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20 mil RO4003C PCB
20 mil RO4003C PCB

RO3003 Hybrid PCB: Unlocking the Potential for High-Frequency Applications

  • December 13. 2023

When it comes to finding a reliable and high-performance printed circuit board (PCB) for your next project, the newly launched RO3003 Hybrid PCB is the perfect solution. Designed with advanced materials and superior construction, this 8-layer blind via PCB is specifically tailored for a wide range of high-frequency applications.

PCB Substrates: Harnessing the Power of RO3003

The RO3003 Hybrid PCB combines the benefits of Rogers RO3003 ceramic-filled PTFE composites and S1000-2M High Tg170 FR-4. With a dielectric constant of 3.0 +/- 0.04 at 10 GHz 23°C and a dissipation factor of 0.001 at the same frequency and temperature, this PCB offers exceptional electrical performance. Moreover, its low X, Y, and Z-axis coefficients of thermal expansion (CTE) of 17, 16, and 25 ppm/°C respectively, ensure excellent mechanical stability even in challenging environments. Operating flawlessly between -40℃ to +85℃, this PCB is designed to withstand extreme temperatures.

Rogers 3003 Hybrid PCB

Features: Unleashing the True Potential of High-Frequency Applications

The RO3003 Hybrid PCB boasts several features that make it an ideal choice for high-frequency applications:

Low Dk Loss:The low Dk loss of this PCB allows for its use in applications up to 77 GHz, enabling seamless signal transmission without loss or degradation.

Excellent Mechanical Properties: This Hybrid RF Circuit Boards offers outstanding mechanical properties across a wide temperature range. Whether it's a stripline or multi-layer board construction, you can rely on the stability and durability of this PCB.

Ideal for Multi-Layer Board Designs: With its 8-layer stackup, this PCB provides ample space for complex multi-layer designs. It offers the perfect canvas for your innovative ideas.

Compatibility with Epoxy Glass Multi-Layer Board Hybrid Designs: The RO3003 Hybrid PCB seamlessly integrates with epoxy glass multi-layer board hybrid designs. Enjoy the versatility and flexibility to bring your projects to life.

Stackup: Building a Solid Foundation

The stackup of the Hybrid 8-layer PCB is meticulously designed for optimal performance:

Copper_layer_1 - 18 μm

Rogers 3003 Core - 0.127 mm

Copper_layer_2 - 18 μm

Prepreg FastRise 28 - 0.11 mm

Copper_layer_3 - 18 μm

S1000-2M FR-4 - 0.66 mm

Copper_layer_4 - 18 μm

Prepreg - 0.11 mm

Copper_layer_5 - 18 μm

S1000-2M FR-4 - 0.36 mm

Copper_layer_6 - 35 μm

Prepreg - 0.11 mm

Copper_layer_7 - 18 μm

S1000-2M FR-4 - 0.36 mm

Copper_layer_8 - 35 μm

Construction Details: Setting New Standards of Excellence

The construction details of theRogersRO3003 Hybrid PCB highlight our commitment to quality:

Board Dimensions: With dimensions of 122.3mm x 94.4 mm, with a tolerance of +/- 0.15mm, this PCB offers ample space for your designs.

Minimum Trace/Space: The minimum trace/space of 4/4 mils ensures accurate and precise signal routing.

Minimum Hole Size: With a minimum hole size of 0.35mm, this PCB can accommodate a wide range of components.

Blind Vias: The PCB features blind vias from L7 to L8, enhancing its flexibility for complex designs.

Finished Board Thickness: The finished board thickness is 2.2mm, providing stability and durability.

Finished Cu Weight: The inner layers have a finished Cu weight of 0.5 oz (0.7 mils), while the outer layers have a finished Cu weight of 1oz (1.4 mils). This ensures optimal conductivity and performance.

Via Plating Thickness: The via plating thickness is 20μm, guaranteeing reliable electrical connections.

Surface Finish: The RO3003 Hybrid PCB is finished with immersion gold, ensuring excellent conductivity and corrosion resistance.

Silkscreen: The top and bottom silkscreens are both white, enhancing visibility and aesthetics. Silkscreen is forbidden on solder pads, ensuring accurate soldering.

100% Electrical Test: Each PCB undergoes a 100% electrical test, guaranteeing reliability and performance.

Impedance Control: The top layer features an 11mil track with a 50-ohm single-end impedance, while the differential impedance is maintained at 100 ohms with a 7mil/7mil track/gap.

PCB Statistics: Unlocking the Potential

The RO3003 Hybrid PCB comes packed with impressive statistics:

Components: This PCB can accommodate up to 81 components, providing ample room for your project's needs.

Total Pads: With a total of 143 pads, you can easily connect and interface various components.

Thru Hole Pads: The PCB offers 61 thru-hole pads, ensuring secure connections.

Top and Bottom SMT Pads: The top side accommodates 52 SMT pads, while the bottom side features 30 SMT pads, allowing for efficient surface mount assembly.

Vias: With 247 vias available, you can create complex connections and optimize signal flow.

Nets: The PCB supports 26 nets, ensuring efficient routing and connectivity.

Artwork Supplied: Seamless Integration

To ensure a smooth integration process, the RO3003 Hybrid PCB's artwork is supplied in Gerber RS-274-X format. This industry-standard format allows for compatibility with various design software and easy manufacturing.

PCB Quality Standard: Meeting Industry Standards

The RO3003 Hybrid PCB adheres to the IPC-Class-2 quality standard, ensuring reliability, durability, and performance. You can trust that you are getting a product that meets the highest industry standards.

Worldwide Availability: Reaching New Markets

The RO3003 Hybrid PCB is available worldwide, enabling you to reach new markets and expand your business. No matter where you are located, we can deliver this high-performance PCB to your doorstep.

Hybrid RF Circuit Boards

Some Typical Applications: Unleashing Your Creativity

The RO3003 Hybrid PCB opens up a world of possibilities for numerous applications, including:

Band Pass Filters: Achieve precise and accurate filtering for various frequency bands.

Microstrip Patch Antennas:Develop high-performance antennas for wireless communication systems.

Voltage Controlled Oscillators: Create stable and reliable oscillators for precise frequency generation.

Applications Sensitive to Temperature Change: The RO3003 Hybrid PCB is ideal for applications that require stability and reliability even in extreme temperature conditions.

Contact Info: Let's Discuss Your Project

If you have any technical questions or require further information about the RO3003 Hybrid PCB, please don't hesitate to contact our dedicated sales team at We are here to help you unleash the full potential of your projects.


In conclusion, the Rogers 3003 Hybrid PCB is a game-changer in the world of high-frequency applications. With its advanced materials, superior construction, and exceptional performance, this PCB is your gateway to innovation. Whether you are designing band pass filters, microstrip patch antennas, voltage-controlled oscillators, or applications sensitive to temperature change, the RO3003 Hybrid PCB is your ultimate partner. Experience the power of reliable and high-performance PCBs and take your projects to new heights with the RO3003 Hybrid PCB.

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IPv6 network supported

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