Rogers RO3006 50mil laminates are ceramic-filled PTFE composites that have been meticulously engineered to provide unparalleled electrical and mechanical stability. These advanced circuit materials offer a stable dielectric constant (Dk) across a wide temperature range, eliminating the abrupt change in Dk experienced by PTFE glass materials near room temperature.

Unveiling the Features

The RO3006 50mil PCB boasts an impressive array of features that make it a superior choice for demanding applications:

2.1 Rogers RO3006 Ceramic-Filled PTFE Composites

The RO3006 PCB leverages the exceptional properties of Rogers RO3006 ceramic-filled PTFE composites. These composites exhibit remarkable stability and consistency, ensuring reliable performance in a variety of environments.

2.2 Consistent Dielectric Constant

With a dielectric constant of 6.15±0.15 at 10 GHz and 23°C, the RO3006 PCB guarantees precise signal propagation and minimized signal loss. This stability across frequencies and temperatures is essential for high-frequency applications.

2.3 Low Dissipation Factor

Featuring a dissipation factor of 0.002 at 10 GHz and 23°C, the RO3006 PCB minimizes energy loss and distortion, resulting in enhanced signal integrity and improved overall system performance.

2.4 Exceptional Thermal Performance

The RO3006 PCB exhibits a high thermal tolerance, with a Td (decomposition temperature) exceeding 500°C. This exceptional thermal resistance ensures reliable operation even in demanding high-temperature environments.

2.5 Efficient Thermal Conductivity

With a thermal conductivity of 0.79 W/mK, the RO3006 PCB effectively dissipates heat, preventing hotspots and enabling efficient thermal management. This feature is crucial for applications requiring optimized thermal performance.

2.6 Minimal Moisture Absorption

The RO3006 PCB demonstrates a moisture absorption rate of only 0.02%, reducing the risk of performance degradation in humid conditions and ensuring long-term reliability.

2.7 Coefficient of Thermal Expansion (CTE)

The RO3006 PCB features a low in-plane expansion coefficient, closely matching that of copper. This compatibility minimizes thermal stress during assembly and operation, enhancing the reliability of surface-mounted assemblies and applications sensitive to temperature changes. Its excellent dimensional stability further contributes to improved performance and longevity.

Unveiling the Benefits

The Rogers 3006 PCB offers a wide range of benefits that address the specific needs of various applications:

3.1 Uniform Mechanical Properties

The RO3006 PCB's uniform mechanical properties make it an ideal choice for multi-layer board designs with different dielectric constants. This versatility enables the creation of complex circuitry with varying signal requirements, ensuring optimal performance and signal integrity throughout the PCB.

3.2 Compatibility with Hybrid Designs

With its compatibility for epoxy glass multi-layer board hybrid designs, the RO3006 PCB facilitates seamless integration into diverse circuit architectures. This characteristic expands its applicability and makes it a preferred choice for hybrid designs that require a balance of performance and flexibility.

3.3 Volume Manufacturing Process

The RO3006 PCB's volume manufacturing process ensures cost-effective production and affordable laminate pricing. This advantage makes it a compelling option for projects with large-scale manufacturing requirements without compromising on quality or performance.

PCB Stackup Details

The RO3006 PCB is a 2-layer rigid PCB designed with precision and reliability in mind. Its stackup configuration consists of the following layers:

Copper Layer 1: 35 μm

Rogers RO3006 Substrate: 50 mil (1.27 mm)

Copper Layer 2: 35 μm

PCB Construction Specifications

The RO3006 PCB provides exceptional performance while adhering to stringent construction guidelines. The following details highlight its construction specifications:

5.1 Compact and Efficient Dimensions

The board dimensions of the RO3006 PCB measure 55 mm x 47 mm, making it compact yet capable of accommodating a diverse range of components and circuitry.

5.2 Precise Trace/Space and Hole Size

The RO3006 PCB supports a minimum trace/space of 4/6 mils, enabling intricate and high-density routing. Additionally, it allows for a minimum hole size of 0.3 mm, facilitating the integration of various components and connectors.

