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Home Newly Shipped RF PCB Customized Double Sided Rogers 10mi RO3010 Material PCB Electroless Nickle Immersion Gold surface finish

Customized Double Sided Rogers 10mi RO3010 Material PCB Electroless Nickle Immersion Gold surface finish


Rogers RO3010 PCB is ideal for a wide range of high-frequency applications, including power amplifiers, filters, couplers, and antennas. 







  • Item NO.:

    BIC-N04-v210.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Customized Double Sided Rogers 10mi RO3010 Material PCBs Electroless Nickle Immersion Gold surface finish

 

Our latest shipment of double-sided RO3010 PCBs, which are made with Rogers RO3010 material and processed in an eco-friendly manner, is being introduced. Reliable operation in a range of environments is designed for this PCB, which has a temperature range of -40℃ to +85℃.

 

Rogers RO3010 PCB offers exceptional performance and stability, making it the ideal choice for high-frequency applications. Its unique properties and compatibility with lead-free processes make it a standout choice for designers who need the highest level of accuracy and reliability. With precision manufacturing, advanced testing, and quality control, Rogers RO3010 material is the future of high-frequency design. Choose Rogers RO3010 PCB and unleash the full potential of your system, achieving unparalleled high-frequency accuracy and performance.

 

Stack-up:

Layer

Thickness

Finished Copper Weight

Top Layer of Copper

17um + plating

1.0 oz or 1.4 mils

RO3010 Dielectric Layer

10mil or 0.254mm

-

Bottom Layer of Copper

17um + plating

1.0 oz or 1.4 mils

 

 

The stack-up comprises a10mil RO3010 material PCB dielectric layer of (0.254mm) thickness sandwiched between two base copper layers of 17um + plating. The finished board thickness is 0.42mm, with a finished copper weight of 1.0 oz (1.4 mils) across all layers, and a via plating thickness of 1 mil. Electroless Nickle and Immersion Gold (ENIG) surface finish, which provides excellent corrosion resistance and electrical performance, is used.


10mil RO3010 PCB BOARD

 

Construction Details:

Construction Details

Specifications

Board dimensions

80mm x 45mm = 1 PCS, +/- 0.15mm

Minimum Trace/Space

7/8 mils

Minimum Hole Size

0.2mm

Blind/Buried vias

No

Finished board thickness

0.42mm

Finished Cu weight

1.0 oz (1.4 mils) all layers

Via plating thickness

1 mil

Surface finish

Electroless Nickle and Immersion Gold (ENIG)

Top Silkscreen

White

Bottom Silkscreen

No

Top Solder Mask

No

Bottom Solder Mask

No

Electrical Testing

100%

 

 

This Rogers RO3010 PCB, which measures 80mm x 45mm, +/- 0.15mm, has a minimum trace/space of 7/8 mils and a minimum hole size of 0.2mm. There are no blind or buried vias, and quality and reliability are ensured through the use of 100% electrical testing. Impedance matching is not included in this design, but the PCB statistics show a total of 19 components and 21 pads, with 10 thru-hole pads and 11 top SMT pads. There are no bottom SMT pads, and the PCB includes a total of 21 vias and 7 nets.


10mil RO3010 material

 

RO3010 PCB Statistic:

PCB Statistics

Quantity

Components

19

Total Pads

21

Thru Hole Pads

10

Top SMT Pads

11

Bottom SMT Pads

0

Vias

21

Nets

7

 

 

R03010 PCB Data sheet:

RO3010 Typical Value
Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105 COND A IPC 2.5.17.1
Tensile Modulus 1902
1934
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.05 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8 j/g/k Calculated
Thermal Conductivity 0.95 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
13
11
16
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃ TGA ASTM D 3850
Density 2.8 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes


For technical questions or support, please contact Jane at sales20@bichengpcb.com. Rogers RO3010 double-sided PCBs are available for order, providing reliable and high-performance operation for your electronic devices.





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