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Home Industry News Why High TG Materials Are Used in PCB Production?

Why High TG Materials Are Used in PCB Production?

  • June 22, 2022
Why High TG Materials Are Used in PCB Production?

In addition to the basic FR-4 material in PCB production, some customers also indicate that high TG material should be used in the materials. Then why do they use high TG material in PCB production?

Used in PCB production is the full name of the TG glass transition temperature, on behalf of the glass transition temperature. The circuit board must be flame resistant and cannot burn at a certain temperature, only to soften. This temperature point is called glass state transition temperature (Tg point), this value is related to the size stability of the PCB board. When the temperature rises to a certain area of Tg PCB, the substrate will change from "glass state" to "rubber state", which is called the glass transition temperature of the sheet (TG). In other words, Tg is the substrate temperature that remains high (℃). That is to say, ordinary PCB substrate materials at high temperature, not only produce deformation, melting and other phenomena, but also on the mechanical and electrical properties of the sharp decline.


8-layer High Tg PCB


Why high TG materials are used in PCB production?

The increase of Tg base, the characteristics of heat resistance, moisture resistance, chemical resistance and resistance stability of Shenzhen circuit board proofing will be strengthened and improved. The higher the TG value, the better the temperature and other properties of the plate, especially in the lead-free manufacturing process, high TG is more widely used.

High Tg refers to high heat resistance. With the rapid development of the electronic industry, especially the electronic products represented by computers are developing towards high functionalization and high multilayer, which requires the higher heat resistance of PCB substrate materials as an important guarantee. The appearance and development of high density installation technology represented by SMT and CMT make PCB more and more dependent on the support of high heat resistance of substrate in small aperture, fine line and thin form. This is also a big reason to use high TG materials in PCB production.

Therefore, in PCB production, the difference between general FR-4 and high Tg FR-4 is that in the hot state, especially after hygroscopic heating, the material has differences in mechanical strength, dimensional stability, adhesion, water absorption, thermal decomposition, thermal expansion and other conditions, and the high Tg product is obviously better than the common PCB substrate material.

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