5.3 Comprehensive Testing

Prior to shipment, each RO3006 PCB undergoes a meticulous 100% electrical test, ensuring optimal functionality and reliability. This stringent testing protocol guarantees that every board meets the highest quality standards.

5.4 Finishing Touches

The finished board thickness of the RO3006 PCB measures 1.4 mm, providing a sturdy and durable foundation for your circuitry. The outer layers feature a 1 oz (1.4 mils) copper weight, ensuring excellent conductivity and signal integrity. Via plating thickness is 20 μm, maximizing connectivity and reducing signal loss. The surface finish comprises immersion gold, providing exceptional solderabilityand corrosion resistance. The top silkscreen is printed in white, allowing for clear component identification and ease of assembly. The bottom silkscreen is not included, providing a clean and unobstructed surface for optimized performance. The absence of top and bottom solder masks further enables precise soldering and component placement.

PCB Statistics

To provide a comprehensive overview, here are the statistics of the RO3006 PCB:

Components: 16

Total Pads: 46

Thru Hole Pads: 29

Top SMT Pads: 17

Bottom SMT Pads: 0

Vias: 41

Nets: 3

These statistics demonstrate the versatility and flexibility of the RO3006 PCB, accommodating a wide range of components and circuit configurations to meet diverse application requirements.

Artwork and Standard Compliance

The Rogers RO3006 PCB accepts Gerber RS-274-X artwork, ensuring compatibility with industry-standard design software and facilitating seamless integration into existing design workflows. It adheres to the IPC-Class-2 standard, guaranteeing high-quality manufacturing and reliable performance.

Worldwide Availability

The Rogers RO3006 2-Layer PCB is available worldwide, enabling customers from various regions to benefit from its exceptional features and performance. With global accessibility, you can confidently incorporate the RO3006 PCB into your projects, knowing that it is readily accessible and supported.

Typical Applications

The RO3006 PCB unlocks endless possibilities across a wide range of applications. Some typical use cases include:

1)Automotive radar applications:

The RO3006 PCB's stability and reliable signal propagation make it ideal for automotive radar systems, enabling precise detection and improved safety.

2)Global positioning satellite antennas:

With its exceptional dielectric properties and thermal stability, the RO3006 PCB ensures accurate signal reception and transmission, enhancing the performance of GPS antennas.

3)Cellular telecommunications systems - power amplifiers and antennas:

The RO3006 PCB's high-frequency capabilities and thermal management properties make it well-suited for power amplifiers and antennas in cellular communication systems, ensuring efficient signal transmission and reception.

4)Patch antenna for wireless communications:

The RO3006 PCB's uniform mechanical properties and thermal stability enable the creation of high-performance patch antennas, enhancing wireless communication capabilities.

5)Direct broadcast satellites:

Leveraging the RO3006 PCB's low dissipation factor and outstanding electrical stability, direct broadcast satellite systems achieve optimal signal quality and reliability.

6)Datalink on cable systems:

The RO3006 PCB's high-speed signal transmission capabilities and minimal signal loss make it an excellent choice for datalink applications in cable systems, ensuring reliable and efficient data transfer.

7)Remote meter readers:

With its stable dielectric constant and exceptional thermal performance, the RO3006 PCB provides reliable performance for remote meter reading systems, enabling accurate data collection and transmission.

8)Power backplanes:

The RO3006 PCB's mechanical stability and compatibility with hybrid designs make it an efficient solution for power backplanes, ensuring reliable power distribution and performance.

Conclusion

In conclusion, Rogers RO3006 High Frequency PCB combines advanced features, exceptional performance, and global availability to revolutionize circuit materials. Its ceramic-filled PTFE composites, uniform mechanical properties, thermal stability, and cost-effective production process make it the ideal choice for a wide range of applications. By leveraging the Rogers RO3006 Microwave PCB, you can unlock the full potential of your designs and achieve unparalleled performance and reliability.