Rogers RO3003 high frequency materials are ceramic filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is the exceptional electrical performance and the mechanical property is stable and consistent. This allows our designers to develop multi-layer board design feeling free and free, without encountering warpage or reliability problems.
For RO3003 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. RO3003 PCBs have wide thickness. These are the standard thickness such as 10 mils, 20 mils, 30 mils and 60mils etc.
Finished copper on PCB can be 1oz, 2oz and 3oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.
Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper etc. for pads plating.
RO3003 PCBs also have low moisture absorption of 0.04%, thermal conductivity of 0.5 W/m/K. This benefits for the heat management devices. The manufacturing process of RO3003 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process to win the market.