Exceptional Material and Construction:

At the heart of our PCB-20mil RO4730G3 lies the Rogers RO4730G3 Hydrocarbon/Ceramic/Woven Glass UL 94 V-0 Antenna Grade Laminates. This material ensures superior performance, with a process DK of 3.0 at 10GHz/23°C, ensuring optimal signal integrity. With a low dissipation factor of 0.0028 at 10GHz/23°C, this PCB minimizes signal loss, allowing for precise and reliable data transmission. Furthermore, the impressive Tg (>280°C) and Td (411°C) ratings make it suitable for high-temperature applications, ensuring long-lasting durability.

Precise Stackup and Construction Details:

The RO4730G3 boasts a 2-layer rigid PCB stackup, featuring a 35μm copper layer on both sides of the 0.508mm RO4730G3 substrate. This construction ensures excellent conductivity and structural integrity. The board dimensions of 136.61mm x 96.7mm offer versatility for various applications, with a tight tolerance of +/- 0.15mm for precise design requirements.

Advanced Design Specifications:

We understand the importance of design flexibility, which is why our RO4730G3 PCB comes with impressive design specifications. With a minimum trace/space of 6/4 mils and a minimum hole size of 0.5mm, this PCB caters to intricate designs and complex circuitry. The finished board thickness of 0.63mm, 1oz (1.4 mils) outer layer copper weight, and 20μm via plating thickness ensure optimal performance and longevity. The immersion gold surface finish, paired with green solder masks, provides reliable protection against oxidation and easy soldering.

Robust Construction and Testing:

We prioritize quality and reliability in our PCBs. Each RO4730G3 undergoes thorough testing, including a 100% electrical test prior to shipment, ensuring that you receive a fully functional and reliable product. The construction details, including the resin-filled and capped 0.5mm vias as per IPC 4761 Type VII, guarantee enhanced structural integrity and improved electrical performance.

Compliance and Availability:

PCB-20mil RO4730G3 adheres to the IPC-Class-2 industry standards, ensuring superior quality and performance. We are proud to offer worldwide availability, allowing you to access this exceptional PCB no matter where you are located.

Technical Support:

We understand that technical questions may arise during your design process. For any inquiries or assistance, please feel free to reach out to Jane at sales20@bichengpcb.com. Jane is our expert sales representative who will provide you with the necessary technical guidance and support.

PCB-20mil RO4730G3 Material is a cutting-edge solution that has sparked a revolution in circuit board technology. With its exceptional properties and advanced characteristics, it has become a game-changer in the industry. This material offers a wide range of benefits, including enhanced signal integrity, improved thermal management, and reliable performance in extreme conditions.

Understanding the Dielectric Constant and Dissipation Factor of RO4730G3PCB

The Dielectric Constant, also known as ε, determines the material's ability to store electrical energy. PCB-20mil RO4730G3 Material boasts a Dielectric Constant of 3.0±0.5, which ensures efficient signal transmission and reduces signal loss. Additionally, the Dissipation Factor, or tanδ, measures the material's ability to dissipate electrical energy as heat. With a low Dissipation Factor of 0.0028, PCB-20mil RO4730G3 Material minimizes energy loss and ensures optimal performance.

Thermal Coefficient of ε: A Key Factor in Material Selection

The Thermal Coefficient of ε is a crucial factor when selecting a material for circuit board manufacturing. PCB-20mil RO4730G3 Material exhibits a Thermal Coefficient of ε of +34 ppm/℃, meaning it can withstand a wide temperature range from -50℃ to 150℃ without significant changes in its Dielectric Constant. This property ensures consistent performance under varying thermal conditions.

Dimensional Stability: Ensuring Reliable Performance in Extreme Conditions

Reliability is a primary concern in circuit board manufacturing. 20mil RO4730G3 substrate excels in dimensional stability, with a maximum change of less than 0.4 mm/m after etching and exposure to elevated temperatures. This exceptional stability ensures consistent performance, even in extreme environmental conditions.

Electrical Properties: Volume Resistivity and Surface Resistivity

Electrical properties play a vital role in circuit board performance. PCB-20mil RO4730G3 Material exhibits a Volume Resistivity of 9x107 MΩ.cm and a Surface Resistivity of 7.2x105 MΩ. These properties enable efficient electrical insulation, preventing signal interference and ensuring optimal circuit board functionality.

PIM Performance of PCB-20mil RO4730G3 Material

Passive Intermodulation (PIM) is a critical consideration in high-frequency applications. RO4730G3 PCB boasts an impressive PIM performance of -165 dBc, making it ideal for applications that require minimal signal distortion and interference.

Flexural Strength: Durability for Robust Applications

Robustness is a key requirement in many circuit board applications. PCB-20mil RO4730G3 Material exhibits a Flexural Strength of 181 Mpa (26.3 kpsi) in the MD direction and 139 Mpa (20.2 kpsi) in the CMD direction, ensuring durability and reliability even in demanding operating conditions.

Moisture Absorption and Thermal Conductivity: Managing Environmental Factors

Environmental factors such as moisture absorption and thermal conductivity can significantly impact circuit board performance. PCB-20mil RO4730G3 Material has a moisture absorption rate of 0.093%, ensuring minimal moisture-induced damage. Additionally, its thermal conductivity of 0.45 W/mK enables efficient heat dissipation, preventing overheating and ensuring optimal circuit board functionality.

Coefficient of Thermal Expansion: Addressing Thermal Stress

Thermal stress can cause material deformation and affect circuit board performance. RO4730G3 PCB circuit board has a Coefficient of Thermal Expansion of 15.9 X, 14.4 Y, and 35.2 Z ppm/℃, enabling it to withstand temperature variations from -50℃ to 288℃ without significant changes in its dimensions. This property ensures reliable performance and longevity in varying thermal conditions.

Additional Features: Tg, Td, Density, Copper Peel Strength, Flammability, and Lead-free Compatibility

Rogers RO4730G3 PCB Material offers several additional features that further enhance its performance. It has a Tg (glass transition temperature) of over 280℃, ensuring stability even at high temperatures. With a Td (decomposition temperature) of 411℃, it demonstrates excellent thermal stability. PCB-20mil RO4730G3 Material has a density of 1.58 gm/cm3, providing a lightweight yet robust solution. It also exhibits a high Copper Peel Strength of 4.1 pli, ensuring strong adhesion in copper-clad laminates. Furthermore, it is rated V-0 for flammability and is compatible with lead-free processes, meeting modern industry requirements.

Conclusion:

When it comes to high-performance PCBs, the RO4730G3 Rogers PCB boardstands out as a reliable and versatile choice. With exceptional material properties, precise construction, and advanced design specifications, this PCB ensures optimal signal integrity, durability, and performance. Experience the difference in your designs with RO4730G3. Order now and elevate your electronics to new levels of excellence.