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Home Newly Shipped RF PCB Rogers TMM4 PCB 2-layer 60mil 1.524mm Silver and Gold Plating High frequency Board

Rogers TMM4 PCB 2-layer 60mil 1.524mm Silver and Gold Plating High frequency Board

TMM4 2-layer PCB delivers the consistency and reliability demanded by mission-critical applications. 

  • Item NO.:

    BIC-445-v528.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers TMM4 PCB 2-layer 60mil 1.524mm Silver and Gold Plating High frequency Board


(Note: Printed Circuit Boards are custom-made products, Images and Parameters are for reference Only)


Designed for demanding high-frequency applications, the TMM4 PCB (2-layer, 60mil) leverages Rogers’ premium thermoset microwave material to deliver uncompromised reliability, signal integrity, and fabrication versatility. Compliant with IPC-Class-2 standards and available worldwide, this Rogers TMM4 PCB integrates precision construction, optimized stackup, and tailored specifications to meet the needs of RF, microwave, and satellite communication systems. Below is a detailed breakdown of its core attributes, followed by structured technical tables for quick reference.

 

PCB Construction Details

Precision-engineered with tight dimensional tolerances and specialized surface treatments, the Rogers PCB’s construction ensures compatibility with high-frequency workflows and long-term operational stability.

 

Specification

Details

Base material

TMM4

Layer count

2 layers

Board dimensions

47mm x 118mm (1PCS), +/- 0.15mm

Minimum Trace/Space

5/7 mils

Minimum Hole Size

0.35mm

Blind vias

No

Finished board thickness

1.6mm

Finished Cu weight (outer layers)

1oz (1.4 mils)

Via plating thickness

20 μm

Surface finish

Silver and gold plating (Gold over silver plating)

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

Green

Bottom Solder Mask

No

Quality control

100% Electrical test prior to shipment

 

 

PCB Stackup

A streamlined rigid 2-layer stackup optimized for microwave performance, featuring consistent copper conductivity and Rogers TMM4 core material for stable dielectric properties.

 

Layer

Material/Description

Thickness

Copper_layer_1

Outer copper layer

35 μm

Rogers TMM4 Core

Thermoset microwave core (60mil)

1.524 mm

Copper_layer_2

Outer copper layer

35 μm

 

 

PCB Statistics

Tailored for focused high-frequency functionality, the 60 mil TMM4 PCB’s component and pad configuration supports efficient connectivity while minimizing signal loss.

 

Metric

Value

Components

32

Total Pads

65

Thru Hole Pads

39

Top SMT Pads

26

Bottom SMT Pads

0

Vias

78

Nets

2

 

 

Core Material

At the heart of this PCB is Rogers TMM4, a ceramic-hydrocarbon thermoset polymer composite engineered to bridge the gap between ceramic and traditional PTFE laminates. It eliminates the need for specialized production techniques while retaining key advantages: strong mechanical stability, chemical resistance, and reliable plated-through-hole performance. Ideal for strip-line and micro-strip applications, TMM4’s thermoset resin enables secure wire-bonding without pad lifting or substrate deformation—critical for high-vibration or temperature-fluctuating environments.

 

TMM4 PCB 2-layer 60mil



Key Features & Performance Advantages

The TMM4 high frequency PCB stands out with industry-leading electrical and physical properties:

 


  • Dielectric constant (Dk) of 4.50±0.045 ensures consistent signal propagation across high frequencies (10GHz dissipation factor of 0.0020 minimizes signal loss).
  • Thermal coefficient of Dk (15ppm/°K) and CTE matched to copper (16ppm/°K x/y-axis) reduce thermal stress and maintain performance stability over temperature ranges.
  • Exceptional mechanical resilience resists creep and cold flow, while resistance to process chemicals lowers fabrication damage risks.
  • Low moisture absorption (0.07%-0.18%) and high decomposition temperature (425°C) enhance long-term reliability in harsh environments.
  • Compatibility with all common PWB processes simplifies manufacturing and reduces lead times.


 

 

Typical Applications

This Silver and Gold Plating TMM4 PCB is purpose-built for high-performance systems requiring precision and durability:

 


  • RF/microwave circuitry, power amplifiers, and combiners
  • Filters, couplers, and dielectric polarizers/lenses
  • Satellite communication systems and GPS antennas
  • Patch antennas and chip testers


  

Supplied with Gerber RS-274-X artwork and validated via 100% electrical testing, the TMM4 2-layer PCB delivers the consistency and reliability demanded by mission-critical applications. Its worldwide availability ensures seamless integration into global supply chains, while compliance with IPC-Class-2 standards guarantees adherence to industry-quality benchmarks.

 

Whether you’re designing satellite communication hardware, high-frequency filters, or precision antennas, this PCB combines Rogers’ trusted TMM4 material with optimized construction to elevate your product’s performance and longevity.


 





BICHENG PCB CERTIFICATE:



Top 10 Sales of Rogers PCB




Major material Supplier



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