The Valuable Information of TMM4 PCBs
TMM4 PCB is a type of high-frequency circuit board designed for use in applications where low loss and high-performance signal transmission is critical. TMM4 stands for Thin
Multilayer Microwave PCB, which refers to the construction of the board.
TMM4 PCBs are built up with multiple layers of thin, high-quality materials that are specifically designed for microwave and RF applications. The layers are laminated together with an adhesive and pressed under heat and pressure to create a dense, stable substrate.
The TMM4 PCB is characterized by its low dielectric loss, high thermal conductivity, and excellent electrical performance at high frequencies. It is commonly used in applications such as mobile communication, satellite communication, and radar systems.
One of the most important features of TMM4 PCBs is their low loss tangent. The loss tangent is a measure of the amount of power lost as heat during signal transmission, and a lower loss tangent means that more power is transmitted efficiently. TMM4 PCB Material typically have a loss tangent of around 0.0015, which is much lower than standard FR-4 PCBs.
Another important feature of TMM4 PCBs is their high thermal conductivity. Because high-frequency signals generate heat, it is important to dissipate that heat quickly to prevent damage to the board and its components. TMM4 PCBs typically have a thermal conductivity of around 3 W/m-K, which is much higher than FR-4 PCBs.
TMM4 PCBs are also known for their high reliability and long lifespan. They are typically designed with strict quality control processes to ensure that they meet the highest standards of performance and durability.
Here's detailed parameters for TMM4.
TMM4 PCB substrate is a type of PCB material that exhibits several properties such as high dielectric constant, low dissipation factor, high insulation resistance, and good thermal stability. The material has a dielectric constant of 4.5±0.045 in the Z-direction at 10 GHz and a design dielectric constant of 4.7 in the frequency range of 8 GHz to 40 GHz as determined by the Differential Phase Length Method. TMM4 has a low dissipation factor of 0.002 in the Z-direction at 10 GHz.
The thermal coefficient of dielectric constant of TMM4 is +15 ppm/°K in the temperature range of -55℃ to 125℃. The material has high insulation resistance (>2000 Gohm) and volume resistivity (6 x 10^8 Mohm.cm) as well as surface resistivity (1 x 10^9 Mohm). The electrical strength or dielectric strength of TMM4 is 371 V/mil as determined by the IPC-TM-650 method 2.5.6.2.
In terms of thermal properties, TMM4 has a decomposition temperature (Td) of 425℃ as determined by TGA testing. The material has a coefficient of thermal expansion of 16 ppm/K in both the X and Y directions and 21 ppm/K in the Z direction over the temperature range of 0 to 140 ℃. The thermal conductivity of TMM4 is 0.7 W/m/K at 80℃.
In terms of mechanical properties,
TMM4 microwave PCB has a copper peel strength of 5.7 (1.0) lb/inch (N/mm) after solder float with 1 oz. EDC, as determined by the IPC-TM-650 Method 2.4.8. The flexural strength of TMM4 is 15.91 kpsi in both the MD and CMD directions, while the flexural modulus is 1.76 Mpsi in both the MD and CMD directions, as determined by ASTM D790 testing.
TMM4 has a moisture absorption rate of 0.07% for a 2x2 inch sample with a thickness of 1.27mm (0.050") and 0.18% for a thickness of 3.18mm (0.125") when tested under D/24/23 conditions according to ASTM D570. The specific gravity of TMM4 is 2.07 as determined by ASTM D792 testing, and its specific heat capacity is 0.83 J/g/K, as calculated.
TMM4 is lead-free process compatible and suitable for use in various applications that require high-speed digital, microwave, and RF performance. The material is widely used in the telecommunications, aerospace, and defense industries, among others.
Overall, TMM4 PCBs are a critical component in many high-frequency applications where low loss and high-performance signal transmission is essential. Their unique construction and advanced materials make them ideal for use in the most demanding environments and applications.