In the world of PCBs, finding a material that combines excellent thermal management, low loss tangent, and stable dielectric properties can be a challenge. However, the search ends with RF-35TC laminates. These PTFE-based, ceramic-filled fiberglass substrates offer "best in class" low dissipation factor with high thermal conductivity, making them the ideal choice for high-power RF applications. In this blog article, we will delve deep into the features, benefits, and applications of RF-35TC PCBs, unveiling why they are the ultimate solution for high-power RF designs.

RF-35TC Introduction:

RF-35TC offers exceptional performance in high-power applications where thermal management and low loss tangent are critical. As a PTFE-based, ceramic-filled fiberglass substrate, RF-35TC ensures minimal heat dissipation and maintains stable dielectric properties over time. Unlike its synthetic rubber (hydrocarbon) competitors, RF-35TC does not oxidize, yellow, or exhibit upward drift in dielectric constant and dissipation factor.

Features:

Taconic RF-35TC PCB boasts an impressive list of features that make it an ideal choice for demanding high-power RF applications. Some of its key features include:

1.Thermally Conductive Low Loss Laminate:

RF-35TC offers excellent thermal management capabilities, allowing for efficient heat dissipation in high-power applications. With a thermal conductivity of 0.87 W/m/K for 0.5oz copper cladded and 0.92W/m/K for 1oz copper cladded, RF-35TC ensures minimal heat accumulation on the PCB.

2.Stable Dielectric Constant and Dissipation Factor:

With a dielectric constant (DK) of 3.5 +/- 0.05 at 10 GHz/23°C and a dissipation factor of 0.002 at the same frequency and temperature, RF-35TC PCBguarantees tight control over electrical performance. This stability enables precise design and reliable signal transmission.

3.Dimensional Stability:

RF-35TC exhibits a low coefficient of thermal expansion (CTE) in the X-axis of 11 ppm/°C, Y-axis of 13 ppm/°C, and Z-axis of 34 ppm/°C. This ensures the PCB's dimensional stability across a wide temperature range, preventing warping or distortion that could affect performance.

4.High Temperature Resistance:

With a Td of 5% weight loss at 436°C, RF-35TC can withstand high temperatures without compromising its dielectric properties. This feature makes it suitable for applications that generate significant heat, such as power amplifiers.

5.Low Moisture Absorption:

RF-35TC has a low moisture absorption rate of 0.05%, ensuring that moisture does not impact the electrical performance or reliability of the PCB. This characteristic is particularly important in humid or harsh environments.

Benefits:

1."Best in Class" Loss Tangent:

RF-35TC offers an exceptional loss tangent, making it highly efficient in minimizing signal loss and maximizing signal integrity. This benefit is crucial in high-power RF applications where even small losses can have a significant impact.

2.Exceptional Thermal Management:

RF-35TC's high thermal conductivity ensures efficient heat dissipation, reducing the risk of overheating and maintaining the performance and reliability of high-power RF circuits. This benefit is especially valuable in applications where power densities are high.

3.Dk Stability Across a Broad Temperature Range:

The stable dielectric constant of RF-35TC guarantees consistent electrical performance over a wide temperature range. This stability is crucial in ensuring predictable and reliable signal transmission in high-power RF applications.

4.Enhanced Antenna Gains/Efficiencies:

RF-35TC's low loss characteristics and stable dielectric properties contribute to enhanced antenna gains and efficiencies. This advantage is particularly valuable in applications where maximizing signal strength and range are paramount.

5.Excellent Adhesion to Very Low Profile Copper:

RF-35TC exhibits excellent adhesion to very low-profile copper, ensuring optimal electrical contact between the substrate and the conductive traces. This benefit improves signal transmission and reduces the risk of signal degradation.

PCB Construction Details:

RF-35TC high frequency PCB is commonly used in 2-layer rigid PCBs. It features a copper layer on both sides, with a core thickness of 0.508mm (20mil). The finished board thickness is 0.6mm, with a 1oz (1.4 mils) outer layer copper weight. The PCBs are finished with immersion gold for optimal performance.

Typical Applications:

RF-35TC 20mil substrate PCB finds its applications in various industries where high-power RF operation is crucial. Some of the typical applications include:

1.Filters, Couplers & Power Amplifiers:

RF-35TC enables the design and assembly of high-performance filters, couplers, and power amplifiers used in wireless communication systems. Its low loss and excellent thermal management capabilities ensure efficient signal transmission and power handling.

2.Antennas:

RF-35TC is ideal for manufacturing antennas, offering high-power capabilities and enhanced signal gains and efficiencies. Its stable dielectric properties ensure reliable and consistent antenna performance.

3.Satellites:

In satellite communication systems, RF-35TC provides the necessary high-power RF capabilities and temperature stability required for reliable signal transmission over long distances. Its low loss tangent and thermal management capabilities make it suitable for these critical applications.

Conclusion:

RF-35TC Taconic laminates offer the ultimate solution for high-power RF applications. With their exceptional thermal management capabilities, low loss tangent, and stable dielectric properties, they are the go-to choice for demanding designs such as power amplifiers, antennas, and satellite communication systems. By choosing RF-35TC 20mil PCB, designers can ensure reliable and efficient performance in their high-power RF designs, contributing to the advancement of wireless communication technologies.