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Videos
  • RT/duroid 6002 High Frequency PCB
    RT/duroid 6002 High Frequency PCB

    There is an episode about the high frequency PCB made on RT/duroid 6002 material. Rogers' RT/duroid 6002 high frequency material is the preferred PTFE-based ceramic composites. It is a kind of low loss and low dielectric constant laminate, which can meet the strict requirements for mechanical reliability and electrical stability in complex microwave structural design. The dielectric constant of RT/duroid 6002 has excellent resistance to temperature change between -55 ℃ and 150 ℃, which can meet the requirements of filter, oscillator and delay line for its electrical stability. For RT/duroid 6002 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. RT/duroid 6002 PCBs have wide thickness. There are the standard thickness such as 10 mils, 20 mils, 30 mils and 60mils etc. and non-standard thickness such as 15 mils, 25 mils,35 mils and 40 mils etc. It’s as thin as 5 mils and as thick as 125 mils for our designers. Finished PCB copper has 1oz and 2oz. Our maximum PCB size on high frequency material is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel. Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper etc. for pads plating. RT/duroid 6002 PCB has tight thickness control with low out-gassing. It is very suited to the equipment of flat and non-planar structures, such as antennas, complex multi-layer PCBs with inner-layer connections, and microwave PCBs for aerospace designs in hostile environments.

  • RO4360G2 High Frequency PCB
    RO4360G2 High Frequency PCB

    RO4360G2 PCB is glass-reinforced, hydrocarbon ceramic-filled thermoset printed circuit board that provides the ideal balance of performance, and manufacturability is similar to FR-4 PCB. They are lead-free process capable and have better rigidity in multi-layer board constructions, while reducing material and fabrication costs. RO4360G2 PCB is also a type of thermal management board with high thermal conductivity of 0.75 W/m-K and high Tg greater than 280 °C For RO4360G2 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. RO4360G2 PCBs have wide thickness. There are the standard thickness such as 12 mils, 20 mils, 32 mils, 60 mils etc. and non-standard thickness such as 8 mils, 16 mils, 24 mils etc. Finished copper on PCB can be 1oz, 2oz and 3oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel. Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper etc. for pads plating. RO4360G2 PCBs are automated assembly compatible and lead free process compatible with reliable plated through holes.They can be paired with RO4450F prepreg and lower-Dk RO4350B, RO4003C in multi-layer designs.

  • RT/duroid 5880LZ High Frequency PCB
    RT/duroid 5880LZ High Frequency PCB

    Rogers RT/duroid 5880LZ laminates are filled PTFE composites designed for exacting strip-line and micro-strip circuit applications. They contain a unique filler that results in a low density, lightweight material for high performance and weight sensitive applications. RT/duroid 5880LZ has Z-axis coefficient of thermal expansion (CTE) at 40 ppm/°C. This is a low value that ensure its reliable plated through holes. When ordering RT/duroid 5880LZ PCB, it is important to specify the dielectric thickness, weight of copper foil required and surface finish.

  • High Frequency PCB Built on RO3006 Material
    High Frequency PCB Built on RO3006 Material

    There is an episode abouthigh frequency PCB built on RO3006 material. Rogers RO3006 printed circuit boards are ceramic-filled PTFE composites designed to offer exceptional electrical and mechanical stability at competitive price, intended for use in commercial microwave and RF applications Firstly, RO3006 has a dielectric constant of 6.15 +/-.15. The high dielectric constant enable designers to design the circuit board smaller. So we can miniaturize our circuit size using RO3006. The DK is stable over a wide range of temperatures, so this eliminates the step change in Dk that occurs for PTFE glass materials near room temperature. The next issue would be the dissipation factor. It’s a very low loss, 0.002 dissipation factor when it’s tested in 10 GHz. And that’s very low loss which helps power amplifier for high gain. The third one we need to mention is the thermal conductivity. RO3006 material is very good for thermal conductivity. It’s got a number of 0.79 W/m-K, that’s considered very high for thermal conductivity and that does really help thermal management issue for power amplifiers. Lastly, the coefficient of thermal expansion (CTE). Ideally that should be at 17 ppm/℃because that’s the value of CTE of copper. As you can see the coefficient of thermal expansion of RO3006 on X and Y axis is 17 ppm/℃which is matched to copper and Z-axis is as low as 24 ppm/℃. This allows for more reliable surface mounted assemblies, it’s ideal for applications sensitive to temperature change. That’s considered pretty good for the plated through holes reliability and excellent dimensional stability. RO3006 PCB also has very low water absorption at 0.02%. The manufacturing process is similar to standard PTFE PCB, so we can get volume manufacturing process and economical pricing to win the market.

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