American PCB manufacturer Calumet Electronics plans to build an advanced packaging substrate manufacturing plant in China
The US PCB manufacturer Calumet Electronics said in an external statement that the company is working hard to fill a key gap in the production capacity of packaging substrates in the United States.
"Calumet will be one of the first, if not the first, to bring scalable IC substrate capacity to the U.S.," said Todd Brassard, the company's chief operating officer. "We've been developing this capability for about three years. We have partnered with some Defense and commercial OEMs have collaborated to complete the first substrate sample fabrication. We have received in-demand requests for our substrates in excess of 1.5 million units per year before we even started production.”
The United States currently lags behind Asian suppliers significantly in the field of
IC packaging substrates, especially the FCBGA and FCCSP substrates used for advanced packaging are almost completely dependent on Asian manufacturers such as Xinxing, ASE, Ibiden, etc., and
low-volume customized substrates involving national defense and other needs are often Lead times are several years.
According to Brassard, Calumet is one of the few PCB companies in the United States that can produce high-density interconnect (HDI) circuit boards, and it is also one of the few manufacturers with ABF substrate research and development capabilities. Customers in the fields of satellite communications, medical equipment and other fields provide customized development services.
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