Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

Hybrid PCB
Hybrid PCB
Products
Home Rogers PCB Board Rogers RO3003 High Frequency PCB 2 Layer 10mil DK3.0 DF 0.001 PCB

Rogers RO3003 High Frequency PCB 2 Layer 10mil DK3.0 DF 0.001 PCB

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices.

  • Item NO.:

    BIC-037-v7.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board DK3.0 DF 0.001 Microwave PCB


The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.


RO3003 PCB 10mil RO3003 PCB 10mil


Typical applications:


1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers


PCB Specifications: 


PCB SIZE 100 x 100mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components NO
Through Hole Components NO
LAYER STACKUP copper ------- 35 um(1 oz)
RO3003 0.254mm
copper ------- 35 um(1 oz)
TECHNOLOGY
Minimum Trace and Space: 5mil / 5mil
Minimum / Maximum Holes: 0.3mm / 0.8mm
Number of Different Holes: N/A
Number of Drill Holes: N/A
Number of Milled Slots: N/A
Number of Internal Cutouts: N/A
Impedance Control: N/A
Number of Gold finger: N/A
BOARD MATERIAL
Glass Epoxy:  RO3003 0.254mm
Final foil external:  1oz
Final foil internal:  N/A
Final height of PCB:  0.3 mm ±0.1
PLATING AND COATING
Surface Finish N/A
Solder Mask Apply To:  N/A
Solder Mask Color:  N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST N/A
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Data Sheet of Rogers 3003 (RO3003): 


 RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107 COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9 j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
16
25
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃TGA ASTM D 3850
Density 2.1 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes


BICHNEG PCB WORKSHOP:


BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION



BICHENG PCB MAIN COURIERS:


BICHENG PCB MAIN COURIERS

Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

Related Products
RT/Duroid 5880 High Frequency PCB
RT/Duroid 5880 20mil 0.508mm Rogers High Frequency PCB

This is a type of double sided RF PCB built on RT/duroid 5880 for the application of Radar Systems.

2 layer  60mil  RO4003C RF PCB
Rogers 4003 60mil 1.524mm RO4003C High Frequency RF PCB

RO4003C PCBs are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance.

RO3010 PCB 10mil
Rogers RO3010 High Frequency 2-Layer 10mil Printed Circuit Board PCB

RO3010 laminates are competitively priced products with exceptional mechanical and electrical stability. This stability simplifies the design of broadband components and allows the materials to be used in a wide range of applications over a very broad range of frequencies.

25mil RO3210 PCB
Rogers RF PCB RO3210 25mil 0.635mm DK10.2 Immersion Gold

These RO3210 materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate.

RT/duroid 6035HTC
Rogers 6035 Double Sided 20mil Core With Immersion Gold PCB

RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

TC350 RF PCB
TC350 Rogers RF PCB 30mil Double Sided Corel With Immersion Gold

TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

Rogers RO3035 High Frequency PCB
Rogers RO3035 High Frequency 2-Layer 10mil Circuit Board DK3.5 DF 0.0015

RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability.

Rogers 6006 High Frequency PCB
Rogers 6006 High Frequency PCB Coating Immersion Gold and Green Mask

RT/duroid 6006 microwave laminates has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.

© Copyright: 2021 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #