Let's dive into the features and specifications of our Taconic TLY-3 20mil PCB:

High-Quality Material: The Taconic TLY-3 PCB is made from premium woven fiberglass PTFE composites, ensuring outstanding durability and thermal stability. It boasts a process DK of 2.33 at 10 GHz/23°C, making it an excellent choice for high-frequency applications.

Reliable Stackup: This TLY-3 2-layer rigid PCB consists of a solid copper layer on both sides, sandwiching a high-quality TLY-3 substrate with a thickness of 0.508mm (20mil). This design provides excellent signal integrity and minimizes interference, ensuring optimal performance.

Impressive Construction Details: The Taconic TLY-3 20mil PCB is designed with meticulous attention to detail. Here are some key features:

• Board dimensions: 141.5mm x 163mm, allowing for versatile usage across various applications.
• Minimum Trace/Space: 4/4 mils, enabling precise routing and compact designs.
• Minimum Hole Size: 0.35mm, facilitating easy component integration.
• Finished board thickness: 0.63mm, providing a sturdy and reliable PCB.
• Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring optimal conductivity.
• Via plating thickness: 20 μm, enabling efficient signal transfer.
• Surface finish: Immersion silver, offering excellent solderability and corrosion resistance.
• Top Silkscreen: No, allowing for a clean and minimalist appearance.
• Bottom Silkscreen: No, maintaining an unobtrusive aesthetic.
• Top Solder Mask: Green, providing protection and insulation.
• Bottom Solder Mask: No, maintaining a sleek and lightweight design.
• 100% Electrical Test: Every PCB undergoes rigorous electrical testing to ensure its reliability and functionality.

Impressive PCB Statistics: The Taconic TLY-3 20mil PCB comes equipped with impressive statistics that showcase its capabilities:

• Components: 183, allowing for complex and diverse electronic designs.
• Total Pads: 250, providing ample space for component connections.
• Thru Hole Pads: 139, facilitating secure and stable through-hole connections.
• Top SMT Pads: 92, offering flexibility for surface mount components.
• Bottom SMT Pads: 19, providing additional SMT options.
• Vias: 90, enabling efficient signal routing and connections.
• Nets: 8, ensuring seamless communication between components.

Compatibility and Standards: The Taconic TLY-3 20mil PCB is designed in accordance with IPC-Class-2 standards, ensuring consistent quality and compatibility. It is compatible with Gerber RS-274-X artwork, making it easy to integrate into your existing manufacturing processes.

Introduction to PCB-20mil TLY-3 Material: An Overview

PCB-20mil TLY-3 Material is a high-performance substrate material designed specifically for advanced printed circuit board (PCB) applications. It offers numerous advantages over traditional materials, such as enhanced electrical performance, superior durability, and improved thermal conductivity. This material is gaining popularity in industries ranging from consumer electronics to aerospace due to its exceptional properties and reliability.

Key Properties of PCB-20mil TLY-3 Material: A Comparative Analysis

Compared to other materials, PCB-20mil TLY-3 boasts a low dielectric constant (DK), which allows for faster signal transmission and reduced signal loss. Additionally, it offers a low dissipation factor (Df), which minimizes energy loss and ensures efficient power delivery. These properties make PCB-20mil TLY-3 an ideal choice for high-speed and high-frequency applications.

Applications of PCB-20mil TLY-3 Material: From Consumer Electronics to Aerospace

The versatility of PCB-20mil TLY-3 Material makes it suitable for a wide range of applications. In consumer electronics, it can be found in smartphones, tablets, and laptops, where its high-performance capabilities enable faster data transfer and improved circuit efficiency. In the aerospace industry, PCB-20mil TLY-3 is used in avionics and communication systems, thanks to its ability to withstand extreme temperatures and its high reliability in harsh environments.

Understanding the Impact of DK and Df on Circuit Performance

The low DK Df PCB-20mil TLY-3 Material contribute significantly to the overall performance of electronic circuits. A low DK ensures minimal signal loss, resulting in improved signal integrity and reduced cross-talk. Meanwhile, a low Df reduces energy loss, leading to more efficient power transmission and reduced heat generation.

Moisture Absorption and Its Effects on PCB-20mil TLY-3 Material

Moisture absorption is a crucial factor to consider in PCB materials, as it can lead to performance degradation and reliability issues. PCB-20mil TLY-3 Material exhibits low moisture absorption, ensuring long-term stability and preventing damage caused by moisture-related effects, such as delamination and electrical breakdown.

Exploring Dielectric Breakdown and Dielectric Strength for Enhanced Safety

Dielectric breakdown is a critical parameter that determines the maximum voltage a material can withstand before electrical breakdown occurs. PCB-20mil TLY-3 Material offers excellent dielectric strength, ensuring reliable operation even under high voltage conditions. This feature is essential in applications where safety is paramount, such as medical devices or power electronics.

Conductivity and Resistivity: Unraveling the Electrical Performance of PCB-20mil TLY-3 Material

The conductivity and resistivity of PCB-20mil TLY-3 Material play a vital role in circuit performance. With its excellent conductivity, it allows for efficient current flow and reduces power losses. Additionally, its low resistivity ensures minimal resistance and impedance, resulting in improved signal quality and reduced noise.

Flex Strength and Peel Strength: Ensuring Durability and Adhesion

PCB-20mil TLY-3 Material offers exceptional flex strength, allowing it to withstand bending and flexing without compromising its electrical performance or structural integrity. Its peel strength is also noteworthy, ensuring excellent adhesion between layers and preventing delamination, even under harsh operating conditions.

Thermal Conductivity: Managing Heat Dissipation in PCB-20mil TLY-3 Material

Efficient heat dissipation is crucial in electronic devices to prevent overheating and ensure long-term reliability. PCB-20mil TLY-3 Material exhibits excellent thermal conductivity, allowing for effective heat transfer, and reducing the risk of component failure due to excessive temperature.

Dimensional Stability and CTE: A Closer Look at Material Expansion and Contraction

PCB-20mil TLY-3 Material maintains dimensional stability even in challenging environments, thanks to its low coefficient of thermal expansion (CTE). This property minimizes material expansion and contraction, reducing the risk of circuit failure due to temperature fluctuations.

In conclusion, PCB-20mil TLY-3 Material is a game-changer in the electronics industry, offering unparalleled performance and reliability. Its exceptional properties, such as low DK and Df, moisture resistance, excellent dielectric strength, and thermal conductivity, make it a preferred choice for various applications. By harnessing the power of PCB-20mil TLY-3 Material, engineers can take their designs to new heights, ensuring optimal performance and durability.

Global Availability: We are proud to offer worldwide availability for the Taconic TLY-3 20mil PCB. No matter where you are located, we can deliver this high-quality PCB to your doorstep.

For any technical inquiries or further assistance, please feel free to contact Jane at sales20@bichengpcb.com. She will be more than happy to assist you and provide the necessary information you need.

Choose the Taconic TLY-3 20mil PCB for your high-frequency applications and experience unparalleled performance and reliability. Trust in our expertise as professional operators in the PCB industry, and let us help you bring your electronic designs to life!