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PCB Board manufacturer
PCB Board manufacturer
- Design for Manufacture

Design For Manufacture (1)    


Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume(S<10 m²) Prototype(S<1m²)
1 Inner layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )  Min.isolation of layers 0.1mm 0.1mm 0.06mm
2 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
3 5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
4 7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
5 9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
6 13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
7 Min.distance from drill to conductor 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil 4 layer 8mil,6 layer 8mil,8-12 layer 10mil,14-20 layer 14mil,22-32 layer 18mil 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil
8 Min.width of annular ring on inner layer 4 Layer 10mil(35um),≥6 Layer 14mil(35um) 4 Layer 8mil(35um),≥6 layer 12mil(35um) 4 Layer 6mil(35um),≥6 Layer 10mil(35um)
9 Inner layer isolation ring width(Min) 10mil (35um) 8mil (35um) 6mil (35um)
10 Min.via pad diameter 20mil (35um) 16mil (35um) 16mil (35um)
11 Min. distance from board edge to conductor(no copper exposured)(inner layer) 14 mil(35um) 12 mil(35um)) 8 mil(35um)
12 Maximum copper weight(Inner layer and outer layer) 3 OZ( 105 um ) 4 OZ ( 140 um ) 6 OZ( 210 um )
13 Core with different copper foil on both sides / 18/35,35/70 um 18/35,35/70 um

Design For Manufacture (2)

Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume(S<10 m²) Prototype(S<1m²)
14 Laminating Tolerance of laminate thickness ±10% PCB thick ±10% PCB thick ±8% PCB thick
15 Maximum laminate thickness 4.0mm 6.0mm 7.0mm
16  Laminate alignment accuracy ≤±5 mil ≤±4 mil ≤±4 mil
17 Drill(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )  Min.drill bit diameter 0.2 mm 0.2 mm 0.2 mm
18 Min.slot router diameter 0.60 mm 0.60 mm 0.60 mm
19 Min.tolerance of PTH slots ±0.15mm ±0.15mm ±0.1mm
20 Max.aspect ratio 1:08 1:12 1:12
21 Hole tolerance ±3mil ±3mil ±3mil
22 Space of via to via 6mil(same net),12mil(different net) 6mil(same net),14mil(different net) 4mil(same net),12mil(different net)
23 Space of component hole to component hole 12mil(same net),16mil(different net) 12mil(same net),16mil(different net) 10mil(same net),14mil(different net)
24 Etching Min.width of etching logo 10mil(18um),12 mil (35um),12 mil(70um) 8mil(18um),10mil(35um),12 mil(70um) 6mil(18um),8 mil(35um),12mil(70um)
25 Etch factor 1.6-2.2 1.6-2.2 1.6-2.2
26 Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.via pad diameter 20mil 16mil 16mil
27 Min.BGA pad diameter 12mil 12mil 10mil
28 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
29 Minimum grid 10/10mil(35um) 8/8mil(35um) 4/8mil(35um)
30 Min.space (conductor to pad, pad to pad) 6mil(18um) 5mil(18um) 4mil(18um)
6mil(35um) 5mil(35um) 4mil(35um)
9mil(70um) 8mil(70um) 7mil(70um)
11mil(105um) 10mil(105um) 9mil(105um)
13mil(140um) 12mil(140um) 11mil(140um)

Design For Manufacture (3)

Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume(S<10 m²) Prototype(S<1m²)
31 Solder mask(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Maximum via-plug diameter 0.5mm 0.5mm 0.5mm
32 Min.width of solder mask bridge Green:5mil(35um) Green:4mil(35um) Green:4mil(35um)
33 Yellow:5mil(35um) Yellow:4mil(35um) Yellow:4mil(35um)
34 Blue:5mil(35um) Blue:4mil(35um) Blue:4mil(35um)
35 Black:6mil(35um) Black:6mil(35um) Black:6mil(35um)
36 White:6mil(35um) White:6mil(35um) White:6mil(35um)
37 All of Matt:6mil All of Matt:6mil All of Matt:6mil
38 Green:5mil(70um) Green:4mil(70um) Green:4mil(70um)
39 Yellow:5mil(70um) Yellow:4mil(70um) Yellow:4mil(70um)
40 Blue:5mil(70um) Blue:4mil(70um) Blue:4mil(70um)
41 Black:6mil(70um) Black:6mil(70um) Black:6mil(70um)
42 White:6mil(70um) White:6mil(70um) White:6mil(70um)
43 Open solder mask 4mil(35um) 4mil(35um) 3mil(35um)
44 Solder mask coverage 4mil(35um) 4mil(35um) 3mil(35um)
45 Min.width of solder mask text 9mil(35um) 9mil(35um) 8mil(35um)
46 Min.thickness of Solder mask 9um(35um) 9um(35um) 9um(35um)
47 Max.thickness of solder mask 30um(35um) 30um(35um) 30um(35um)

