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Home Rogers PCB Board Rogers RO3035 High Frequency 2-Layer 10mil Circuit Board DK3.5 DF 0.0015

Rogers RO3035 High Frequency 2-Layer 10mil Circuit Board DK3.5 DF 0.0015

RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability.

  • Item NO.:

    BIC-041-v51.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers RO3035 High Frequency PCB 2-Layer Rogers 3035 10mil Circuit Board DK3.5 DF 0.0015 Microwave PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RO3035 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3035 materials with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.


RO3035 10mil PCB


Typical applications:


1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers


RO3035 PCB 60mil GPS antenna


PCB Specifications:


PCB SIZE 55 x 57mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3035 0.254mm
copper ------- 18um(0.5 oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.4 mm / 5.5 mm
Number of Different Holes: 5
Number of Drill Holes: 79
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy:  RO3035 0.254mm
Final foil external:  1 oz
Final foil internal:  N/A
Final height of PCB:  0.3 mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold
Solder Mask Apply To:  N/A
Solder Mask Color:  N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Data Sheet of Rogers 3035 (RO3035):


RO3035 Typical Value
Property RO3035 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0015 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -45 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.11
0.11
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107 COND A IPC 2.5.17.1
Tensile Modulus 1025
1006
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
17
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃TGA ASTM D 3850
Density 2.1 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 10.2 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes


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BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION



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