PCB Material:

The RO4003C Hybrid PCB is crafted using Rogers RO4003C Hydrocarbon Ceramic Woven Glass, a top-of-the-line material known for its outstanding electrical performance and mechanical stability. With a dielectric constant of 3.38 at 10GHz and a dissipation factor of 0.0027 at 10GHz, this material ensures low dielectric tolerance and low loss, making it ideal for applications that necessitate higher operating frequencies.

Features and Benefits:

A) Designed for Performance-Sensitive Applications:

The RO4003C Hybrid PCB is specifically engineered to cater to the demands of performance-sensitive, high-volume applications. Its construction guarantees optimal performance and reliability, making it the perfect choice for critical projects.

B) Excellent Electrical Performance:

With its low dielectric tolerance and low loss, the RO4003C Hybrid PCB delivers exceptional electrical performance. This characteristic enables a wide range of applications, including those requiring broadband capabilities.

C) Stable Electrical Properties vs. Frequency:

One of the standout features of the RO4003C Hybrid PCB is its ability to maintain stable electrical properties across different frequencies. This stability allows for the implementation of controlled impedance transmission lines and the repeatable design of filters, ensuring consistent and reliable results.

D) Excellent Dimensional Stability:

Thanks to its low thermal coefficient of dielectric constant, the RO4003C Hybrid PCB exhibits remarkable dimensional stability. This means that your circuitry will remain accurate and reliable, even in the face of varying temperatures.

E) Reliable Plated Through Holes:

The RO4003C Hybrid PCB boasts a low Z-axis expansion, offering reliable plated through holes. By minimizing the risk of defects, this feature ensures the longevity and performance of your PCB.

F) Stability Over a Range of Circuit Processing Temperatures:

With a low in-plane expansion coefficient, the RO4003C Hybrid PCB stays stable throughout the circuit processing, even when subjected to varying temperatures. This stability ensures consistent performance and ease of manufacturing.

G) Volume Manufacturing Process:

Manufacturing PCBs using the RO4003C Hybrid PCB material is a breeze, as it can be easily fabricated using standard glass epoxy processes. This not only saves time but also makes it a cost-effective choice for high-volume production.

H) CAF Resistant:

The RO4003C Hybrid PCB material is resistant to conductive anodic filament (CAF) formation. This resistance ensures the long-term reliability and durability of your PCB, even in challenging operating conditions.

Stackup:

The RO4003C Hybrid PCB features a robust 6-layer stackup, providing flexibility and versatility for your designs. The copper layers have a thickness of 35 μm, while the RO4003C core 12mil (0.305 mm) thickness, offering excellent structural integrity.

Construction Details:

When it comes to construction, the RO4003C Hybrid 6 layers PCB leaves no room for compromise. Here are the key details:

Board Dimensions: The PCB measures 76mm x 74mm, with a tolerance of +/- 0.15mm, ensuring precise fitment in your applications.

Minimum Trace/Space: The RO4003C Hybrid PCB supports a minimum trace/space of 5/7 mils, allowing for intricate designs and dense circuitry.

Minimum Hole Size: The minimum hole size for this PCB is 0.2mm, enabling precise and accurate assembly.

No Blind Vias: The absence of blind vias simplifies the manufacturing process, ensuring reliability and cost-effectiveness.

Finished Board Thickness: The finished thickness of the RO4003C Hybrid PCB is 1.1mm, striking the perfect balance between durability and compactness.

Finished Cu Weight: The outer layers of the PCB feature a 1oz (1.4 mils) copper weight, providing excellent conductivity and signal integrity.

Via Plating Thickness: The vias of this PCB are plated with a thickness of 25 μm, ensuring robust connections and superior electrical performance.

Surface Finish: The RO4003C Hybrid PCB comes with an immersion gold surface finish, offering excellent solderability and corrosion resistance.

Silkscreen and Solder Mask: The top and bottom silkscreens are adorned with white markings, while the top and bottom solder masks sport a stylish matt blue color.

100% Electrical Test: Before shipment, every single RO4003C Hybrid PCB undergoes a rigorous 100% electrical test, ensuring its functionality and reliability.

Impedance Control: The top layer of the PCB features a 23mil single-ended type with a 50-ohm impedance, allowing for precise signal control and transmission quality.

Resin-Filled and Capped Vias: The 0.2mm and 0.25mm vias are resin-filled and capped, guaranteeing enhanced structural integrity and reliable electrical connections.

PCB Statistics:

To give you a better idea of the capabilities of the RO4003C Hybrid PCB, here are its statistics:

Components: The PCB can accommodate up to 98 components, making it versatile enough for a wide range of applications.

Total Pads: With a total of 114 pads, the RO4003C Hybrid PCB offers ample connection options for your circuitry.

Thru-Hole Pads: The PCB features 35 thru-hole pads, allowing for secure and reliable connections.

Top SMT Pads: There are 42 top surface mount technology (SMT) pads, enabling efficient and space-saving component placement.

Bottom SMT Pads: The bottom surface of the PCB supports 37 SMT pads, providing additional options for component integration.

Vias: With 62 vias, the RO4003C Hybrid PCB offers excellent connectivity and signal routing capabilities.

Nets: The PCB boasts 12 nets, facilitating seamless communication between different components and sections of your circuit.

Artwork Supplied:

The RO4003C Hybrid PCB is designed to be compatible with Gerber RS-274-X artwork format, making it easy for manufacturers to integrate this exceptional material into their production processes.

Quality Standard:

To ensure the highest standards of quality, the RO4003C Hybrid PCB conforms to IPC-Class-2 quality standards. This certification guarantees that you receive a PCB that meets or exceeds industry requirements, providing peace of mind and confidence in your designs.

Availability:

The RO4003C Hybrid PCB is readily available worldwide, ensuring that engineers and manufacturers across the globe can benefit from its exceptional features and performance.

Typical Applications:

The versatility of the RO4003C Hybrid PCB makes it well-suited for various applications, including but not limited to:

a. Cellular base station antennas and power amplifiers:

Achieve reliable and efficient communication in cellular networks with the RO4003C Hybrid PCB.

b. RF identification tags:

Build cutting-edge identification systems with the RO4003C Hybrid PCB's exceptional high-frequency capabilities.

c. Automotive radar and sensors:

Ensure precise and accurate radar and sensor systems in vehicles with the reliability of the RO4003C Hybrid PCB.

d. LNB's for direct broadcast satellites:

Achieve optimal signal reception and transmission in satellite communication systems with the advanced features of the RO4003C Hybrid PCB.

Contact Info:

For any technical inquiries or questions about the RO4003C Hybrid PCB, please feel free to reach out to Jane at sales20@bichengpcb.com. As a senior sales manager, Jane possesses deep knowledge and expertise in the RO4003C Hybrid PCB and will be more than happy to assist you with any inquiries or concerns.

Don't miss out on the opportunity to elevate your electronic designs with the RO4003C Hybrid PCB 12mil Core. Its exceptional performance, reliability, and stability make it the perfect choice for demanding high-frequency applications. Contact us today to explore how the RO4003C Hybrid material PCB can take your projects to new heights.