RO4730G3, part of the Rogers family of antenna grade laminates, is a hydrocarbon/ceramic/woven glass material designed to provide optimal antenna performance at a lower cost compared to traditional PTFE-based laminates. With its unique resin system and exceptional properties, Rogers RO4730G3 offers designers a reliable and affordable alternative for achieving high-performance antennas. This blog post dives into the features, benefits, stackup, construction details, statistics, and typical applications of RO4730G3 20mil PCB, highlighting its ability to deliver low loss, lightweight, and cost-effective solutions for antenna designs.

Features: Unleashing Antenna Potential:

1. PCB possesses a dielectric constant (Dk) of 3.0+/- 0.05 at 10 GHz, enabling efficient signal transmission and precise impedance control for antenna applications.

2. With a low dissipation factor of 0.0028 at 10 GHz, RO4730G3 minimizes energy loss, ensuring low insertion loss and improved signal integrity.

3. The thermal coefficient of Dk of 34 ppm/°C provides excellent dimensional stability and consistent circuit performance across a wide temperature range.

4. RO4730G3 exhibits a coefficient of thermal expansion (CTE) matched to copper, minimizing the risk of delamination and ensuring reliable performance in thermal cycling environments.

5.The high glass transition temperature (Tg) of >280°C offers design flexibility and compatibility with automated assembly processes.

6. With a decomposition temperature (Td) of 411°C, RO4730G3 PCB can withstand high-temperature processes without compromising its electrical properties.

7. RO4730G3's thermal conductivity of 0.45W/mK facilitates efficient heat dissipation, enhancing overall reliability.

Benefits: Empowering Antenna Design:

1. The low loss dielectric and low profile foil of RO4730G3 contribute to reduced Passive Intermodulation (PIM) and low insertion loss, ensuring superior antenna performance.

2. The unique filler/closed microspheres in RO4730G3 result in a low-density laminate that is 30% lighter than PTFE/glass alternatives, enabling lightweight antenna designs.

3. RO4730G3's low Z-axis CTE (<30 ppm/°C) and high Tg (>280°C) provide design flexibility and compatibility with automated assembly processes, simplifying manufacturing and reducing costs.

4. The low TCDk (<40 ppm/°C) of RO4730G3 ensures consistent circuit performance, maintaining signal integrity even in temperature-varying environments.

5. The specially formulated thermoset resin system/filler in RO4730G3 offers a low TCDk, a stable Dk of 3.0, ease of fabrication, and compatibility with plated through-hole (PTH) processes, simplifying manufacturing and reducing production time.

6. RO4730G3 is environmentally friendly, with lead-free process compatibility and compliance with the Restriction of Hazardous Substances (RoHS) directive.

PCB Stackup and Construction Details: Precision and Reliability

The RO4730G3 high frequency PCB features a 2-layer rigid stackup with the following construction details:

Copper Layer 1: 35 μm

RO4730G3 Core: 20mil (0.508mm)

Copper Layer 2: 35 μm

Additional construction details:

1)Board dimensions:150mm x 110mm

2)Minimum Trace/Space:4/6 mils, allowing for high-density circuit designs.

3)Minimum Hole Size:0.25mm, facilitating precise component placement and assembly.

4)No Blind Vias:Simplified fabrication process without the need for blind vias.

5)Finished Board Thickness:0.6mm, ensuring compactness and compatibility with space-constrained applications.

6)Finished Cu Weight:1 oz (1.4 mils) outer layers, providing sufficient conductivity for reliable circuit performance.

7)Via Plating Thickness:20 μm, ensuring robust electrical connections.

8)Surface Finish:Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), offering excellent solderability, corrosion resistance, and a flat, planar surface for component assembly.

9)Top Silkscreen:No top silkscreen, providing a clean and unobstructed surface on the top side of the PCB.

10)Bottom Silkscreen:No bottom silkscreen, offering a clean and unobstructed surface on the bottom side of the PCB.

11)Top Solder Mask:Green, providing insulation and protection for the copper traces.

12)Bottom Solder Mask:Green, ensuring a uniform appearance and protection for the bottom side of the PCB.

13)100% Electrical Test:Each RO4730G3 PCB undergoes a rigorous 100% electrical test prior to shipment, ensuring optimal functionality and reliability.

PCB Statistics and Quality Standard: Performance Assurance:

The RO4730G3 20mil substrate PCB is designed to meet the highest quality standards. Here are the statistics and quality specifications:

1)Components:29, enabling the integration of complex circuitry.

2)Total Pads:38, providing ample connectivity options for components.

3)Thru-Hole Pads:22, facilitating the use of through-hole components for enhanced mechanical stability.

4)Top SMT Pads:16, allowing for surface-mount components on the top side of the PCB.

5)Bottom SMT Pads:0, offering a clean and unobstructed surface on the bottom side of the PCB.

6)Vias:17, enabling efficient signal routing and interconnection between layers.

7)Nets:6, ensuring effective communication between different parts of the circuit.

The quality standard of the Rogers RO4730G3 PCB complies with IPC-Class-2, guaranteeing the highest level of manufacturing quality, reliability, and performance.

Availability and Typical Applications: Versatility and Reach:

The RO4730G3 printed circuit board is available worldwide, making it easily accessible for designers and manufacturers across the globe. Its exceptional properties and cost-effectiveness make it an ideal choice for a wide range of applications, with cellular base station antennas being just one example. The RO4730G3 PCB's low loss dielectric, lightweight design, and compatibility with high-temperature lead-free solder processing make it suitable for various antenna designs, including those used in cellular base stations.

Conclusion:

The RO4730G3 PCB 20mil from Rogers is a game-changer in the field of antenna design. With its innovative features, such as low loss dielectric, lightweight construction, and compatibility with conventional FR-4 and high-temperature lead-free solder processing, it offers designers a cost-effective alternative to traditional PTFE-based laminates. The RO4730G3 PCB's exceptional performance, reliability, and compliance with industry standards make it a top choice for applications that require high-quality antennas. Whether it's cellular base station antennas or other antenna designs, theRogers RO4730G3 high frequency PCB empowers engineers to achieve optimal performance, reduced costs, and design flexibility. Experience the revolution in antenna design with the RO4730G3 PCB 20mil.