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TMM4 2-layer PCB delivers the consistency and reliability demanded by mission-critical applications.
Item NO.:
BIC-445-v528.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers TMM4 PCB 2-layer 60mil 1.524mm Silver and Gold Plating High frequency Board
(Note: Printed Circuit Boards are custom-made products, Images and Parameters are for reference Only)
Designed for demanding high-frequency applications, the TMM4 PCB (2-layer, 60mil) leverages Rogers’ premium thermoset microwave material to deliver uncompromised reliability, signal integrity, and fabrication versatility. Compliant with IPC-Class-2 standards and available worldwide, this Rogers TMM4 PCB integrates precision construction, optimized stackup, and tailored specifications to meet the needs of RF, microwave, and satellite communication systems. Below is a detailed breakdown of its core attributes, followed by structured technical tables for quick reference.
PCB Construction Details
Precision-engineered with tight dimensional tolerances and specialized surface treatments, the Rogers PCB’s construction ensures compatibility with high-frequency workflows and long-term operational stability.
|
Specification |
Details |
|
Base material |
TMM4 |
|
Layer count |
2 layers |
|
Board dimensions |
47mm x 118mm (1PCS), +/- 0.15mm |
|
Minimum Trace/Space |
5/7 mils |
|
Minimum Hole Size |
0.35mm |
|
Blind vias |
No |
|
Finished board thickness |
1.6mm |
|
Finished Cu weight (outer layers) |
1oz (1.4 mils) |
|
Via plating thickness |
20 μm |
|
Surface finish |
Silver and gold plating (Gold over silver plating) |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
No |
|
Top Solder Mask |
Green |
|
Bottom Solder Mask |
No |
|
Quality control |
100% Electrical test prior to shipment |
PCB Stackup
A streamlined rigid 2-layer stackup optimized for microwave performance, featuring consistent copper conductivity and Rogers TMM4 core material for stable dielectric properties.
|
Layer |
Material/Description |
Thickness |
|
Copper_layer_1 |
Outer copper layer |
35 μm |
|
Rogers TMM4 Core |
Thermoset microwave core (60mil) |
1.524 mm |
|
Copper_layer_2 |
Outer copper layer |
35 μm |
PCB Statistics
Tailored for focused high-frequency functionality, the 60 mil TMM4 PCB’s component and pad configuration supports efficient connectivity while minimizing signal loss.
|
Metric |
Value |
|
Components |
32 |
|
Total Pads |
65 |
|
Thru Hole Pads |
39 |
|
Top SMT Pads |
26 |
|
Bottom SMT Pads |
0 |
|
Vias |
78 |
|
Nets |
2 |
Core Material
At the heart of this PCB is Rogers TMM4, a ceramic-hydrocarbon thermoset polymer composite engineered to bridge the gap between ceramic and traditional PTFE laminates. It eliminates the need for specialized production techniques while retaining key advantages: strong mechanical stability, chemical resistance, and reliable plated-through-hole performance. Ideal for strip-line and micro-strip applications, TMM4’s thermoset resin enables secure wire-bonding without pad lifting or substrate deformation—critical for high-vibration or temperature-fluctuating environments.
Key Features & Performance Advantages
The TMM4 high frequency PCB stands out with industry-leading electrical and physical properties:
Typical Applications
This Silver and Gold Plating TMM4 PCB is purpose-built for high-performance systems requiring precision and durability:
Supplied with Gerber RS-274-X artwork and validated via 100% electrical testing, the TMM4 2-layer PCB delivers the consistency and reliability demanded by mission-critical applications. Its worldwide availability ensures seamless integration into global supply chains, while compliance with IPC-Class-2 standards guarantees adherence to industry-quality benchmarks.
Whether you’re designing satellite communication hardware, high-frequency filters, or precision antennas, this PCB combines Rogers’ trusted TMM4 material with optimized construction to elevate your product’s performance and longevity.
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