Hybrid PCB RO4003C S1000-2M: A Powerful Solution for Advanced Electronics

As technology continues to advance at a rapid pace, the demand for high-performance printed circuit boards (PCBs) is greater than ever before. To meet this demand, Bicheng PCB is proud to introduce our newly shipped Hybrid PCB RO4003C S1000-2M. This advanced Hybrid RF Circuit Boards offers a wide range of features and capabilities that make it ideal for a variety of applications, from cellular base station antennas to automotive radar and sensors. In this article, we will explore the key properties and benefits of the RO4003C S1000-2M PCB, as well as its construction and typical applications.

PCB Material: RO4003C and S1000-2M

The Hybrid PCB RO4003C S1000-2M utilizes two different materials, each with its own unique properties. The core material, RO4003C, is a Rogers Hydrocarbon Ceramic woven glass laminate. It offers a dielectric constant (DK) of 3.38 at 10 GHz and a dissipation factor of 0.0027 at 10 GHz, ensuring tight control on signal integrity. With a Tg (glass transition temperature) greater than 280 °C and a Td (thermal decomposition temperature) greater than 425°C, RO4003C provides excellent thermal stability and reliability. On the other hand, the S1000-2M material is a Shengyi High Tg, Low CTE Epoxy Glass laminate with a DK of 4.6 at 1 GHz and a dissipation factor of 0.0018 at 1 GHz. It boasts a Tg greater than 185 °C and a Td greater than 180°C, making it suitable for applications that require high heat resistance.

Features and Attentions

The RO4003C S1000-2M Hybrid PCB offers a range of features that make it a versatile and reliable choice for advanced electronics. The RO4003C laminate provides tight control on dielectric constant and low loss while utilizing the same processing method as standard epoxy/glass laminates. This allows for cost-effective production without sacrificing performance. It is important to note that RO4003C materials are non-brominated and are not UL 94 V-0 rated. In contrast, the S1000-2M material features anti-Conductive Anodic Filament (CAF) capability, lead-free compatibility, excellent thermal and through-hole reliability, and exceptional mechanical processability.

Stackup and Construction Details

The Hybrid PCB RO4003C S1000-2M features a 4-layer rigid PCB construction. The 4 Layer Hybrid PCBs tackup consists of two outer copper layers with a weight of 35 µm (1oz) each, a RO4003C core with a thickness of 12mil (0.305mm), and a layer of prepreg with a thickness of 0.1mm. This is by a S1000-2M FR-4 core, another layer of prepreg, and finally, the second set of outer copper layers. The finished board thickness is 1.6mm, and the finished copper weight is 1oz (1.4 mils) each layer. The via plating thickness is 25 μm. The surface finish of the board is Immersion Gold (ENIG), which offers excellent solderability and oxidation resistance. The top and bottom silkscreens are white, and the top and bottom solder masks are green. The PCB is manufactured with a minimum trace/space of 4/7 mils and a minimum hole size of 0.2mm. Additionally, the PCB is subjected to a 100% electrical test prior to shipment to ensure its reliability and adherence to IPC-Class-2 quality standards.

PCB Statistics

The Hybrid PCB RO4003C S1000-2M has a compact size, with dimensions of 76mm x 65mm. It consists of 29 components and a total of 87 pads. Of these pads, 44 are for thru-hole components, 32 are for top surface mount technology (SMT) components, and 11 are for bottom SMT components. The PCB features a total of 70 vias and 5 nets, allowing for efficient signal routing and connectivity.

Typical Applications

The Hybrid PCB RO4003C S1000-2M is suitable for a wide range of applications that require high performance and reliability. Some typical applications include cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNBs (Low Noise Block downconverters) for Direct Broadcast Satellites. The unique combination of RO4003C and S1000-2M materials provides the necessary properties for these applications, such as excellent signal integrity, high heat resistance, and anti-CAF capability.

Contact Information

If you have any technical questions or would like more information about the Hybrid PCB RO4003C S1000-2M, please do not hesitate to contact our dedicated sales team at sales20@bichengpcb.com. We are committed to providing exceptional customer service and support to ensure that you receive the best PCB solution for your specific requirements.

In conclusion, the RO4003C S1000-2M hybrid PCB is a powerful and reliable solution for advanced electronics. Its unique combination of RO4003C and S1000-2M materials offers excellent signal integrity, high heat resistance, and anti-CAF capability. With its versatile features and reliable construction, this PCB is suitable for a wide range of applications. Trust Bicheng PCB to deliver high-quality PCBs and exceptional customer service. Contact us today to learn more about the Hybrid PCB RO4003C S1000-2M and how it can benefit your next project.