Rogers RO3006 High Frequency Printed Circuit
Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Rogers RO3006 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and
RF applications.The
application of this material gives the RO3006 series dielectric constant
extremely high temperature stability. The thermal stability coefficient (Z
direction) of its dielectric constant can reach -3ppm/°C when operating at
10GHz and the temperature varies from -50°C to + 150°C. The permittivity of
PTFE glass material will not change by step at room temperature. At the same
time, RO3005 also maintains a high dielectric constant frequency stability, can
be used in a wide frequency range. The RO3006 laminate also shows a very low
dielectric loss of 0.0013 at 10GHz.
Also thanks to the application of this
composite material, the thermal expansion coefficient of RO3006 PTFE ceramic
material in the X and Y directions is 17ppm/C, which is similar to that of
copper, which can make the material shrinkage due to etching (etching after
baking) typical value is less than 0.5mi/inch, showing excellent dimensional
stability. Thermal expansion coefficient of 25ppm/°C in the 7 direction ensures
the stability of electroplated through-holes even in severe temperature
conditions.
RO3000 family also includes RO3006 PTFE
ceramics, RO3010 PTFE ceramics and RO3035 PTFE ceramics, respectively have
different dielectric constant (range of 3.0~10.2), but has unified - mechanical
stability, It can save the problem of warping or reliability when designing
multilayer circuits because one layer uses materials with different
permittivity.
Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers
PCB Specifications:
|
PCB SIZE
|
152 x
152mm=1PCS
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
YES
|
|
LAYER STACKUP
|
copper
------- 18um(0.5 oz)+plate TOP layer
|
|
RO3006 0.254mm
|
|
copper ------- 18um(0.5 oz) + plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
14
mil / 14 mil
|
|
Minimum
/ Maximum Holes:
|
0.4
mm / 4.0 mm
|
|
Number
of Different Holes:
|
1
|
|
Number
of Drill Holes:
|
1
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
0
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RO3006
0.254mm
|
|
Final
foil external:
|
1
oz
|
|
Final
foil internal:
|
N/A
|
|
Final
height of PCB:
|
0.3
mm ±0.1mm
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion Gold
|
|
Solder
Mask Apply To:
|
N/A
|
|
Solder
Mask Color:
|
N/A
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
N/A
|
|
Colour
of Component Legend
|
N/A
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
Plated
through hole(PTH), minimum size 0.4mm.
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Data Sheet of Rogers 3006 (RO3006):
|
RO3006
Typical Value
|
|
Property
|
RO3006
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
6.15±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric
Constant,εDesign
|
6.5
|
Z
|
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation
Factor,tanδ
|
0.002
|
Z
|
|
10
GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Coefficient of ε
|
-262
|
Z
|
ppm/℃
|
10 GHz -50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Dimensional
Stability
|
0.27
0.15
|
X
Y
|
mm/m
|
COND A
|
IPC-TM-650 2.2.4
|
|
Volume
Resistivity
|
105
|
|
MΩ.cm
|
COND A
|
IPC 2.5.17.1
|
|
Surface
Resistivity
|
105
|
|
MΩ
|
COND A
|
IPC 2.5.17.1
|
|
Tensile
Modulus
|
1498
1293
|
X
Y
|
MPa
|
23℃
|
ASTM D 638
|
|
Moisture
Absorption
|
0.02
|
|
%
|
D48/50
|
IPC-TM-650 2.6.2.1
|
|
Specific Heat
|
0.86
|
|
j/g/k
|
|
Calculated
|
|
Thermal
Conductivity
|
0.79
|
|
W/M/K
|
50℃
|
ASTM D 5470
|
Coefficient of Thermal Expansion
(-55 to 288℃)
|
17
17
24
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650 2.4.4.1
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM D 3850
|
|
Density
|
2.6
|
|
gm/cm3
|
23℃
|
ASTM D 792
|
|
Copper Peel
Stength
|
7.1
|
|
Ib/in.
|
1oz,EDC After Solder
Float
|
IPC-TM 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-free
Process Compatible
|
Yes
|
|
|
|
|
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