The development status of global PCB industry segmented products

"With the accelerated investment and expansion of China's fabs and the advancement of the independent and controllable national strategy of the semiconductor industry, the domestic demand for IC substrates will grow rapidly. It is expected that the growth rate of my country's IC substrate output will be significantly higher than the international level in the future. According to the data It shows that the total operating income of my country's IC substrate industry in 2020 is about 4.035 billion yuan, a year-on-year increase of 6.07%."

According to the information released by the research report network, PCBs are mainly divided into hard boards (including single-layer boards, double-layer boards and multi-layer boards), HDI boards, IC substrates , flexible boards, rigid-flex boards, materials and functions And application areas are different. In recent years, with the continuous development of industries such as smart terminals, smart wearable devices, 5G and cloud computing, the market demand for flexible boards and rigid-flex boards, HDI boards, and IC substrates has continued to grow.

In terms of subdivided product structure, ordinary multi-layer boards accounted for 44.77% of the PCB industry market share, HDI boards accounted for 21.23% of the market share, and flexible boards accounted for 22.62% of the PCB industry market share.

According to the information released by the Guanyan Report Network, IC-Substrates are developed based on HDI boards. They have the characteristics of high density, high performance, and thinness. They are an upgrade to traditional integrated circuit packaging lead frames and are used in various chip packaging links. . In recent years, as the integrated circuit industry continues to approach the direction of small size and high integration, IC packaging has also developed in the direction of ultra-multi-pin, ultra-miniaturization and narrow pitch. According to relevant data, the global IC substrate output value will reach 10.188 billion U.S. dollars in 2020, mainly due to the rapid growth of global integrated circuit sales in 2020. In the context of the rapid growth of downstream industries, the demand for IC substrates has increased substantially.

In the Chinese market, with the accelerated investment and expansion of Chinese fabs and the advancement of the independent and controllable national strategy of the semiconductor industry, domestic demand for IC substrates will grow rapidly. It is expected that the growth rate of my country’s IC substrate output will be significantly higher than the international level in the future . According to data, the total operating income of my country's IC substrate industry in 2020 will be approximately 4.035 billion yuan, a year-on-year increase of 6.07%.

Rigid Board

Rigid boards can be divided into single-layer boards, double-layer boards and multi-layer boards. Single-layer boards are the most basic PCB products. The wiring diagrams are mainly network printing. The copper foil and wires only exist on one side and the wiring cannot cross. It can only be used for relatively simple electronic products and has been gradually eliminated; The double-layer board has wires on both sides, which can be used for double-sided wiring and welding, with an insulating layer in the middle. Its function and stability are stronger than that of a single-layer board. It is widely used in white goods and other electronic equipment that does not require a signal source. The market demand is relatively stable. . According to data, in 2019, the total output value of the global single- and double-layer board industry was 8.09 billion U.S. dollars, and it is expected to reach 9.34 billion U.S. dollars in 2025.

In addition, the multi-layer board adds an internal power layer on the basis of a single-layer board and a double-layer board, and has a larger wiring space, which can significantly optimize the line layout and reduce the dense and complex line connection space to achieve the effect of integration. At present, multi-layer boards are mainly used in various electronic devices with complex structures and large wiring space, such as 5G base stations, servers, automotive electronics, desktop computers, etc. Therefore, driven by 5G, cloud computing, and new energy vehicles, the market demand for multilayer boards has continued to grow in recent years. According to Prismark's forecast, the global multilayer board market will reach US$31.683 billion in 2025.

Flexible Board and Rigid-Flex Board

Flexible board, also known as flexible board, is a printed circuit board made of flexible insulating substrates such as polyimide or polyester film. The flexible board has the characteristics of bendable, windable, foldable, light and thin. It can be arranged in accordance with the space layout requirements, and can be moved and expanded in three-dimensional space to achieve the integration of component assembly and wire connection. It is currently mainly used in Smart phones, tablet computers and wearable devices and other portable consumer electronics products. Therefore, in recent years, the market size of the flexible board industry will be further expanded due to the continuous upgrading of smart phones and the development of portable consumer electronics and intelligence.

However, the production cost of rigid-flex boards is higher than that of flexible boards, and the market share is relatively small. They are mainly used in 5G data communication networks and fixed-line broadband links, medical equipment, digital equipment, etc. In recent years, with the continuous development of 5G communications and the continuous improvement of the autonomy of medical equipment, the market for rigid-flex board is broad. According to Prismark's forecast, the global output value of flexible boards and rigid-flex boards will reach 15.364 billion U.S. dollars in 2025.

HDI board

HDI PCB board is a high-density interconnection board. It is a circuit board with a relatively high line distribution density using micro-blind buried via technology. It is characterized by "light, thin, short, and small". At the same time, the circuit density can be increased, and the signal output quality can be greatly improved, thereby meeting the requirements of continuously improving electronic product functions and performance. At present, HDI boards are mainly used in light-weight and convenient scenes such as smart terminals and scenes that require high-speed and high-frequency transmission, such as 5G base stations and smart cities.