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20 mil RO4003C PCB
20 mil RO4003C PCB

RO3003 20mil PCB for High-Frequency Applications

  • March 06. 2024


The RO3003 20mil PCB is a cutting-edge solution for high-frequency applications in the field of microwave and RF technology. Manufactured using Rogers RO3003 high-frequency laminates, these ceramic-filled PTFE composites offer exceptional stability of dielectric constant (Dk) across a range of temperatures and frequencies. With its superior performance and reliability, this PCB is specifically designed to meet the demands of advanced technologies such as automotive radar, driver assistance systems, and 5G wireless infrastructure.


The RO3003 20mil laminate PCB comes with a range of impressive features that make it an ideal choice for high-frequency applications:

1) Rogers RO3003 Ceramic-Filled PTFE Composites:

The PCB is constructed using Rogers RO3003 ceramic-filled PTFE composites, ensuring optimal performance in high-frequency environments.

2) Stable Dielectric Constant:

The PCB exhibits a dielectric constant (Dk) of 3+/- 0.04 at 10 GHz/23°C, offering excellent stability over varying temperatures and frequencies. This eliminates the step change in Dk typically observed with PTFE glass materials near room temperature.

3) Low Dissipation Factor:

With a dissipation factor of 0.001 at 10 GHz/23°C, the PCB minimizes energy loss, making it suitable for applications up to 77 GHz.

4) High Temperature Resistance:

The RO3003 20mil PCB has a Td> 500°C, ensuring reliable performance even in extreme temperature conditions.

5) Thermal Conductivity:

The PCB exhibits a thermal conductivity of 0.5 W/mK, allowing for efficient heat dissipation and ensuring the longevity of electronic components.

6) Low Moisture Absorption:

With a moisture absorption rate of only 0.04%, the PCB maintains its electrical and mechanical properties, even in humid environments.

7) Coefficient of Thermal Expansion:

The PCB's coefficient of thermal expansion (-55 to 288 °C) ensures dimensional stability and compatibility with copper, making it ideal for surface-mounted assemblies.

Rogers RO3003 PCB


The Rogers 3003 PCB offers numerous benefits for high-frequency applications:

1) Versatile Mechanical Properties:

The PCB's excellent mechanical properties remain consistent across a wide range of dielectric constants. This makes it suitable for multi-layer board designs with varying dielectric constants, including epoxy glass multi-layer board hybrid designs.

2) Stable Dielectric Constant:

The PCB maintains a stable dielectric constant versus temperature and frequency, making it an ideal choice for applications such as bandpass filters, microstrip patch antennas, and voltage-controlled oscillators.

3) Reliable Stripline and Multi-Layer Board Constructions:

The PCB's reliable construction ensures consistent performance in stripline and multi-layer board designs, providing reliable signal transmission and minimizing signal loss.

4) Volume Manufacturing Process:

The PCB's volume manufacturing process ensures economical laminate pricing, making it a cost-effective choice for large-scale production.

PCB Stackup and Construction Details:

The RO3003 20mil PCB is a 2-layer rigid PCB with the following stackup:

Copper Layer 1: 35 μm

Rogers RO3003 Substrate: 20mil (0.508mm)

Copper Layer 2: 35 μm

RO3003 High Frequency PCB

Additional construction details include:

Board Dimensions: 85.7mm x 73.2mm (1PCS)

Minimum Trace/Space: 4/4 mils

Minimum Hole Size: 0.35mm

Finished Board Thickness: 0.6mm

Finished Cu Weight: 1 oz (1.4 mils) outer layers

Via Plating Thickness: 20 μm

Surface Finish: Immersion Gold

Top Silkscreen: No

Bottom Silkscreen: No

Top Solder Mask: No

Bottom Solder Mask: No

100% Electrical Test: All PCBs undergo rigorous electrical testing prior to shipment.

PCB Statistics:

The Rogers RO3003 PCB boasts the following statistics:

Components: 27

Total Pads: 61

Thru-Hole Pads: 40

Top SMT Pads: 21

Bottom SMT Pads: 0

Vias: 42

Nets: 4

Type of Artwork Supplied and Accepted Standard:

The PCB design files are supplied in the Gerber RS-274-X format, ensuring compatibility with various design tools and fabrication processes. The PCB adheres to the IPC-Class-2 standard, guaranteeing high-quality manufacturing and reliable performance.


The RO3003 High Frequency PCB is available worldwide, making it accessible to customers across different regions.

Typical Applications:

The versatility and high-performance characteristics of the RO3003 20milmaterialPCB make it suitable for various applications, including:

  1. Automotive Radar Applications
  2. Global Positioning Satellite Antennas
  3. Cellular Telecommunications Systems (Power Amplifiers and Antennas)
  4. Patch Antennas for Wireless Communications
  5. Direct Broadcast Satellites
  6. Datalink on Cable Systems
  7. Remote Meter Readers
  8. Power Backplanes


The 2-layer RO3003 PCB is a state-of-the-art solution for high-frequency applications, offering exceptional stability, low dielectric loss, and reliable performance across varying temperatures and frequencies. With its advanced features, versatility, and compatibility with different design requirements, this PCB is an ideal choice for automotive radar, 5G wireless infrastructure, and other high-frequency applications. Its volume manufacturing process ensures cost-effectiveness, making it a reliable option for large-scale production. Choose the RO3003 20milsubstratePCB to achieve optimal performance and reliability in your high-frequency electronic designs.

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IPv6 network supported

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