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20 mil RO4003C PCB
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RT/duroid 5880LZ High Frequency PCB: Exploring a Lightweight Solution for Advanced Circuit Applications

  • November 13. 2023
Overview:

Today, we delve into the world of lightweight high frequency circuit boards and focus on the remarkable capabilities of RT/duroid 5880LZ PCB. These laminates, developed by Rogers, are composed of filled PTFE composites specially designed for demanding strip-line and micro-strip circuit applications. With a unique filler contributing to its lightweight nature, this material excels in both high performance and weight-sensitive scenarios. Now, let's take a closer look at the impressive properties that make RT/duroid 5880LZ stand out.


Key Properties:

Dielectric Constant:

RT/duroid 5880LZ material boasts a dielectric constant of 2.00 ± 0.04 at 10 GHz and 23°C, ensuring reliable signal transmission in the Z direction according to IPC-TM-650, 2.5.5.5. The design dielectric constant remains consistent at 2.00 in the Z direction across a frequency range of 8 GHz to 40 GHz, as determined by the differential phase length method.


Dissipation Factor:

With an impressively low dissipation factor, also known as tan delta, RT/duroid 5880LZ showcases a typical value of 0.0021 and a maximum of 0.0027 at 10 GHz and 23°C. This denotes minimal signal loss and exceptional performance.


Thermal Coefficient of Dielectric Constant:

RT/duroid 5880LZ exhibits a thermal coefficient of dielectric constant of +20 ppm/°C in the Z direction, allowing for stable performance across temperatures ranging from -50°C to 150°C at 10 GHz, as specified by IPC-TM-650, 2.5.5.5.


Electrical Properties:

The electrical strength of Rogers 5880LZ is measured at 40 KV, ensuring durability and reliability in demanding applications as per D48/50 specifications in IPC-TM-650, 2.5.6. Moreover, it demonstrates a volume resistivity of 1.74 x 10^7 Mohm•cm and a surface resistivity of 2.08 x 10^6 Mohm, tested under C-96/35/90 conditions according to IPC-TM-650, 2.5.17.1.


Dimensional Stability:

When it comes to dimensional stability, RT/duroid 5880LZ showcases exceptional performance with a dimensional change of -0.38% in the X and Y directions. This ensures consistent and reliable operation, as tested under IPC-TM-650, 2.4.39A.


RT/duroid 5880LZ 20mil PCB


Additional Properties:

RT/duroid 5880LZ substrate demonstrates a moisture absorption of 0.31% after 24 hours at 23°C, indicating its resistance to moisture penetration as specified by IPC-TM-650, 2.6.2.1. It also exhibits a thermal conductivity of 0.33 W/m/°K in the Z direction at 80°C, according to ASTM C518. The material's coefficient of thermal expansion is 54 ppm/°C in the X direction, 47 ppm/°C in the Y direction, and 40 ppm/°C in the Z direction from 0°C to 150°C, ensuring dimensional stability under varying temperature conditions, as per IPC-TM-650, 2.4.41. Furthermore, RT/duroid 5880LZ meets the requirements of ASTM E-595 for outgassing, with low values for Total Mass Loss (TML), Collected Volatile Condensable Materials (CVCM), and Water Vapor Regain (WVR), all at 0.01%. The material's density is 1.4 gm/cm^3, providing a lightweight yet robust solution for high-frequency applications, as determined by ASTM D792. Its copper peel strength surpasses 4.0 pli, ensuring excellent adhesion and reliability in copper bonding processes, as tested under IPC-TM-650, 2.4.8. Moreover, RT/duroid 5880LZ achieves a V-O rating for flammability according to UL 94, indicating its resistance to ignition and flame propagation. Lastly, it is compatible with lead-free processes, offering a reliable and environmentally friendly solution for electronic applications.


Property

RT/duroid 5880LZ

Direction

Units

Condition

Test Method

Dielectric Constant er,Process

2.00 ± 0.04

Z


10 GHz/23°C

IPC-TM-650, 2.5.5.5

Dielectric Constant er,Design

2.00

Z


8 GHz - 40 GHz

Differential Phase Length Method

Dissipation Factor, tan

Typ: 0.0021               Max: 0.0027

Z


10GHz/23°C

IPC-TM-650, 2.5.5.5

Thermal Coefficient of Dielectric Constant, er

+20

Z

ppm/°C

-50°C to 150°C 10GHz

IPC-TM-650, 2.5.5.5

Volume Resistivity

1.74 X 10^7


Mohm•cm

C-96/35/90

IPC-TM-650, 2.5.17.1

Surface Resistivity

2.08 X 10^6


Mohm

C-96/35/90

IPC-TM-650, 2.5.17.1

Electrical Strength

40


KV

D48/50

IPC-TM-650, 2.5.6

Dimensional Stability

-0.38

X,Y

%


IPC-TM-650, 2.4.39A

Moisture Absorption

0.31


%

24 hours/23°C

IPC-TM-650, 2.6.2.1

Thermal Conductivity

0.33

Z

W/m/°K

80°C

ASTM C518

Coefficient of Thermal Expansion

54, 47 40

X,Y Z

ppm/°C

0 to 150°C

IPC-TM-650, 2.4.41

Outgassing





TML

0.01


%


ASTM E-595

CVCM

0.01



WVR

0.01



Density

1.4


gm/cm^3


ASTM D792

Copper Peel

>4.0


pli


IPC-TM-650, 2.4.8

Flammability

V-O




UL 94

Lead-Free Process Compatible

YES







PCB Capability:


For Rogers 5880LZ PCB, we provide a range of options including single layer boards, double layer boards, multi-layer boards, and hybrid types. Our designers work with standard thicknesses such as 10 mils, 20 mils, 50 mils, and 100 mils to cater to your specific needs. Finished copper options include 1oz and 2oz. The maximum PCB size on high frequency materials reaches 400mm by 500mm, allowing for single board or panel designs. We offer a variety of solder mask colors such as green, black, blue, and yellow, while providing options for pads plating including immersion gold, immersion silver, immersion tin, and bare copper.


PCB material:

Unique Filled PTFE Composites

Designation:

RT/Duroid 5880LZ

Dielectric constant:

2

Dissipation factor

0.0021 10GHz

Layer count:

1-layer, 2-layer, multi-layer, hybrid designs

Laminate thickness:

10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm  )

Copper weight:

1oz (35µm), 2oz (70 µm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Immersion gold, Immersion silver, Immersion tin, ENEPIG, Bare copper, HASL, OSP, Pure gold plated etc..


Real-Life Application:

An example of an RT/duroid 5880LZ 20mil substrate PCB is a 20mil double layer board with immersion gold. These PCBs find typical applications in airborne antenna systems, lightweight feed networks, and point-to-point digital radio antennas, among others.


Ordering Considerations:

When ordering RT/duroid 5880LZ high frequency PCBs, it is crucial to specify the desired dielectric thickness, required weight of copper foil, and preferred surface finish to ensure the perfect fit for your specific requirements.


Conclusion:

With its exceptionally low Z-axis coefficient of thermal expansion (CTE) at 40 ppm/°C, RT/duroid 5880LZ guarantees reliable plated through holes. When opting for this high-performance PCB, be sure to communicate your dielectric thickness, copper foil weight, and surface finish preferences for optimal results. Trust in the capabilities of RT/duroid 5880LZ PCB to deliver outstanding performance in your electronic applications, all while providing a lightweight and environmentally friendly solution.

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