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Rogers RO3010 PCB is ideal for a wide range of high-frequency applications, including power amplifiers, filters, couplers, and antennas.
Item NO.:
BIC-N04-v210.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Customized Double Sided Rogers 10mi RO3010 Material PCBs Electroless Nickle Immersion Gold surface finish
Our latest shipment of double-sided RO3010 PCBs, which are made with Rogers RO3010 material and processed in an eco-friendly manner, is being introduced. Reliable operation in a range of environments is designed for this PCB, which has a temperature range of -40℃ to +85℃.
Rogers RO3010 PCB offers exceptional performance and stability, making it the ideal choice for high-frequency applications. Its unique properties and compatibility with lead-free processes make it a standout choice for designers who need the highest level of accuracy and reliability. With precision manufacturing, advanced testing, and quality control, Rogers RO3010 material is the future of high-frequency design. Choose Rogers RO3010 PCB and unleash the full potential of your system, achieving unparalleled high-frequency accuracy and performance.
Stack-up:
Layer |
Thickness |
Finished Copper Weight |
Top Layer of Copper |
17um + plating |
1.0 oz or 1.4 mils |
RO3010 Dielectric Layer |
10mil or 0.254mm |
- |
Bottom Layer of Copper |
17um + plating |
1.0 oz or 1.4 mils |
The stack-up comprises a10mil RO3010 material PCB dielectric layer of (0.254mm) thickness sandwiched between two base copper layers of 17um + plating. The finished board thickness is 0.42mm, with a finished copper weight of 1.0 oz (1.4 mils) across all layers, and a via plating thickness of 1 mil. Electroless Nickle and Immersion Gold (ENIG) surface finish, which provides excellent corrosion resistance and electrical performance, is used.
Construction Details:
Construction Details |
Specifications |
Board dimensions |
80mm x 45mm = 1 PCS, +/- 0.15mm |
Minimum Trace/Space |
7/8 mils |
Minimum Hole Size |
0.2mm |
Blind/Buried vias |
No |
Finished board thickness |
0.42mm |
Finished Cu weight |
1.0 oz (1.4 mils) all layers |
Via plating thickness |
1 mil |
Surface finish |
Electroless Nickle and Immersion Gold (ENIG) |
Top Silkscreen |
White |
Bottom Silkscreen |
No |
Top Solder Mask |
No |
Bottom Solder Mask |
No |
Electrical Testing |
100% |
This Rogers RO3010 PCB, which measures 80mm x 45mm, +/- 0.15mm, has a minimum trace/space of 7/8 mils and a minimum hole size of 0.2mm. There are no blind or buried vias, and quality and reliability are ensured through the use of 100% electrical testing. Impedance matching is not included in this design, but the PCB statistics show a total of 19 components and 21 pads, with 10 thru-hole pads and 11 top SMT pads. There are no bottom SMT pads, and the PCB includes a total of 21 vias and 7 nets.
RO3010 PCB Statistic:
PCB Statistics |
Quantity |
Components |
19 |
Total Pads |
21 |
Thru Hole Pads |
10 |
Top SMT Pads |
11 |
Bottom SMT Pads |
0 |
Vias |
21 |
Nets |
7 |
R03010 PCB Data sheet:
RO3010 Typical Value | |||||
Property | RO3010 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 10.2±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 11.2 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.0022 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -395 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.35 0.31 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
Tensile Modulus |
1902 1934 |
X Y |
MPa | 23℃ | ASTM D 638 |
Moisture Absorption | 0.05 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
Specific Heat | 0.8 | j/g/k | Calculated | ||
Thermal Conductivity | 0.95 | W/M/K | 50℃ | ASTM D 5470 | |
Coefficient of Thermal Expansion (-55 to 288℃) |
13 11 16 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
Td | 500 | ℃ TGA | ASTM D 3850 | ||
Density | 2.8 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 9.4 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
For technical questions or support, please contact Jane at sales20@bichengpcb.com. Rogers RO3010 double-sided PCBs are available for order, providing reliable and high-performance operation for your electronic devices.
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