Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

20 mil RO4003C PCB
20 mil RO4003C PCB
Search
Home Search

  • What Is RT/duroid 5880, And Why Is It Used in High-frequency PCBs?
    • February 20. 2025

    What Is RT/duroid 5880, And Why Is It Used in High-frequency PCBs? In the fast-paced world of electronics, the demand for high-performance printed circuit boards (PCBs) continues to grow exponentially. From aerospace to telecommunications, industries are constantly seeking materials that can deliver consistent performance across a wide frequency range. The RT/duroid 5880 PCB is one such material, ...

  • Why TLY-5 PCB Is the Go-To Choice for Automotive Radar and Satellite Communications?
    • February 24. 2025

    Why TLY-5 PCB Is the Go-To Choice for Automotive Radar and Satellite Communications? In the ever-evolving world of electronics, the demand for high-performance, reliable, and dimensionally stable printed circuit boards (PCBs) is at an all-time high. Whether it's for automotive radar systems, satellite communications, or aerospace applications, the need for PCBs that can operate efficiently at high...

  • Can You Handle High-frequency (RF/microwave) PCBs? Materials?
    • April 16. 2025

    Can You Handle High-frequency (RF/microwave) PCBs? Materials? Introduction High-frequency PCBs, particularly those used in RF (Radio Frequency) and microwave applications, require specialized materials and manufacturing expertise. Unlike standard FR-4 PCBs, these boards must maintain signal integrity, minimize dielectric losses, and withstand extreme thermal conditions. A common question we encoun...

  • Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs
    • May 21. 2025

    Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs Introduction In high-speed PCB design, signal integrity is paramount. As data rates increase, crosstalk—unwanted electromagnetic coupling between traces—becomes a critical challenge. A well-optimized multilayer stackup is essential to minimize crosstalk while ensuring signal integrity, power delivery, and manufacturability. This ar...

  • PTFE Materials Are Difficult to Process—How to Solve Lamination and Drilling Challenges?
    • June 12. 2025

    PTFE Materials Are Difficult to Process—How to Solve Lamination and Drilling Challenges? Introduction Polytetrafluoroethylene (PTFE), commonly known by the brand name Teflon (TFE), is a high-performance material widely used in printed circuit boards (PCBs) for high-frequency applications. Its low dielectric constant (Dk) and dissipation factor (Df) make it ideal for RF, microwave, and millimeter-w...

  • How to Choose Between RO4350B, PTFE, and Ceramic-Filled Substrates?
    • June 12. 2025

    How to Choose Between RO4350B, PTFE, and Ceramic-Filled Substrates? Introduction High-frequency PCBs are critical in modern RF and microwave applications, including 5G communications, radar systems, and satellite technology. Selecting the right substrate material is essential to ensure signal integrity, thermal stability, and manufacturability. Three of the most commonly used high-frequency PCB ma...

    A total of

    11

    pages

© Copyright: 2025 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #