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Home High Frequency PCB 2 Layer Rogers RO3006 High Frequency Printed Circuit Board DK6.15 DF 0.002 Microwave Gold PCB

2 Layer Rogers RO3006 High Frequency Printed Circuit Board DK6.15 DF 0.002 Microwave Gold PCB

Rogers RO3006 series high frequency circuit materials are PTFE composite materials with ceramic fillers.

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  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
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Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3006 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications.The application of this material gives the RO3006 series dielectric constant extremely high temperature stability. The thermal stability coefficient (Z direction) of its dielectric constant can reach -3ppm/°C when operating at 10GHz and the temperature varies from -50°C to + 150°C. The permittivity of PTFE glass material will not change by step at room temperature. At the same time, RO3005 also maintains a high dielectric constant frequency stability, can be used in a wide frequency range. The RO3006 laminate also shows a very low dielectric loss of 0.0013 at 10GHz.

Also thanks to the application of this composite material, the thermal expansion coefficient of RO3006 PTFE ceramic material in the X and Y directions is 17ppm/C, which is similar to that of copper, which can make the material shrinkage due to etching (etching after baking) typical value is less than 0.5mi/inch, showing excellent dimensional stability. Thermal expansion coefficient of 25ppm/°C in the 7 direction ensures the stability of electroplated through-holes even in severe temperature conditions.

RO3000 family also includes RO3006 PTFE ceramics, RO3010 PTFE ceramics and RO3035 PTFE ceramics, respectively have different dielectric constant (range of 3.0~10.2), but has unified - mechanical stability, It can save the problem of warping or reliability when designing multilayer circuits because one layer uses materials with different permittivity.

Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

RO3006 10mil PCB

PCB Specifications:

PCB SIZE 152 x 152mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3006 0.254mm
copper ------- 18um(0.5 oz) + plate  BOT Layer
Minimum Trace and Space: 14 mil / 14 mil
Minimum / Maximum Holes: 0.4 mm / 4.0 mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
Glass Epoxy:  RO3006 0.254mm
Final foil external:  1 oz
Final foil internal:  N/A
Final height of PCB:  0.3 mm ±0.1mm
Surface Finish Immersion Gold
Solder Mask Apply To:  N/A
Solder Mask Color:  N/A
Solder Mask Type: N/A
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

RO3006 PCB 25mil Sensitive to temperature change

Data Sheet of Rogers 3006 (RO3006):

RO3006 Typical Value
Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z 10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z 10 GHz/23℃ IPC-TM-650
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650
Dimensional Stability 0.27
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105 MΩ.cm COND A IPC
Surface Resistivity 105 COND A IPC
Tensile Modulus 1498
MPa 23℃ ASTM D 638
Moisture Absorption 0.02 % D48/50 IPC-TM-650
Specific Heat 0.86 j/g/k Calculated
Thermal Conductivity 0.79 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
ppm/℃ 23℃/50% RH IPC-TM-650
Td 500 ℃TGA ASTM D 3850
Density 2.6 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes




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