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The 12mil core is on the top layer and it mainly plays
the roles of signal layer. The core has fixed thickness which is very important
to the electrical length of RF lines on the circuit board.
Item NO.:
BIC-083-v36.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysHybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)
The type of 6-layer RF PCB built on 12mil RO4003C and FR-4. This board is used for satellite antenna. Following drawing is the stack-up of the board.
Viewing from the stack-up, the rest layers are FR-4 epoxy glass material with similar thickness with RO4003C.
The detailed specifications are as follows:
Base material: 12mil 0.305mm RO4003C+ Tg170 FR-4
Dielectric constant: 3.38+/-0.05
Layer count: 6 layers
Via type: Through holes
Format: 105mm x 80mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35μm / Inner layer 18μm
Solder mask / Legend: Green / White
Final PCB height: 1.4 mm
Others: Impedance controlled PCB
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
At present, the mature mixed pressing materials are as follows:
RO4350B + FR4;
RO4003C + FR4;
F4B + FR4;
RT/duroid 5880 + RO4350B
RT/duroid 5880 + FR4
Appendix: Our PCB Capability 2021:
Parameter | Value |
Layer Counts | 1-32 |
Substrate Material | FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET. |
Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
Board Outline Tolerance | ±0.0059" (0.15mm) |
PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
Thickness Tolerance(T≥0.8mm) | ±8% |
Thickness Tolerance(t<0.8mm) | ±10% |
Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
Minimum Track | 0.003" (0.075mm) |
Minimum Space | 0.003" (0.075mm) |
Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
Registration (Mechanical) | 0.00197" (0.05mm) |
Aspect Ratio | 12:1 |
Solder Mask Type | LPI |
Min Soldermask Bridge | 0.00315" (0.08mm) |
Min Soldermask Clearance | 0.00197" (0.05mm) |
Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
Impedance Control Tolerance | ±10% |
Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
BICHENG MAIN COURIERS:
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