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Home Taconic PCB Board Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold

Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold


The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.


  • Item NO.:

    BIC-036-v135.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Taconic TLY laminates are a type of low loss laminates. They are manufactured with very lightweight woven fiberglass and are more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix yields a more mechanically stable laminate that is suitable for high volume manufacturing. 

The dielectric constant is as low as 2.17-2.20 +/-0.02, and dissipation factor is as low as 0.0009.


TLY-3 PCB


Benefits:


Dimensionally stable

Lowest DF

Low moisture absorption

High copper peel strength

Uniform & consistent DK

Laser ablatable


Applications:


Automotive radar

Satellite/cellular communications

Power amplifiers

LNBs, LNAs, LNCs

Aerospace

Ka, E and W band applications



PCB Specifications:


PCB SIZE 100 x 90mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
TLY-3 0.762mm
copper ------- 18um(0.5 oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.4mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  TLY-3 0.762mm
Final foil external:  1oz
Final foil internal:  N/A
Final height of PCB:  0.8 mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold (31%)
Solder Mask Apply To:  NO
Solder Mask Color:  N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend Top Side
Colour of Component Legend white
Manufacturer Name or Logo:  Marked on the board in a conductor and legend FREE AREA
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Data Sheet of Taconic TLY Material

TLY TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650 2.5.5.5 2.2 2.2
Df at 10 GHz IPC-650 2.5.5.5 0.0009 0.0009
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19 0.21 0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038 -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031 -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 26 ppm/℃ 26
CTE(Y axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 15 ppm/℃ 15
CTE(Z axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 217 ppm/℃ 217
NASA Outgassing(% TML) 0.01 0.01
NASA Outgassing(% CVCM) 0.01 0.01
NASA Outgassing(% WVR) 0.00 0.00
UL-94 Flammability Rating UL-94 V-0 V-0



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