TSM-DS3 High Frequency PCB

April 19, 2024

TSM-DS3 High Frequency PCB

Introducing our latest product, the TSM-DS3 High Frequency PCB! With exceptional low-loss properties and thermal stability, this industry-leading laminate is perfect for high-power applications where efficient heat dissipation is crucial.

Featuring a ceramic-filled reinforced material with minimal fiberglass content, TSM-DS3 offers reliability and consistency in complex multilayer designs. Its low coefficients of thermal expansion make it ideal for demanding thermal cycling requirements.

Our PCB capabilities include single-sided, double-sided, multi-layer, and hybrid options, with customizable copper weight and dielectric thickness. With dimension sizes up to 400mm X 500mm and a variety of solder mask colors and surface finishes available, we can tailor our TSM-DS3 PCBs to suit your specific needs.

From couplers to phased array antennas to oil drilling applications, TSM-DS3 PCBs are versatile and reliable for a wide range of industries. Trust in our expertise and quality craftsmanship for your next project. Contact us today to learn more about how TSM-DS3 can elevate your PCB designs!