Rogers 3006 High Frequency PCB RO3006 RF PCB 10mil,
25mil and 50mil Thick Coating Immersion Gold, Tin, Silver and HASL
(PCB's are custom-made products, the picture
and parameters shown are just for reference)
RO3006 high frequency circuit laminates are
ceramic-filled PTFE composites intended for using in commercial microwave and
RF applications. Its obvious characteristic is that the electrical performance
is exceptional and the mechanical property is stable and consistent. This
allows our designer to develop multi-layer board without encountering warpage
or reliability problems.
More features
and applications are as follows:
1.excellent mechanical properties versus
temperature, it’s reliable for stripline and multi-layer board constructions.
2.uniform mechanical properties, it’s suitable
for use with epoxy glass multi-layer board hybrid designs.
3.low in-plane expansion coefficient matches to
copper, it allows for more reliable surface mounted assemblies; ideal for
applications sensitive to temperature change and exhibit excellent dimensional
stability.
Our PCB Capability
(RO3006)
|
PCB Material:
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Ceramic-filled
PTFE composite
|
|
Designation:
|
RO3006
|
|
Dielectric
constant:
|
6.15 ±0.3 (process)
|
|
6.5 (design)
|
|
Layer count:
|
2 Layer,
Multilayer, Hybrid PCB
|
|
Copper weight:
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0.5oz (17 µm),
1oz (35µm), 2oz (70µm)
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|
PCB thickness:
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10mil (0.254mm),
25mil (0.635mm)
|
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50mil (1.27mm)
|
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PCB size:
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≤400mm X 500mm
|
|
Solder mask:
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Green, Black,
Blue, Yellow, Red etc.
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|
Surface finish:
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Bare copper,
HASL, ENIG, OSP etc..
|
|
|
|
Double sided RO3006 high
frequency PCBs are available, and also with multi-layer and hybrid
construction, 0.5oz to 2oz finished copper, 0.3mm to 1.3mm thick, maximum size
400mm by 500mm, surface finish with bare copper, hot air leveling, immersion
gold etc.
Typical
applications
1. Automotive
radar applications
2. GPS Antennas
3. Power
amplifiers and antennas
4. Patch
antennas for wireless communications
5. Direct broadcast
satellite
The basic colour of RO3006 PCB is white.
The manufacturing process of RO3006 high
frequency PCB is similar to standard PTFE PCB, so it’s suitable for volume
manufacturing process winning advantageous market.
Appendix: Data Sheet RO3006
|
RO3006
Typical Value
|
|
Property
|
RO3006
|
Direction
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Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
6.15±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric
Constant,εDesign
|
6.5
|
Z
|
|
8GHz
to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation
Factor,tanδ
|
0.002
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Coefficient of ε
|
-262
|
Z
|
ppm/℃
|
10 GHz -50℃to
150℃
|
IPC-TM-650 2.5.5.5
|
|
Dimensional
Stability
|
0.27
0.15
|
X
Y
|
mm/m
|
COND
A
|
IPC-TM-650 2.2.4
|
|
Volume
Resistivity
|
105
|
|
MΩ.cm
|
COND
A
|
IPC 2.5.17.1
|
|
Surface
Resistivity
|
105
|
|
MΩ
|
COND
A
|
IPC 2.5.17.1
|
|
Tensile
Modulus
|
1498
1293
|
X
Y
|
MPa
|
23℃
|
ASTM D 638
|
|
Moisture
Absorption
|
0.02
|
|
%
|
D48/50
|
IPC-TM-650 2.6.2.1
|
|
Specific Heat
|
0.86
|
|
j/g/k
|
|
Calculated
|
|
Thermal
Conductivity
|
0.79
|
|
W/M/K
|
50℃
|
ASTM D 5470
|
Coefficient of Thermal Expansion
(-55 to 288℃)
|
17
17
24
|
X
Y
Z
|
ppm/℃
|
23℃/50%
RH
|
IPC-TM-650 2.4.4.1
|
|
Td
|
500
|
|
℃TGA
|
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ASTM D 3850
|
|
Density
|
2.6
|
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gm/cm3
|
23℃
|
ASTM D 792
|
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Copper Peel
Stength
|
7.1
|
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Ib/in.
|
1oz,EDC
After Solder Float
|
IPC-TM 2.4.8
|
|
Flammability
|
V-0
|
|
|
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UL 94
|
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Lead-free
Process Compatible
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Yes
|
|
|
|
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