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Home Rogers PCB Board High Frequency PCB Rogers 30mil 0.762mm RO4350B Double Sided RF Circuit Board

High Frequency PCB Rogers 30mil 0.762mm RO4350B Double Sided RF Circuit Board

RO4350B material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. 

  • Item NO.:

    BIC-002-v71.0
  • Order(MOQ):

    10
  • Payment:

    T/T
  • Market Price:

    $2.99
  • Price Range:1 - 100/$89.99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


High Frequency PCB Rogers 30mil 0.762mm RO4350B Double Sided RF Circuit Board for LNCs

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RO4350B hydrocarbon ceramic laminates are designed to offer superiorhigh frequency performanceand low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. Low dielectric loss allows RO4350B material to be used in many applications where higher operating frequencies limit the use of conventionalcircuit board materials. 


30mil RO4350B


The temperature coefficient of dielectric constantis among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4350B material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4350B is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed formixed dielectric multi-layer boardsconstructions. The low Z-axis CTE of RO4350B provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has aTg of >280Cso its expansion characteristics remain stable over the entire range of PCB processing temperatures.


PCB Specifications:


PCB SIZE 93 x 92mm=1PCS
BOARD TYPE
Number of Layers Double sided PCB, 2 Layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17.8um(0.5oz)+plate TOP layer
RO4350B 30mil (0.762mm)
copper ------- 17.8um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 11.97mil
Minimum / Maximum Holes: 0.3/2.8mm
Number of Different Holes: 2
Number of Drill Holes: 195
Number of Milled Slots: 5
Number of Internal Cutouts: 0
Impedance Control No
BOARD MATERIAL
Glass Epoxy:  RO4350B 30mil (0.762mm), Tg 288℃
Final foil external:  1oz
Final foil internal:  0oz
Final height of PCB:  0.8mm ±0.1
PLATING AND COATING
Surface Finish Immersion Gold (16.2%) 2 micoinch over 100 microinch nickel
Solder Mask Apply To:  NO
Solder Mask Color:  NO
Solder Mask Type: N/A
CONTOUR/CUTTING Routing, Fiducial Marks
MARKING
Side of Component Legend NO
Colour of Component Legend NO
Manufacturer Name or Logo:  N/A
VIA Plated Through Hole(PTH)
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


30mil RO4350B PCB



Typical applications are as follows:


PCB


 

Data sheet of Rogers 4350B (RO4350B):


Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
0.0031
Z 10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 x 1010 MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 x109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
130(18.9)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 255
(37)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
32
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃TMA A IPC-TM-650 2.4.24.3
Td 390 ℃TGA ASTM D 3850
Thermal Conductivity 0.69 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
(5.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0 UL 94
Lead-free Process Compatible Yes


MANUFACTURING PROCESS:


Rogers 4350B MANUFACTURING PROCESS


BICEHNG PCB EQUIPMENT:


Bicheng PCB Equipment


BICHENG PCB CERTIFICATE:


RO4350B DK DF PCB

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