High
Frequency PCB Built on Taconic RF-35TC DK3.5 With 60mil Thick and Immersion
Gold for Power Amplifier
(PCB's are custom-made products, the picture
and parameters shown are just for reference)
RF-35TC is a PTFE based, ceramic filled
fiberglass high frequency material from Taconic company.
Taconic RF-35TC PCB is made of high-quality
materials and can withstand a wide range of temperatures. It is suitable for
both outdoor and indoor use, and its design is tough. It is thus an ideal
component of your projects. Its main material is epoxy glass, which has a high
thermal shock resistance and flexibility. As a result, the Taconic RF-35TC PCB
can withstand both extreme heat and cold. It will continue to perform admirably
over time.
PCB Specifications
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Layer count:
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Double sided
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Base material:
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RF-35TC DK 3.5
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Dimension:
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105 x 87mm
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Finished thickness
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1.6mm ±10%
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Finished Copper
weight:
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2 oz
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SMOBC:
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No
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Surface finish:
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Immersion Gold
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Double sided, RF-35TC substrate, DK at 3.5;
105mm long by 87mm wide; finished PCB thickness at 1.6mm, finished copper
weight at 2oz; No solder mask and silkscreen; surface finish is Immersion gold.
Depending on how you intend to use the Taconic
RF-35TC material, it has a variety of specifications. Its high-quality brass
connection blocks allow it to be used in a variety of applications. At the same
time, its copper ground plane can help improve your installation's overall
performance.
This is the stack up drawing.
Top layer and bottom layer are 2oz finished
copper, dielectric material RF-35TC is in the middle at 1.524mm thick, DK at
3.5
The basic colour of RF-35TC PCB is brown and
grey. Its main applications are power amplifiers, couplers and filters. In
addition, It’s also widely used in antennas, satellite equipment and so on.
Our PCB Capability (RF-35TC)
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PCB Material:
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PTFE based
ceramic filled fiberglass substrate
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|
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Designator:
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RF-35TC
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|
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Dielectric
constant @ 10GHz:
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3.50
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|
|
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Layer count:
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2 Layer,
Multilayer, Hybrid type
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|
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Copper weight:
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0.5oz, 1oz, 2oz
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PCB thickness:
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0.3mm, 0.6mm,
0.8mm, 1.6mm
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|
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(10mil, 20mil,
30mil, 60mil substrate)
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|
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Solder mask:
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Green, Red, Black,
White, Blue etc.
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|
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PCB size:
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≤400mm X 500mm
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|
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Surface finish:
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Bare copper,
HASL, ENIG, Immersion tin etc.
|
|
|
|
|
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We can provide you with double sided board,
multilayer board and hybrid board. Thickness ranges from 0.3mm to 1.6mm,
maximum size at 400 mm by 500mm; there’re surface finishes of bare copper, hot
air level, immersion gold etc.
RF-35TC offers superior heat dissipation
performance, so it's a type of thermally conductive low loss laminate. It's
best suited for high power applications. Heat dissipates away from both
transmission line on PCB and surface mount components such as capacitor etc.
Appendix: Data sheet RF-35TC
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RT/duroid
6035HTC Typical Value
|
|
Property
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RT/duorid 6035HTC
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Direction
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Units
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Condition
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Test Method
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Dielectric Constant,εProcess
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3.50±0.05
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Z
|
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10 GHz/23℃
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IPC-TM-650
2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
3.6
|
Z
|
|
8 GHz - 40
GHz
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Differential Phase Length Method
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Dissipation
Factor
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0.0013
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Z
|
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10 GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal Coefficient of ε
|
-66
|
Z
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ppm/℃
|
-50℃to 150℃
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mod IPC-TM-650, 2.5.5.5
|
|
Volume Resistivity
|
108
|
|
MΩ.cm
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A
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IPC-TM-650, 2.5.17.1
|
|
Surface Resistivity
|
108
|
|
MΩ
|
A
|
IPC-TM-650, 2.5.17.1
|
|
Dimensional Stability
|
-0.11 -0.08
|
CMD MD
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mm/m
(mils/inch)
|
0.030"
1oz EDC foil Thickness after etch '+E4/105
|
IPC-TM-650 2.4.39A
|
|
Tensile Modulus
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329 244
|
MD CMD
|
kpsi
|
40 hrs @23℃/50RH
|
ASTM D638
|
|
Moisure Absorption
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0.06
|
|
%
|
D24/23
|
IPC-TM-650 2.6.2.1 ASTM D570
|
Coefficient of Thermal Expansion (-50℃to 288℃)
|
19 19 39
|
X Y Z
|
ppm/℃
|
23℃/ 50% RH
|
IPC-TM-650 2.4.41
|
|
Thermal Conductivity
|
1.44
|
|
W/m/k
|
80℃
|
ASTM C518
|
|
Density
|
2.2
|
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gm/cm3
|
23℃
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ASTM D792
|
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Copper Peel Stength
|
7.9
|
|
pli
|
20 sec. @288℃
|
IPC-TM-650 2.4.8
|
|
Flammability
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V-0
|
|
|
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UL 94
|
|
Lead-Free Process Compatible
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Yes
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|
|
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