Key Features:

1. Superior PCB Material: Our PCB utilizes RO3035 ceramic PTFE composites with a DK value of 3.5. This advanced material offers excellent electrical properties and high thermal stability, ensuring optimal performance even in challenging conditions. The lead-free process further enhances its reliability.

2. Robust Construction: The 2-layer stackup RO3035 PCB consists of a finished copper layer of 35um, a RO3035 dielectric layer measuring 30 mil (0.762mm), and another finished copper layer of 35um. This sturdy construction provides excellent signal integrity and structural strength.

3. Precise Specifications:

- Board Dimensions: The RO3035 PCB measures 195mm x 98mm with a tolerance of +/- 0.15mm, offering ample space for your components and circuitry.

- Minimum Trace/Space: Achieve intricate designs with a minimum trace width of 8 mils and a minimum spacing of 11 mils, ensuring efficient signal transmission and reduced interference.

- Minimum Hole Size: The PCB supports a minimum hole size of 0.3mm, facilitating effortless integration of electronic components.

- No Blind or Buried Vias: The absence of blind or buried vias simplifies assembly and ensures a streamlined manufacturing process.

- Compact Thickness: With a finished board thickness of 0.8mm,RO3035PCB is lightweight and space-efficient, suitable for various compact applications.

- Reliable Copper Weight: The finished Cu weight is 1 oz (1.4 mils) across all layers, ensuring optimal conductivity and stability.

- Consistent Via Plating: The PCB boasts a via plating thickness of 1 mil, guaranteeing reliable connections and efficient signal transfer.

- Immersion Gold Surface Finish: The immersion gold surface finish provides excellent solderability, corrosion resistance, and a smooth, uniform surface for optimal performance.

- Clear Silkscreen: The top silkscreen is presented in white, offering clear and legible component labeling for ease of identification.

4. Exceptional Quality Assurance:

- Rigorous Electrical Testing: Each RO3035 PCB undergoes a 100% electrical test to ensure consistent performance and reliability.

- IPC-Class-2 Standard: Our PCB adheres to the widely accepted IPC-Class-2 standard, guaranteeing high-quality manufacturing and reliable functionality.

5. Comprehensive Statistics:

- Components: The RO3035 PCB supports up to 71 components, providing versatility for a wide range of applications.

- Pads and Vias: With a total of 117 pads, including 78 thru-hole pads and 39 top SMT pads, the PCB accommodates diverse component types.

- Efficient Net Connections: The PCB features 78 vias and 15 nets, enabling seamless connectivity between components and ensuring efficient signal routing.

6. Artwork and Standards:

- Artwork Format: The supplied artwork is in Gerber RS-274-X format, ensuring compatibility with common PCB design tools.

- IPC-Class-2 Standard: Our #30milRO3035PCB meets the IPC-Class-2 standard, ensuring consistent quality and reliability.

7. Global Service:

- Worldwide Service Area: We offer our PCB services to customers worldwide, ensuring accessibility and convenience.

Introduction:

The world of electronics is constantly evolving, demanding cutting-edge solutions that deliver uncompromising performance. Here at BICHENG, we are proud to introduce our newly shipped PCB, crafted with precision using RO3035 ceramic PTFE composites. In this article, we will delve deep into the technology, construction, and features of the RO3035 PCB, showcasing its unparalleled potential for your electronic projects.

Understanding the 30mil RO3035 Ceramic PTFE Composites: Unveiling the Technology BehindRO3035 PCB

30mil RO3035 substrate is a revolutionary material that combines ceramic and PTFE composites, resulting in exceptional electrical properties and high thermal stability. With a dielectric constant (εProcess) of 3.50±0.05, it ensures efficient signal transmission even at frequencies up to 10 GHz.

Unmatched Performance: Delving into the Key Properties of RO3035 PCB

The 30mil RO3035 high frequency PCB exhibits remarkable properties, including a low dissipation factor (tanδ) of 0.0015 at 10 GHz, ensuring minimal signal loss. It also boasts a thermal coefficient of ε of -45 ppm/°C, providing stability across a wide temperature range.

Unveiling the Construction: A Closer Look at the Stackup and Dimensions

The 2-layer stackup of our PCB features a RO3035 dielectric layer measuring 30 mil (0.762mm), sandwiched between two 35um finished copper layers. With board dimensions of 195mm x 98mm and a finished board thickness of 0.8mm, it offers ample space for your components while maintaining a compact form factor.

Seamless Integration: Meeting the Industry Standards with IPC-Class-2 Certification

Our commitment to quality is evident in our adherence to the widely accepted IPC-Class-2 standard. This ensures that our PCB meets the highest manufacturing and performance standards, providing you with a reliable and durable solution.

Worldwide Reach: Experience Global Service and Support

Whether you're located across the globe or in our vicinity, we offer worldwide service and support. Our team is dedicated to assisting you at every step of the process, from design to delivery, ensuring a seamless experience.

Unleashing Design Potential: Minimum Trace/Space and Hole Size Considerations

With a minimum trace width of 8 mils and a minimum spacing of 11 mils,30mil RO3035 material enables intricate and compact designs. The minimum hole size of 0.3mm further enhances design flexibility, allowing for seamless integration of electronic components.

The Strength Within: Exploring the Structural Resilience and Copper Weight

RO3035 PCB's robust construction ensures structural integrity and reliable performance. With a finished copper weight of1 ounce (35um), it provides excellent conductivity and durability, making it suitable for a wide range of applications.

Surface Excellence: Immersion Gold Finish for Enhanced Solderability and Corrosion Resistance

To enhance solderability and protect against corrosion, the 30mil RO3035 PCB features an immersion gold finish. This ensures reliable solder joints and long-term performance, even in challenging environments.

Ensuring Quality and Reliability: Rigorous Electrical Testing and 100% Efficiency

At BICHENG, quality and reliability are our top priorities. Each RO3035 PCB undergoes rigorous electrical testing to guarantee exceptional performance. With a 100% efficiency rate, you can trust RO3035 PCB to meet your stringent requirements.

Embracing Lead-Free: Environmentally Friendly and Compatible with Modern Processes

In line with our commitment to sustainability,the RO3035 PCB is lead-free, making it environmentally friendly. It is also fully compatible with modern lead-free manufacturing processes, ensuring a seamless transition for your production line.

Conclusion:

With our newly shipped RO3035 Ceramic PTFE Composites PCB, you can unlock the full potential of your electronic projects. From its exceptional electrical properties to its robust construction and global support,RO3035 PCB is designed to exceed your expectations. Experience the future of PCB technology  and embrace unparalleled performance and reliability. Contact us today to discover how the Rogers 30mil RO3035 PCB can elevate your electronic designs to new heights.

For any technical inquiries or further assistance, please reach out to Jane at sales20@bichengpcb.com. Jane will provide expert guidance and address any questions you may have regarding ourRO3035PCB.

Upgrade your electronic projects with our RO3035 2-layer rigid PCB. Experience exceptional performance, reliability, and functionality in every circuit. Order now to unlock limitless possibilities for your electronic designs.