New High-Frequency PCB Material Enhances Wireless Communication System Performance

In recent days, the high-frequency PCB industry has captured the attention of professionals, as a breakthrough product has been launched that promises significant advancements in the performance of wireless communication systems. This innovative new product utilizes cutting-edge material solutions to deliver a more efficient and reliable communication experience for users.

The high-frequency PCB incorporates 30mil Rogers RO4350B hydrocarbon ceramic laminates, renowned for their excellent thermal conductivity and stability. With a lead-free process, the product meets environmental standards and addresses the growing consumer demand for eco-friendly materials. Furthermore, the operating temperature range of -40℃ to +85℃ ensures its suitability for a wide range of complex environments.

Regarding construction details, the stackup of this high-frequencyRO4350B PCB involves a base copper layer of 17um, a 30mil RO4350B dielectric layer, and another 17um base copper layer. This design ensures the stability and reliability of high-frequency signals during transmission. Precise control over these construction details guarantees the quality of communication for users.

In addition, the Rogers 4350B PCB boasts several outstanding features. The board dimensions measure 52.00mm x 38.00mm, with an accuracy of +/- 0.15mm, meeting the requirements for precise dimensions. With a minimum trace/space of 8/6 mils and a minimum hole size of 0.5mm, it fulfills the demands of high-density circuit designs. The product employs 1 oz (1.4 mils) finished copper weight across all layers, 1 mil via plating thickness, and an ENEPIG surface finish, further enhancing its quality and reliability.

Notably, the high-frequency material PCB is equipped with a top and bottom solder mask of Matt Black, 0.5mm via copper paste filled and capped, and requires edge plating. These carefully implemented manufacturing processes contribute to exceptional electrical performance and stability.

Impedance matching, accurate within +/- 10%, is achieved to ensure signal stability and consistency. Additionally, the product provides comprehensive statistics, including 15 components, 53 pads, 45 vias, and 3 nets, offering valuable reference information for users.

For any technical inquiries regarding this high-frequency PCB technology, customers are encouraged to contact Jane, the sales manager, at sales20@bichengpcb.com, who will provide technical support and consultation services.

The introduction of this groundbreaking 30mil RO4350B high-frequency PCB material will undoubtedly propel the development of wireless communication systems. Its outstanding performance and reliability will enhance the speed, stability, and reliability of wireless communication, delivering an exceptional communication experience for users. Looking ahead, we anticipate further innovations in the high-frequency PCB industry, unlocking more potential and possibilities for wireless communication technology.

Conclusion:

The arrival of this revolutionary high-frequency PCB material marks a significant milestone for the industry, opening up broader horizons for the advancement of wireless communication systems. It promises a more efficient and reliable communication experience for users and brings forth new opportunities and innovations in the field. With ongoing technological advancements and innovations, we firmly believe that the high-frequency PCB industry will continue to play a vital role in driving the development of wireless communication technology.