Design For Manufacture (4)

Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume(S<10 m²) Prototype(S<1m²)
48 Silkscreen Min.width of silkscreen text 6mil 6mil 5mil
49 Min.height of silkscreen text 35mil 35mil 30mil
50 Min.space from silkscreen to pads 6mil 6mil 5mil
51 Colour of silkscreen White, Black, Yellow
52 Carbon ink Carbon ink covers conductor or pads 14mil 13mil 12mil
53 Mid distance from carbon ink to pads 12mil 11mil 10mil
54 Peelable mask Peelable mask covers conductor or pads 8mil 7mil 6mil
55 Min.distance from peelable mask to pads 14mil 13mil 12mil
56 Max.via-plug of Silk-screen method 2.0mm 2.0mm 2.0mm
57 Max. via-plug of aluminum foil method 4.5mm 4.5mm 4.5mm
58 Surface finish Thickness of nickel of ENIG 3-5um 3-5um 2-6.35um
59 Thickness of Gold of ENIG 0.05-0.1um
60 Thickness of nickel of Gold finger 3-5um
61 Thickness of Gold of Gold finger 0.1-1.27um
62 Thickness of tin of HASL 2.54-6.35um
63 Thickness of OSP 0.2-0.5um
64 Thickness of tin of Immersion tin 0.2-0.75um
65 Thickness of silver of Immersion silver 0.15-0.75um

Design For Manufacture (5)

Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume(S<10 m²) Prototype(S<1m²)
66 Contour process Method of contour process CNC milling, V-CUT, Break-out tap, break-out holes, Punching
67 Minimum router 0.8mm
68 Min.tolerance of contour ±0.15mm ±0.13mm ±0.1mm
69 Min.distance of milling contour(no copper exposure) 12mil 10mil 8mil
70 Angle of V-CUT 20、30、45、60 ±5 degree
71 Degree of symmetry of V-CUT ±6mil ±5mil ±4mil
72  Tolerance of residual thickness of V-CUT ±6mil ±5mil ±4mil
73 Tolerance of Chamfer angle of Gold finger ±5 degree ±5 degree ±5 degree
74 Tolerance of residual thickness of bevel edge of gold finger ±5mil ±5mil ±5mil
75 Min radius of inner corner 0.4mm
76 Min. distance from edge to V-Cut (no copper exposure) 18mil (1.6mm Thick, 20 degree V-groove cutter) 14mil(1.6mm Thick, 20 degree V-groove cutter) 12mil (1.6mm Thick, 20 degree V-groove cutter)
77 20mil (1.6mm Thick, 30 degree V-groove cutter) 18mil (1.6mm Thick, 30 degree V-groove cutter) 16mil (1.6mm Thick, 30 degree V-groove cutter)
78 24mil (1.6mm Thick, 45 degree V-groove cutter) 22mil (1.6mm Thick, 45 degree V-groove cutter) 20mil (1.6mm Thick, 45 degree V-groove cutter)
79 30mil (1.6mm Thick, 60 degree V-groove cutter) 28mil (1.6mm Thick, 60 degree V-groove cutter) 26mil (1.6mm Thick, 60 degree V-groove cutter)

Design For Manufacture (6)

Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume(S<10 m²) Prototype(S<1m²)
80 Special tolerance Board thickness of flying probe test 0.6-4.0mm
81 Panel size of flying probe test Size≤900X600mm, Small size can be compensated through manufacturing procedure
82 Panel size of fixture test method Size≤460X380mm,Small size can be compensated through manufacturing procedure
83 Board thickness of fixture test method 0.4-6.0mm
84 Tolerance of press-fit hole ±2mil
85 Tolerance of NPTH ±2mil
86 Tolerance of PCB thickness 1.0mm≥PCB thickness, Tolerance ±0.1mm;1.0mm≤PCB thickness, Tolerance ±10%
87 Tolerance of depth of countersunk hole ±0.2mm
88 Depth tolerance of blind slot ±0.2mm
89 Maximum shipment size Size≤1200X600mm(Double side, no test required)
90 Size≤1000X600mm(Multilayer, no test required)
91 Minimum shipment size 10X10mm
92 PCB thickness of HASL 0.8-3.0mm(Hole less 0.5mm should be use via-plug or mask-tent )
93 HASL PCB Size Size≤600X460mm
94 PCB thickness 0.15-7.0mm
95 Depth of V groove 0.8-3.2mm
96 Distance of non-continuous v-groove ≥7mm
97 Max. drill diameter Size≤6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm)
98 Max. countersink diameter Size≤6.5mmCountersink can be used counterbore drill or router)
99 Distance of Bevel Size≥11mm Size≥5mm Size≥5mm
100 Thickness of peelable mask 0.2-1.5mm ±0.15mm


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