Here is the Episode about the Rogers’ TC350 PCBs, which are comprised of PTFE, highly thermally conductive ceramic fillers and woven glass reinforcement. It offers us a unique combination of low insertion loss and higher thermal conductivity. This enables superior reliability and reduced operating temperatures in high power applications. It has a successful usage in heat resistance, heat conduction and liquid cooling solutions and the like. The dielectric constant (Dk) of TC350 is 3.5 at 10GHz, dissipation factor is 0.002 at 10GHz. This is a very low loss tangent value. Lower losses result in higher amplifier and antenna gains and efficiencies. It also has low thermal coefficient of Dk at -9 ppm/°C, ranging -40°C to 140°C; low coefficient of thermal expansion on X, Y and Z axis (7, 7, and 23 ppm/°C respectively).This feature provides unsurpassed plated through hole reliability. Last but not least, TC350 has high thermal conductivity of 0.72 W/m-K. It helps toreduce junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability. For TC350 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. These PCBs have wide thickness. They are the standard thickness such as 10 mils, 20 mils, 30 mils, 60mils. Finished copper on PCB is 1oz and 2oz. Our maximum PCB size on high frequency material is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel. Solder mask of green, black, red and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper etc. for pads plating. TC350 PCBs are widely used in many devices that need heat transferred fast, such as power amplifiers,backhaul radios, tower mounted amplifiers (TMA), tower mounted boosters (TMB), thermally cycled antennas, microwave combiners and power dividers etc. TC350 PCB also has excellent dielectric constant stability across a wide temperature range. This helps power amplifier and antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes. This DK stability is also critical to phase and impedance sensitive devices such as network transformers utilized for impedance matching networks.

There is an episode about a type of high DK microwave PCB ---- RT/duroid 6010.2LM PCB. Rogers RT/duroid 6010.2LM high frequency PCBs are a type of high DK PCB boards of ceramic-filled PTFE composites which are designed for electronic and microwave circuit applications. High dielectric constant material can reduce the size of microwave circuits because it requires narrower conductors for controlled impedance. It will make the resonator shorter and the overall filters smaller. The dielectric constant of RT/duroid 6010.2LM is as high as 10.2 and dissipation factor is as low as 0.0023 at 10 GHz. It's well suited for electronic and microwave circuit applications requiring a high dielectric constant. The low loss is ideal for operating at X-band or below. The thermal coefficient of dielectric constant is -425 ppm/℃ due to its filling ceramics. The moisture absorption is as low as 0.01%. This helps to reduce effects of moisture on electrical loss. RT/duroid 1060.2LM also has good thermal mechanical stability because of the ceramic fillers, its thermal conductivity is as high as 0.86 W/mK. The coefficient of thermal expansion on X and Y axis is similar to copper, and Z-axis CTE is as low as 47 ppm/℃, this property ensures the reliable plated through-holes in multi-layer boards.

There ia an episode about high frequency PCB built on RT/duroid 5870 laminates. RT/duroid 5870 is glass microfiber reinforced PTFE composite of Rogers Corporation, which is designed for exacting stripline and microstrip circuit applications. There’re some reasonsfor using RT/duroid 5870 material. The first one is lowest electrical loss among reinforced PTFE materials. RT/duroid 5870 has a low dielectric constant of 2.33 and 0.0012 low dissipation factortestedat 10Ghz. Its low dissipation factor extends the usefulness to Ku-band and above. The next is low moistureabsorption.Since it’s PTFE properties, it doesn’t absorb water,the moisture absorption is as low as 0.02%.It’s ideal materials for high moisture environments. Thirdly, the randomly oriented microfibers result in exceptional dielectric constant uniformity. The DK is uniform from panel to panel and is constant over a wide frequency range. Lastly,It is isotropic and designed for microstrip and stripline applications. RT/duroid 5870 PCBs offer high frequency with low dielectric constant loss. They are well suited forhigh frequency/broadband applicationswhere dispersion and losses need to be minimized.

There is an episode about high frequency PCB built on RO4003C laminates. RO4003C high frequency materials are woven glass reinforced hydrocarbon ceramic-filled laminates produced by Rogers Corporation. It has the similar electrical properties of PTFE/woven glass and manufacturability of epoxy resin materials. RO4003C materials are designed to offer superior high frequency performance, with dielectric constant of 3.38 +/- 0.05, dissipation factor of 0.0027 at 10 GHz. Low loss results in excellent electrical performance and allows applications with high operating frequencies. Multi-layer circuit boards on RO4003C are manufactured by combining several cores through bondply RO4450F. In order to save production cost but not reduce signal loss in high frequency environment,the construction of high frequency materials mixed with FR-4 came into being.At present, the manufacturing technology of hybrid circuit board is mature and they are welcomed in the market.

Rogers RO3003 high frequency materials are ceramic filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is the exceptional electrical performance and the mechanical property is stable and consistent. This allows our designers to develop multi-layer board design feeling free and free, without encountering warpage or reliability problems. For RO3003 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. RO3003 PCBs have wide thickness. These are the standard thickness such as 10 mils, 20 mils, 30 mils and 60mils etc.  Finished copper on PCB can be 1oz, 2oz and 3oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.  Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper etc. for pads plating.  RO3003 PCBs also have low moisture absorption of 0.04%, thermal conductivity of 0.5 W/m/K. This benefits for the heat management devices. The manufacturing process of RO3003 high frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume manufacturing process to win the market.

Rogers TMM 4 PCB is a ceramic, hydrocarbon, thermoset polymer composite designed for stripline and microstrip applications. It has strong mechanical and chemical properties combined many of the benefits of both ceramic and traditional PTFE materials. It is based on thermoset resins which allows for reliable wire-bonding without pad lifting or substrate deformation. TMM 4 has dielectric constant value of 4.5 +/- .045 at 10GHz, the tolerance is very tight. Then dissipation factor is .002 at 10GHz, very low dissipation factor. Next, the thermal coefficient of dielectric constant (TCDK) is as low as 15 ppm/°C from -55°C to +125°C. Ideally, TCDk should be 0 ppm / ℃, that is, Dk does not change with temperature. So, as a digital reference, a TCDk less than | 50 | ppm / ℃ or lower can be considered better. The coefficient of thermal expansion of three axes (16,16 and 21 ppm/°C) is very closely matched to copper, so TMM4 PCB production has very high reliable plated through holes and low etch shrinkage values. For TMM 4 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. TMM 4 PCBs have wide thickness. There are the standard thickness such as 20 mils, 30 mils, 50 mils and 60mils etc. and non-standard thickness such as 15 mils, 25 mils,75 mils, and 125 mils etc. It’s as thin as 15 mils and as thick as 500 mils for our designers. Finished copper on PCB can be 1oz, 2oz and 3oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel. Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, pure gold and bare copper etc. for pads plating. TMM 4’s mechanical properties resist creep and cold flow. It is resistant to process chemicals, reducing damage during fabrication. All common PCB manufacturing processes can be used with TMM 4 materials, so the volume mass production is available for marketing.