Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
RO4003C exhibit a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband
applications. And signal integrity performance improvement over
the stack-ups with all FR4 board.
Item NO.:
BIC-074-v8.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 daysRF Hybrid High Frequency PCB 4 Layer Hybrid PCB Built On 8mil 0.203mm RO4003C and FR-4
We’ll see a type of 4 layer hybrid PCB built on 0.203mm (8mil) RO4003C and FR-4 for the application of attenuator. It's 1.1 mm thick with blue solder mask and immersion silver on pads. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.
Let’s see the stack-up.
Layer 1 to layer 2 is the RO4003C core, then the left are FR-4 material. Boards are through holes.
Let’s see the micro-section.
Features and Benefits:
1) RO4003C exhibit a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.
2) Signal integrity performance improvement over the stack-ups with all FR4 board
3) Thermal stress test, reliability test, insulation resistance test and ionic contamination test, AOI test etc.
4) No MOQ
5) Experienced sales persons provide skilled customer services.
Applications:
RF transceiver Power divider LNBAttenuator Directional coupler Photocoupler
Parameter and Data Sheet:
| PCB SIZE | 140 x 35 mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 4 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um TOP layer |
| RO4003C 0.203mm | |
| copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 0.5mm | |
| copper ------- 35um(1oz) MidLayer 2 | |
| FR-4 0.2mm | |
| copper ------- 35um BOT layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 7.8 mil / 4.4 mil |
| Minimum / Maximum Holes: | 0.3 mm / 2.5 mm |
| Number of Different Holes: | 4 |
| Number of Drill Holes: | 91 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | Rogers RO4003C +FR4 hybrid material |
| Final foil external: | 1 oz |
| Final foil internal: | 1 oz |
| Final height of PCB: | 1.1 mm ±0.11 |
| PLATING AND COATING | |
| Surface Finish | Immersion silver |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Blue, KSM-6189BL04/KSM-19H01 |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | NO |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |

BICHENG PCB CERTIFICATE:

BICHENG PCB MAIN COURIERS:

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
20-Layer Panasonic TU872 HDI PCB ENEPIG 3.0mm Finished Thick Laser-drilled Blind Vias
10-Layer Rogers RO4003C + 370HR FR4 Hybrid Laminate PCB ENIG Impedance Control
8-Layer 10oz Heavy Copper TU-865 Substrate PCB With ENIG Blind &Buried Via
4-Layer Rogers RO3210 + RO4450F PCB ISIG Surface Finish 1.321mm With Blind Via
4-Layer Rogers RO3003+TG170 FR-4 Hybrid PCB Immersion Silver Green Solder Mask
WL-CT440 PCB 30mil 0.762mm Wangling Laminate ENIG Finish No Solder Mask
TP1600 PCB 31.49mil High DK16 Wangling Laminate Pure Gold Plating
TLX-9 PCB 10mil 0.254mm Taconic High Frequency Laminate EPIG Nickle-free
© Copyright: 2026 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported