Rogers TC350 PCBs are designed for thermal solutions. It is comprised of PTFE, highly thermally conductive ceramic fillers and woven glass reinforcement. It offers us a unique combination of low insertion loss and higher thermal conductivity. This enables superior reliability and reduced operating temperatures in high power applications. It has the features of dielectric constant of 3.5 high thermal conductivity of 0.72 W/m-K low loss tangent of .002 at 10GHz It has a successful usage in backhaul radios, power amplifiers, low noise amplifiers and receivers, heat resistance, heat conduction and liquid cooling solutions etc.

Rogers' RT/duroid 6035HTC high frequency PCBs are ceramic filled PTFE composites. The thermal conductivity is almost 2.4 times the standard RT/duroid 6000 boards, and its electrodeposited copper or reverse treat copper has excellent long term thermal stability. So 6035HTC circuit boards are an exceptional choice for high power RF and microwave applications. Data Sheets The dielectric constant of 6035HTC is 3.5 at 10Ghz, 23 degrees Celsius under the test method of clamped stripline. Dissipation factor is 0.0013 at 10Ghz, 23 degrees Celsius. OK..then the thermal conductivity is 1.44 W/m/k (Watt per meter per Kelvin). See the comparison of other 6000 material, 6002 is 0.6 W/m/k, 6006 is 0.49 and 6010 is 0.89 Our capability There’s 10mil, 20mil, 30mil and 60mil laminate with half ounces, 1 ounce and 2 ounces. The pads can be coating with immersion gold, silver and HASL etc. The maximum panels is better with 400mm by 500mm. We can provide you with prototypes, small batches and volume production service.

F4B series high frequency materials are Wangling's products of PTFE woven glass fabric.  Today, we'll learn the woven glass fabric with ceramic filler: F4BTM-1/2. It's widely used in navigation, radar, satellite communication, 4G, 5G communications etc. with advantages in price and stableness in quality. F4BTM-1/2 has wide range of dielectric constant (DK) 2.55 to 10.2, and wide laminate thickness, 0.254mm to 10.0mm. Here I list them in the table and keep 3 seconds, you can make a screenshot for the purpose of learning

RT/duroid 5880 is one of Rogers’ glass microfiber reinforced PTFE composite which is designed for exacting stripline and microstrip circuit applications. Why do we use RT/duroid 5880? Firstly, it has low dielectric constant of 2.2 between 8 Ghz to 40Ghz, and is constant over a wide frequency range. The randomly oriented microfibers help to maintain the DK uniformity. Secondly, RT/duroid 5880 has low dielectric loss. It’s as low as 0.0004 when 1 MHz and 0.0009 when 10 GHz. Its low dissipation factor extends the usefulness of 5880 to Ku-band and above. Thirdly, it’s designed for exacting stripline and microstrip circuit applications We can provide you with double layer board, multi-layer board and hybrid types. Laminate thickness ranges 10 mils to 62 mils with half ounces, one ounce and two ounces. Panel size within 400mm by 500mm is well suited for fabrication. Green colour or no colour is the most used for solder mask and Immersion gold is often chosen for pads finish. RT/duroid 5880 PCB also has the properties of low water absorption, excellent chemical resistance etc. The typical applications are microstrip and stripline circuits, commercial airline broadband antenna，radar systems, millimeter wave applications, point to point digital radio antenna etc.

Rogers RO3035 PCBs are ceramic-filled PTFE based high frequency circuit boards. Its expansion coefficient is matched to that of copper, which allows the PCBs to exhibit excellent dimensional stability. RO3035 materials have dielectric constant of 3.50 at 10GHz. With the characteristics of stable DK over different temperature and uniform DK over wide frequency range, it solves many challenges faced by antenna designers, such as patch antennas, phase array antennas. Since its “soft-substrate” feature, it has successful applications in a variety of conformal antennas. RO3035 materials exhibit the CTE in the X and Y axis of 17 and 17 ppm/°C respectively. This expansion coefficient is matched to that of copper (17 ppm/°C), which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/°C, which provides exceptional plated through-hole reliability, even in severe thermal environments. Low X, Y and Z axis CTE and thermal conductivity of 0.5 W/m/k assure its reliability over power cycling and active electronically scanned array (AESA). Low dissipation factor of .0015 at 10 GHz together with high thermal conductivity is a must for power amplifiers, low noise amplifiers and receivers, digital communications control circuitry etc. RO3035 PCBs also have low moisture absorption of 0.04%, thermal conductivity of 0.5 W/m/K, which benefits for the thermal management. RO3035 PCB can be fabricated using standard PTFE circuit board processing techniques, so it’s suitable for volume manufacturing process to win the market.

There is the episode 5 about the RO4350B high frequency PCB, which has a dielectric constant of 3.48 at 10 GHz, a dissipation factor of 0.0037 at 10 GHz. Low dielectric tolerance and low loss allows applications with higher operating frequencies. The expansion coefficient of RO4350B PCB is similar to that of copper that allows the board exhibiting excellent dimensional stability. And RO4350B boards have a Tg of >280°C (536°F) so its expansion characteristics remain stable over the entire range of circuit processing temperatures.