High
Frequency PCB Rogers 30mil 0.762mm RO4350B Double Sided RF Circuit Board for
LNCs
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
RO4350B hydrocarbon ceramic laminates are designed to offer superiorhigh frequency
performanceand low cost circuit fabrication. The selection of laminates
typically available to designers is significantly reduced once operational
frequencies increase to 500 MHz and above. Low dielectric loss allows RO4350B material to be used in many
applications where higher operating frequencies limit the use of conventionalcircuit board materials.
The
temperature coefficient of dielectric constantis among the lowest of any circuit
board material, and the dielectric constant is stable over a broad frequency
range. RO4350B material's thermal coefficient of expansion(CTE) provides
several key benefits to the PCB designers. The expansion coefficient of RO4350B
is similar to that of copper which allows the material to exhibit excellent
dimensional stability, a property needed formixed dielectric multi-layer
boardsconstructions. The low Z-axis CTE of RO4350B provides reliable plated
through-hole quality, even in severe thermal shock applications. RO4350B
material has aTg of >280Cso its expansion characteristics remain stable
over the entire range of PCB processing temperatures.
PCB
Specifications:
|
PCB SIZE
|
93 x 92mm=1PCS
|
|
BOARD TYPE
|
|
|
Number
of Layers
|
Double sided
PCB, 2 Layer PCB
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
YES
|
|
LAYER STACKUP
|
copper
------- 17.8um(0.5oz)+plate TOP layer
|
|
RO4350B 30mil (0.762mm)
|
|
copper ------- 17.8um(1oz)+plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
11.97mil
|
|
Minimum
/ Maximum Holes:
|
0.3/2.8mm
|
|
Number
of Different Holes:
|
2
|
|
Number
of Drill Holes:
|
195
|
|
Number
of Milled Slots:
|
5
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control
|
No
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RO4350B 30mil (0.762mm), Tg 288℃
|
|
Final
foil external:
|
1oz
|
|
Final
foil internal:
|
0oz
|
|
Final
height of PCB:
|
0.8mm
±0.1
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion
Gold (16.2%) 2 micoinch over 100 microinch nickel
|
|
Solder
Mask Apply To:
|
NO
|
|
Solder
Mask Color:
|
NO
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing,
Fiducial Marks
|
|
MARKING
|
|
|
Side of
Component Legend
|
NO
|
|
Colour
of Component Legend
|
NO
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
Plated
Through Hole(PTH)
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
(0.15mm)
|
|
Board
plating:
|
0.0030"
(0.076mm)
|
|
Drill
tolerance:
|
0.002"
(0.05mm)
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Typical applications are as follows:
Data sheet of Rogers 4350B (RO4350B)：
|
Property
|
RO4350B
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
3.48±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
3.66
|
Z
|
|
8 to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factortan,δ
|
0.0037
0.0031
|
Z
|
|
10
GHz/23℃
2.5 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of ε
|
+50
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
1.2 x 1010
|
|
MΩ.cm
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Surface Resistivity
|
5.7 x109
|
|
MΩ
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Electrical Strength
|
31.2(780)
|
Z
|
Kv/mm(v/mil)
|
0.51mm(0.020")
|
IPC-TM-650
2.5.6.2
|
|
Tensile Modulus
|
16,767(2,432)
14,153(2,053)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Tensile Strength
|
203(29.5)
130(18.9)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Flexural Strength
|
255
(37)
|
|
MPa
(kpsi)
|
|
IPC-TM-650
2.4.4
|
|
Dimensional Stability
|
<0.5
|
X,Y
|
mm/m
(mil/inch)
|
after etch+E2/150℃
|
IPC-TM-650
2.4.39A
|
|
Coefficient of Thermal Expansion
|
10
12
32
|
X
Y
Z
|
ppm/℃
|
-55℃to288℃
|
IPC-TM-650
2.4.41
|
|
Tg
|
>280
|
|
℃TMA
|
A
|
IPC-TM-650
2.4.24.3
|
|
Td
|
390
|
|
℃TGA
|
|
ASTM
D 3850
|
|
Thermal Conductivity
|
0.69
|
|
W/M/oK
|
80℃
|
ASTM
C518
|
|
Moisture Absorption
|
0.06
|
|
%
|
48hrs
immersion 0.060"
sample Temperature 50℃
|
ASTM
D 570
|
|
Density
|
1.86
|
|
gm/cm3
|
23℃
|
ASTM
D 792
|
|
Copper Peel Stength
|
0.88
(5.0)
|
|
N/mm
(pli)
|
after
solder float 1 oz.
EDC Foil
|
IPC-TM-650
2.4.8
|
|
Flammability
|
(3)V-0
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
MANUFACTURING PROCESS:
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