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Home Metal Core PCB Double Sided Aluminum PCB Dual Layer Circuit Board 2-Layer MCPCB

Double Sided Aluminum PCB Dual Layer Circuit Board 2-Layer MCPCB

This is a type of double sided aluminum based PCB for the application of switch regulator.

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  • Price Range:1 - 50/$99
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Double Sided Aluminum PCB Dual Layer Aluminum Circuit Board 2-Layer MCPCB

(Aluminum PCB’s are custom-made products, the picture and parameters shown are just for reference)

1.1 General Description:

This overall thickness is 2.0mm typical from copper to aluminum base, >2000V AC isolation, 1 W/MK thermal conductivity, 2oz copper each layer. The CCL plate is from Totking, ink of solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. 25 boards are packed for shipment.

Stackup 2-layer MCPCB

1.2 PCB Specifications:

PCB SIZE 500 x 150mm=10PCS
Number of Layers Double sided PCB, Metal core PCB
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 70um(2oz)
dielectric material 75um
copper ------- 70um(2oz)
dielectric material 75um
Aluminum backed 1.8mm 
Minimum Trace and Space: 5.98mil/6.18mil
Minimum / Maximum Holes: 0.3/2.2mm
Number of Different Holes: 5
Number of Drill Holes: 548
Number of Milled Slots: 11
Number of Internal Cutouts: 0
Impedance Control no
Thermal conductivity 2W / MK
Final foil external:  2oz
Final foil internal:  2oz
Final height of PCB:  2.1mm ±0.2
Surface Finish Hot Air Soldering Leveling(HASL),lead free, Sn>=2.54µm
Solder Mask Apply To:  Top, 12micon Minimum.
Solder Mask Color:  Super White for LED 
Solder Mask Type: LPSM
Side of Component Legend TOP
Colour of Component Legend Black
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA  via tented.
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

1.3 Applications of Aluminum PCB:

Power Hybrid IC

Audio Frequency Apparatus:

Input / Output Amplifier, Balanced Amplifier, Pre-amplifier, Audio amplifier

Power supply device: Switch regulator, DC/AC Converter, Switch regulator

Communication electronic equipment: High frequency generator, Filter appliance, Transmission circuit

Office automation equipment: Motor drive

Automotive: Electronic regulator, Igniter, Power controller

Computer: CPU board, Floppy disk drive, Power supply unit

Power module: Converter, Solid relay, Rectifier bridge

Lamp lighting: All kinds of energy-saving and gorgeous LED lights

Dural layer Aluminum PCB

1.4 Layer up:

The most common MCPCB construction consists of the following 3 layers:

1) A metal substrate, typically aluminum. In some applications, a copper substrate is more appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK) but more expensive.

2) Epoxy dielectric layer. This is the most important layer in the MCPCB construction as it affects the thermal performance, electrical breakdown strength, and, in some cases, the solder joint performance of the MCPCB system. The typical thermal conductivity of the dielectric layer on a MCPCB is 1W/MK. A higher value is better for good thermal performance. A thinner dielectric layer is better for thermal performance as well but can negatively impact the ability of the MCPCB to withstand a high potential test to meet minimum electrical safety standards as required in certain lighting markets. The typical dielectric thickness layer is 100μm.

3)Top copper layer. A thicker copper layer improves heat spreading into the PCB but may pose challenges for PCB manufacturers when fabricating narrow traces or spaces. A copper thickness of 1oz (35μm) or 2oz (70μm) is common.

1.5 Manufacturing Process of MCPCB:

The process can be described as a flow diagram as follows.

1.6 Metal Core PCB Capability 2022:

NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, OSP
4 Thickness of Surface plating HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5 Layer Count 1-2 Layers
6 Maximum of Board Size 23" x 46" (584mm×1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm×5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness 0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm)
10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20µm
16 Tolerance of PTH ±0.00295" (0.075mm) 
17 Tolerance of NPTH ±0.00197" (0.05mm) 
18 Deviation of Hole Position  ±0.00394" (0.10mm) 
19 Outline Tolerance Routing: ±0.00394" (0.1mm)
Punching: ±0.00591" (0.15mm) 
20 Angle of V-cut 30°, 45°, 60°
21 V-cut Size 0.1969" x 47.24" (5mm×1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle ±5º
24 V-CUT Verticality ≤0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13µm (0.013mm)
29 Insulation Resistance 1012ΩNormal
30 Peel-off Strength 2.2N/mm
31 Solder float 260℃3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist ≤0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)

1.7 More Displays of Double Sided Aluminum PCB:

 More Double Sided Aluminum PCB 2  More Double Sided Aluminum PCB (3) More Double Sided Aluminum PCB (4)




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