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Home Hybrid PCB Board RF Hybrid High Frequency 4 Layer 8mil RO4003C FR-4 PCB

RF Hybrid High Frequency 4 Layer 8mil RO4003C FR-4 PCB

RO4003C exhibit a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications. And signal integrity performance improvement over the stack-ups with all FR4 board.

  • Item NO.:

    BIC-074-v8.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

RF Hybrid High Frequency PCB 4 Layer Hybrid PCB Built On 8mil 0.203mm RO4003C and FR-4


We’ll see a type of 4 layer hybrid PCB built on 0.203mm (8mil) RO4003C and FR-4 for the application of attenuator. It's 1.1 mm thick with blue solder mask and immersion silver on pads. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

Let’s see the stack-up.


RO4003C + FR4 PCB


Layer 1 to layer 2 is the RO4003C core, then the left are FR-4 material. Boards are through holes.

Let’s see the micro-section.


RO4003C + FR4 PCB


Features and Benefits: 

    

1) RO4003C exhibit a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Signal integrity performance improvement over the stack-ups with all FR4 board

3) Thermal stress test, reliability test, insulation resistance test and ionic contamination test, AOI test etc.

4) No MOQ

5) Experienced sales persons provide skilled customer services.


Applications:


RF transceiver    Power divider    LNBAttenuator   Directional coupler   Photocoupler


Parameter and Data Sheet:


PCB SIZE 140 x 35 mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um TOP layer
RO4003C 0.203mm
copper ------- 35um(1oz) MidLayer 1
FR-4 0.5mm
copper ------- 35um(1oz) MidLayer 2
FR-4 0.2mm
copper ------- 35um BOT layer
TECHNOLOGY
Minimum Trace and Space: 7.8 mil / 4.4 mil
Minimum / Maximum Holes: 0.3 mm / 2.5  mm
Number of Different Holes: 4
Number of Drill Holes: 91
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  Rogers RO4003C +FR4 hybrid material
Final foil external:  1 oz
Final foil internal:  1 oz
Final height of PCB:  1.1 mm ±0.11
PLATING AND COATING
Surface Finish Immersion silver
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Blue, KSM-6189BL04/KSM-19H01
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend NO
Colour of Component Legend NO
Manufacturer Name or Logo:  NO
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

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