There is an episode abouthigh frequency PCB built on RO3006 material.

Rogers RO3006 printed circuit boards are ceramic-filled PTFE composites designed to offer exceptional electrical and mechanical stability at competitive price, intended for use in commercial microwave and RF applications

Firstly, RO3006 has a dielectric constant of 6.15 +/-.15. The high dielectric constant enable designers to design the circuit board smaller. So we can miniaturize our circuit size using RO3006. The DK is stable over a wide range of temperatures, so this eliminates the step change in Dk that occurs for PTFE glass materials near room temperature.

The next issue would be the dissipation factor. It’s a very low loss, 0.002 dissipation factor when it’s tested in 10 GHz. And that’s very low loss which helps power amplifier for high gain.

The third one we need to mention is the thermal conductivity. RO3006 material is very good for thermal conductivity. It’s got a number of 0.79 W/m-K, that’s considered very high for thermal conductivity and that does really help thermal management issue for power amplifiers.

Lastly, the coefficient of thermal expansion (CTE). Ideally that should be at 17 ppm/℃because that’s the value of CTE of copper. As you can see the coefficient of thermal expansion of RO3006 on X and Y axis is 17 ppm/℃which is matched to copper and Z-axis is as low as 24 ppm/℃. This allows for more reliable surface mounted assemblies, it’s ideal for applications sensitive to temperature change. That’s considered pretty good for the plated through holes reliability and excellent dimensional stability.

RO3006 PCB also has very low water absorption at 0.02%. The manufacturing process is similar to standard PTFE PCB, so we can get volume manufacturing process and economical pricing to win the market.