PCBs with advanced capabilities, including high-layer counts (24-40 layers) and sophisticated HDI technology. Our company has been at the forefront of this trend, achieving a significant milestone by becoming one of the first manufacturers globally to mass-produce 28-layer accelerator card PCBs using 5th and 6th-order HDI technology.   In the latest quarter, our AI server PCB shipments, including products designed for NVIDIA’s GB200, exceeded $2 billion, with high-layer count andHDI boards accounting for 75% of the total revenue. Looking ahead, NVIDIA’s GB200 is expected to ship over 1 million units by 2025, representing nearly 40-50% of its high-end GPU shipments. This surge in demand underscores the critical role of advanced PCBs in enabling the next wave of AI innovation.   Next-Generation Materials: PTFE and TU-883 Leading the Way As AI and high-performance computing push the limits of PCB technology, material innovation is becoming increasingly important. NVIDIA’s upcoming GB300 architecture is expected to adopt PTFE (Polytetrafluoroethylene) hybrid PCB, which offer superior dielectric properties, including a dielectric constant of 2.1 and a dissipation factor of <5×10⁻⁴. These characteristics make PTFE an ideal choice for high-frequency and high-speed applications.   In parallel, our newly shipped 8-layer HDI PCB leverages TU-883 material, a high-performance laminate renowned for its low dielectric constant (3.39 @ 10GHz...

• February 21, 2025

The Future of High-Frequency PCBs–Trends, Challenges, and Innovations The global PCB industry is undergoing a transformative phase, driven by the rapid adoption of advanced technologies such as 5G, IoT, and satellite communications. Over the past six months, several key trends have emerged, shaping the future of high-frequency PCBs and creating new opportunities for manufacturers and suppliers. As a leading player in the high-frequency PCB market, we are at the forefront of these developments, delivering cutting-edge solutions to meet the evolving demands of industries such as aerospace, telecommunications, and defense. Industry Trends Shaping the High-Frequency PCB Market 1. 5G Expansion and Beyond The rollout of 5G networks continues to accelerate worldwide, with countries investing heavily in infrastructure to support faster data speeds and lower latency. This has created a surge in demand for high-frequency PCBs capable of handling higher frequencies with minimal signal loss. According to recent reports, the 5G PCB market is expected to grow at a CAGR of over 15% through 2028, driven by the need for advanced materials and innovative designs. 2. Satellite Constellations and Space Exploration The rise of satellite constellations for global connectivity and space exploration has significantly increased the demand for high-reliability PCBs. These applications require materials that can withstand extreme temperatures, radiation, and mechanical stress while maintaining stable electrical performance. The growing interest in low Earth orbit (LEO) satellites and deep-space missions has further emphasized the need for robust PCB solutions. 3. Military and Defense Modernization Governments worldwide are investing in the modernization of military and defense systems, including radar, communication, and surveillance technologies. High-frequency laminates PCBs play a critical role in these systems, enabling precise signal transmission and reception. The demand for lightweight, durable, and thermally stable PCBs in this sector is expected to remain strong in the coming years. 4. Sustainability and Material Innovation As the industry moves toward more sustainable practices, there is a growing focus on developing eco-friendly materials and manufacturing processes. Manufacturers are exploring ways to reduce waste, improve energy efficiency, and use recyclable materials without compromising performance. This trend is particularly relevant in the high-frequency PCB segment, where material properties are critical to performance. Innovations in High-Frequency PCB Materials In response to these industry trends, we are proud to introduce the F4BTMS series, a next-generation material designed to meet the demanding requirements of modern high-frequency applications. Building on the success of our F4BTM series material, the F4BTMS1000 incorporates advanced ceramic and glass fiber technologies to deliver superior performance in aerospace, telecommunications, a...

• February 14, 2025

The Rise of HDI Hybrid PCBs and the Latest Innovations in High-Frequency Materials   As we step into 2025, the PCB industry continues to evolve at a rapid pace, driven by the increasing demand for high-performance, high-density interconnect (HDI) PCBs and advanced materials that cater to the needs of cutting-edge technologies such as 5G, IoT, automotive electronics, and aerospace applications. Among the most significant trends this year is the growing adoption of hybrid PCBs that combine high-frequency materials like Rogers RO4003C with traditional FR-4 laminates. These hybrid PCBs offer a unique balance of performance, cost-effectiveness, and manufacturability, making them ideal for a wide range of applications.   In line with this trend, we are proud to announce the successful shipment of our latestHDI Hybrid PCB: the 8-Layer 1.5mm RO4003C S1000-2M. This product exemplifies the industry's shift toward more sophisticated and high-performance PCB solutions, designed to meet the stringent requirements of modern electronic devices.   The 2025 PCB Industry Landscape: Key Trends and Innovations   1. The Surge in Demand for HDI PCBs   High-density interconnect (HDI) PCBs have become the backbone of modern electronics, enabling the miniaturization of devices while enhancing their performance. With the proliferation of 5G networks, IoT devices, and advanced automotive systems, the demand for HDI PCBs has skyrocketed. These PCBs feature finer trace widths, smaller vias, and higher layer counts, allowing for greater functionality in compact designs.   2. Hybrid PCBs: Bridging the Gap Between Performance and Cost   Hybrid PCBs, which combine high-frequency materials like Rogers RO4003C with traditional FR-4 laminates, are gaining traction in 2025. These PCBs offer the best of both worlds: the superior electrical performance of high-frequency materials and the cost-effectiveness of FR-4. This makes them particularly attractive for applications such as RF/microwave circuits, automotive radar systems, and cellular base stations.   3. Advancements in High-Frequency Materials   Materials likeRogers RO4003C are at the forefront of the PCB industry's evolution. With a dielectric constant (Dk) of 3.38 and a low dissipation factor (Df) of 0.0027 at 10GHz, RO4003C is ideal for high-frequency applications. Its thermal stability, low moisture absorption, and compatibility with standard FR-4 manufacturing processes make it a preferred choice for designers of RF and microwave circuits.   4. Sustainability and Environmental Compliance   As environmental regulations become more stringent, PCB manufacturers are increasingly adopting eco-friendly materials and processes.Rogers 4003C, for instance, is non-brominated and free from harmful substances, aligning with global sustainability goals.     Introducing Our Latest HDI Hybrid PCB: 8-Layer 1.5mm RO4003C S1000-2M Our newly shipped...