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20 mil RO4003C PCB
20 mil RO4003C PCB
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Why is RT/duroid 6035HTC the Ultimate Choice for High-Power RF Applications?

  • July 14. 2025

Why is RT/duroid 6035HTC the Ultimate Choice for High-Power RF Applications?

 

Introduction

Rogers RT/duroid 6035HTC high-frequency circuit materials are ceramic-reinforced polytetrafluoroethylene (PTFE) composites, engineered specifically for high-power radio frequency (RF) and microwave uses. These materials excel in high-power settings: their thermal conductivity surpasses that of standard RT/duroid 6000 series products by nearly 2.4 times; they incorporate specially processed electrolytic copper foils (both ED type and reverse-treated variants) boasting superior long-term thermal stability; additionally, Rogers' cutting-edge filler technology enhances material drillability, leading to significant reductions in drilling costs when compared to conventional high-thermal-conductivity laminates relying on alumina fillers.

 

Core Characteristics

RT/duroid 6035HTC features a dielectric constant of 3.50 with a tight tolerance of±0.05, providing a foundation for stable and reliable equipment operation.

 

When operating at a frequency of 10GHz, it exhibits a low dissipation factor of 0.0013, which serves to minimize signal loss and ensure efficient signal transmission in high-frequency conditions.

 

At 80°C, its thermal conductivity measures 1.44 W/m/K, facilitating effective heat dispersion and temperature regulation—a attribute that proves especially vital in high-power applications.

 

Through the utilization of thermally stable low-profile reverse-treated copper foil, Rogers 6035HTC achieves reduced insertion loss while maintaining exceptional thermal stability of circuit traces, ensuring consistent electrical performance even amid temperature variations.


Rogers 6035HTC Features 

 

PCB Manufacturing Capabilities

We provide an extensive array of PCB manufacturing solutions to address your unique requirements:

 

Layer configurations: Options include single-layer, double-layer, multi-layer, and hybrid-structure PCBs

 

Copper foil weights: Available in 1oz (35μm) and 2oz (70μm)

 

Laminate thicknesses: Offering 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm) to accommodate diverse design and mechanical requirements.

 

PCB dimensions: Maximum circuit size reaches 400mm×500mm, providing versatility for projects of varying scales

 

Solder mask colors: Encompassing green, black, blue, yellow, red, and other options

 

Surface finish choices: Including bare copper, Hot Air Solder Leveling (HASL), Electroless Nickel Immersion Gold (ENIG), Immersion Silver, Immersion Tin, Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), pure gold, and Organic Solderability Preservative (OSP), among others.

 

Rogers 6035HTC PCB Capability

 

Application Areas

RT/duroid 6035HTC PCBs find widespread use in the realm of high-power RF and microwave electronics, with specific applications such as high-power RF amplifiers, microwave power amplifiers, couplers, filters, combiners, and power dividers.


Rogers 6035HTC pcb



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