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Home Newly Shipped RF PCB 2-layer Adhesiveless FPC SF305 Polyimide 50um 0.05mm Immersion Gold Flexible Printed Circuit

2-layer Adhesiveless FPC SF305 Polyimide 50um 0.05mm Immersion Gold Flexible Printed Circuit

Whether you’re designing foldable devices, rugged automotive electronics, or precision instruments, our 2-Layer Adhesiveless FPC combines premium materials, meticulous engineering, and global compliance to meet your most demanding requirements. 

  • Item NO.:

    BIC-447-v532.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


2-layer Adhesiveless FPC SF305 Polyimide 50um 0.05mm Immersion Gold Flexible Printed Circuit

 

Introducing our 2-Layer Adhesiveless Flexible Printed Circuit (FPC)—a precision-engineered solution designed to redefine performance in high-reliability electronic applications. Built with a50μm Polyimide PIcore and Electroless Nickel Immersion Gold (ENIG) finish, this FPC PCB Board leverages Shengyi Technology’s premium SF202 adhesiveless copper-clad laminate (FCCL) to eliminate adhesive-related failure points, delivering superior flexibility, signal integrity, and durability. Ideal for dynamic bending scenarios, high-frequency transmission, and harsh environments, it meets global quality standards and supports diverse applications across consumer electronics, automotive, and industrial sectors.

 

PCB Construction Details

Below is a detailed breakdown of the Dual Layer FPC PCB’s construction parameters, ensuring transparency on material selection, dimensional accuracy, and quality control measures:

 

PCB Construction Details

Specifications

Layer Count

2 layers

Base Material

Adhesiveless Polyimide (SF202)

Board Dimensions

110mm x 130mm (1PCS), Tolerance: ±0.15mm

Minimum Trace/Space

8/6 mils

Minimum Hole Size

0.2mm

Blind Vias

None

Finished Board Thickness

0.12mm

Finished Cu Weight (Outer Layers)

0.5oz (0.7 mils)

Via Plating Thickness

15 μm

Surface Finish

Electroless Nickle Immersion Gold (ENIG)

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

Green

Bottom Solder Mask

Green

Quality Inspection

100% Electrical test prior to shipment

 

 

PCB Stackup

The polyimide flexible circuit’s simplified stackup balances mechanical flexibility with electrical performance, tailored for high-frequency and dynamic applications:

 

PCB Stackup

Material/Component

Thickness

Layer 1

Copper_layer_1

22 μm

Core Layer

SF305 Polyimide Core

0.05mm (50μm)

Layer 2

Copper_layer_2

22 μm

 

 

PCB Statistics

Key component and connectivity metrics reflect the FPC PCB’s adaptability for compact, high-density electronic designs:

 

PCB Statistics

Quantity

Components

90

Total Pads

179

Thru Hole Pads

79

Top SMT Pads

120

Bottom SMT Pads

0

Vias

51

Nets

2

 

  2-layer Adhesiveless FPC SF305



Core Material: SF202 Adhesiveless PI FCCL

At the heart of this FPC flexible printed circuit is Shengyi Technology’s SF202 adhesiveless double-sided FCCL—engineered exclusively for high-reliability flexible electronics. Unlike adhesive-based alternatives, its adhesiveless structure eliminates degradation risks from temperature cycling or repeated bending, ensuring long-term stability in demanding scenarios (e.g., foldable devices). Optimized for high-frequency signal transmission, SF202 delivers low dielectric loss and exceptional dimensional stability, making it the material of choice for applications requiring uncompromised performance.

 

Key Technical & Performance Advantages

Validated to IPC-TM-650 standards, the FPC flexible PCB combines industry-leading electrical, mechanical, and environmental properties:

 

1) Electrical Performance: Dk=3.2 and dissipation factor=0.007 at 1GHz, minimizing signal loss for high-frequency applications.

 

2) Mechanical Durability: 90°peel strength≥1N/mm, superior flexibility, and thermal resistance—ideal for dynamic bending and harsh operating conditions.

 

3) Environmental Compliance: Halogen-free (UL94 V-0/VTM-0), EU RoHS-compliant (free of Pb, Hg, Cd, Cr6+, PBB, PBDE), and moisture absorption≤1.5%.

 

4) Reliability: Dielectric strength of 150 V/μm, excellent soldering reliability, and chemical resistance≥80%—ensuring durability in corrosive or humid environments.

 

 

Typical Applications

This versatile FPC is engineered for sectors demanding precision and resilience:

 

- Computer

- Mobile phone,

- Digital camera, VCR,

- Automobile, Office Automatic equipment, etc..

 

Quality & Availability

Manufactured to IPC-Class-2 standards, the custom flex PCB undergoes rigorous 100% electrical testing to ensure zero defects. Compatible with Gerber RS-274-X artwork (industry-standard format), it seamlessly integrates into existing production workflows. With worldwide availability, this FPC supports global manufacturing needs, delivering consistent quality across regions.

 

Whether you’re designing foldable devices, rugged automotive electronics, or precision instruments, our 2-Layer Adhesiveless FPC combines premium materials, meticulous engineering, and global compliance to meet your most demanding requirements. It’s not just a circuit board—it’s a foundation for reliable, innovative electronics.

 

For customized quotes, technical support, or sample requests, feel free to reach out—our team is ready to help you integrate this high-performance FPC into your product lineup.

 






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Major material Supplier



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