Today, we delve into the realm of high frequency PCBs, specifically those built on the RO3006 cutting-edge material.

Rogers RO3006 printed circuit boards are composed of ceramic-filled PTFE composites that offer remarkable electrical and mechanical stability at a competitive price. These boards are designed to excel in commercial microwave and RF applications.

Key Properties of RO3006

RO3006 boasts exceptional properties, and we will explore its noteworthy features.

Let's begin with the dielectric constant. During the manufacturing process, RO3006 PCB typically exhibits a value of 6.15±0.05 at 10 GHz and 23℃ (IPC-TM-650 2.5.5.5 Clamped Stripline). For design purposes, the estimated dielectric constant within the frequency range of 8 GHz to 40 GHz is 6.5, as determined by the Differential Phase Length Method. This high dielectric constant enables designers to create smaller circuit boards, facilitating miniaturization of electronic devices. Moreover, the DK remains stable across a wide temperature range, eliminating the abrupt Dk changes experienced by PTFE glass materials near room temperature.

Next, let's discuss the dissipation factor or tan delta, a crucial parameter for loss characterization. RO3006 demonstrates a low dissipation factor of 0.002 at 10 GHz and 23℃ (IPC-TM-650 2.5.5.5). This attribute contributes to excellent signal integrity and minimal signal loss, making it ideal for high-gain power amplifiers.

When it comes to thermal properties, Rogers 3006 PCB showcases a thermal coefficient of dielectric constant of -262 ppm/℃ within the temperature range of -50℃ to 150℃ at 10 GHz (IPC-TM-650 2.5.5.5). This indicates its ability to maintain stable electrical performance even in extreme temperature conditions.

Moving on to dimensional stability, RO3006 exhibits outstanding structural integrity with a dimensional change of 0.27 mm/m in the X direction and 0.15 mm/m in the Y direction under specified conditions (COND A, IPC-TM-650 2.2.4). This ensures reliable and precise performance in various applications.

RO3006 also possesses excellent electrical properties. It showcases a volume resistivity of 10^5 MΩ.cm and a surface resistivity of 10^5 MΩ under specified conditions (COND A, IPC 2.5.17.1). These characteristics make it highly suitable for high-frequency applications that require reliable insulation.

Furthermore, the material exhibits impressive mechanical properties. With a tensile modulus of 1498 MPa in the X direction and 1293 MPa in the Y direction at 23℃ (ASTM D 638), RO3006 ensures durability and structural robustness.

In terms of moisture absorption, RO3006 high frequency PCB boasts a low rate of 0.02% (D48/50, IPC-TM-650 2.6.2.1). This attribute is crucial for maintaining consistent electrical performance even in humid environments.

Other notable properties include a specific heat of 0.86 j/g/k (calculated), indicating efficient heat dissipation, and a thermal conductivity of 0.79 W/M/K at 50℃ (ASTM D 5470), contributing to effective thermal management. These aspects address thermal management issues, particularly in power amplifiers.

When considering its response to temperature variations, RO3006 exhibits a coefficient of thermal expansion of 17 ppm/℃ in the X and Y directions and 24 ppm/℃ in the Z direction (-55 to 288℃, 23℃/50% RH, IPC-TM-650 2.4.4.1). This allows for more reliable surface mounted assemblies, making it ideal for temperature-sensitive applications. Moreover, these properties ensure excellent dimensional stability and reliability in plated through holes.

Additionally, RO3006 showcases a high thermal decomposition temperature (Td) of 500℃ (TGA, ASTM D 3850), indicating its ability to withstand elevated temperatures without significant degradation.

In terms of material density, RO3006 has a density of 2.6 gm/cm3 at 23℃ (ASTM D 792). This characteristic contributes to its lightweight yet robust nature.

Furthermore, RO3006 exhibits excellent copper peel strength, with a value of 7.1 Ib/in. This measurement is conducted on 1oz copper after solder float (IPC-TM 2.4.8), ensuring reliable adhesion between the material and copper layers.

RO3006 also meets safety standards, achieving a flammability rating of V-0 (UL 94). Additionally, it is compatible with lead-free processes, making it an environmentally friendly and compliant choice.

PCB Capability with RO3006

When it comes to RO3006 50mil substrate PCBs, we offer a range of options including single layer boards, double layer boards, multi-layer boards, and hybrid types. These PCBs come in various thicknesses, such as 5 mils, 10 mils, 20 mils, 25 mils, and 50 mils.

We can provide finished copper on the PCBs at 1oz, 2oz, and 3oz. Furthermore, our maximum PCB size on high frequency materials is 400mm by 500mm. This allows for single board configurations or multiple designs within a single panel.

In terms of surface finishes, we offer solder masks in a variety of colors including green, black, blue, red, and yellow. Additionally, we provide options for surface finishes such as immersion gold, HASL, immersion silver, immersion tin, and bare copper for the pads.

A Glimpse of RO3006 PCBs

Displayed on thefollowing is a sample of a 50 mil RO3006 PCB with immersion gold. This particular PCB finds its typical applications in GPS antennas, power amplifiers and antennas, patch antennas for wireless communications, and direct broadcast satellites, among others.

Conclusion

In conclusion, RO3006 50mil high frequency PCB stands as an advanced high-performance laminate material with a dielectric constant of 6.15±0.05 during the manufacturing process and 6.5 for design purposes. It showcases a low dissipation factor, excellent thermal stability, dimensional accuracy, superior electrical properties, reliable mechanical performance, high Td, good density, and strong copper peel strength. Moreover, it exhibits low moisture absorption, good thermal conductivity, and meets safety standards. With a PCB manufacturing process similar to standard PTFE PCBs, volume manufacturing and economical pricing can be achieved, positioning it for success in the market.