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RT/duroid 6002 High Frequency PCB

  • November 01. 2023

RT/duroid 6002 High Frequency PCB

 

Overview

In this article, we will discuss the high frequency PCB created using RT/duroid 6002 material.


Rogers RT/duroid 6002 material is a preferred choice for PTFE-based ceramic composites. It is a low loss and low dielectric constant laminate that meets the rigorous requirements for mechanical reliability and electrical stability in complex microwave structural designs.

 

The dielectric constant of RT/duroid 6002 remains stable across temperatures ranging from -55 ℃ to 150 ℃, making it suitable for filters, oscillators, and delay lines that require electrical stability.


Rogers 6002 PCB

 

Properties of RT/duroid 6002

RT/duroid 6002 showcases impressive characteristics that make it ideal for demanding applications. Let's explore some key features.

 

Let's begin by discussing the Dielectric Constant of RT/duroid 6002 substrate. It maintains a reliable signal transmission with a process value of 2.94±0.04 at 10 GHz and 23°C. The Dielectric Constant remains consistent at 2.94 throughout the design phase, covering a frequency range of 8 GHz to 40 GHz, as determined by the Differential Phase Length Method.

 

The Dissipation Factor, or tan delta, is remarkably low at 0.0012 at 10 GHz and 23°C, indicating minimal signal loss and excellent performance.

 

RT/duroid 6002 also exhibits a positive thermal coefficient of dielectric constant, measuring +12 ppm/°C at 10 GHz over a temperature range of 0°C to 100°C. This ensures stability and reliable performance even in varying thermal conditions.

 

In terms of electrical properties, RT/duroid 6002 demonstrates excellent electrical insulation capabilities with a volume resistivity of 10^6 Mohm.cm. Additionally, the surface resistivity measures 10^7 Mohm, further enhancing the material's electrical performance.

 

When it comes to mechanical properties, RT/duroid 6002 showcases impressive tensile modulus values of 828 MPa (120 kpsi) in both the X and Y directions at 23°C, indicating its high strength and rigidity. The material also exhibits an ultimate stress of 6.9 MPa (1.0 kpsi) and an ultimate strain of 7.3%, highlighting its ability to withstand demanding conditions.

 

To ensure structural integrity under pressure, RT/duroid 6002 boasts a compressive modulus of 2482 MPa (360 kpsi) in the Z direction.

 

Rogers 6002 PCB has excellent resistance to moisture absorption, with only 0.02% absorption according to the D48/50 test method specified by IPC-TM-650 2.6.2.1 and ASTM D570.

 

The material also exhibits a thermal conductivity of 0.6 W/m/K at 80°C, allowing for efficient heat dissipation in electronic systems.

 

In terms of thermal expansion, RT/duroid 6002 has a coefficient of thermal expansion of 16 ppm/°C along the X and Y axes, and 24 ppm/°C along the Z axis, at 23°C and 50% relative humidity.

 

Other notable properties include a decomposition temperature (Td) of 500°C, ensuring the material's stability and reliability even at high temperatures. The density of RT/duroid 6002 is 2.1 gm/cm³, and its specific heat measures 0.93 J/g/K (0.22 BTU/ib/°F), contributing to efficient thermal management.

 

RT/duroid 6002 also exhibits excellent copper peel strength, with a value of 8.9 lbs/in (1.6 N/mm), as tested according to IPC-TM-650 2.4.8.

 

Additionally, RT/duroid 6002 is classified as V-0 for flammability according to UL 94 standards, ensuring its resistance to ignition and flame propagation.

 

Furthermore, RT/duroid 6002 is compatible with lead-free processes, aligning with industry standards and environmental regulations.

 

Property

RT/duroid 6002

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.94±0.04

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Dielectric Constant,εDesign

2.94

 

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0012

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

+12

Z

ppm/℃

10 GHz 0℃-100℃

IPC-TM-650 2.5.5.5

Volume Resistivity

106

Z

Mohm.cm

A

ASTM D 257

Surface Resistivity

107

Z

Mohm

A

ASTM D 257

Tensile Modulus

828(120)

X,Y

MPa(kpsi)

23℃

ASTM D 638

Ultimate Stress

6.9(1.0)

X,Y

MPa(kpsi)

Ultimate Strain

7.3

X,Y

%

Compressive Modulus

2482(360)

Z

MPa(kpsi)

 

ASTM D 638

Moisture Absorption

0.02

 

%

D48/50

IPC-TM-650 2.6.2.1
ASTM D 570

Thermal Conductivity

0.6

 

W/m/k

80℃

ASTM C518

Coefficient of Thermal Expansion
(-55 to 288℃)

16
16
24

X
Y
Z

ppm/℃

23℃/50% RH

IPC-TM-650 2.4.41

Td

500

 

℃ TGA

 

ASTM D 3850

Density

2.1

 

gm/cm3

 

ASTM D 792

Specific Heat

0.93(0.22)

 

j/g/k
(BTU/ib/OF)

 

Calculated

Copper Peel

8.9(1.6)

 

Ibs/in.(N/mm)

 

IPC-TM-650 2.4.8

Flammability

V-0

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 

 

 

 RT/duroid 6002 PCB Capability

For RT/duroid 6002 PCBs, we offer single layer, double layer, multi-layer, and hybrid board options.

 

RT/duroid 6002 PCBs are available in various thicknesses, including standard thicknesses such as 10 mils, 20 mils, 30 mils, and 60 mils, as well as non-standard thicknesses like 15 mils, 25 mils, 35 mils, and 40 mils. Our designers can create boards as thin as 5 mils and as thick as 125 mils.

 

The finished PCB copper options include 1oz and 2oz. Our high frequency material can accommodate a maximum PCB size of 400mm by 500mm, allowing for single boards or different designs within a panel.

 

We offer solder mask options in green, black, blue, yellow, and more. Pads plating options include immersion gold, HASL, immersion silver, immersion tin, and bare copper.

 

PCB material:

Ceramic-filled PTFE composite

Designation:

RT/duroid 6002

Dielectric constant:

2.94  ±0.04 (process), 2.94 (design)

Layer count:

1-layer, 2-layer, multi-layer, hybrid designs.

Laminate thickness:

5mil (0.127mm), 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 35mil (0.889mm), 40mil (1.016mm), 50mil (1.270mm), 60mil (1.524mm), 90mil (2.286mm), 100mil (2.540mm), 120mil (3.048mm), 125mil (3.175mm)

Copper weight:

1oz (35µm), 2oz (70µm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red, etc.

Surface finish:

Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP etc..

 

An Example of RT/duroid 6002 PCB

RT/duroid 6002 PCBs are typically white in color. The image presented showcases a double-sided PCB with immersion silver, designed specifically for phased array antennas.


 RT/duroid 6002 High Frequency PCB


RT/duroid 6002 PCB Applications

RT/duroid 6002 PCBs find their applications in various fields such as GPS antennas, ground-based and airborne radar systems, power backplanes, and commercial airline collision avoidance systems.

 

In Conclusion

RT/duroid 6002 high frequency PCBs offer tight thickness control and low out-gassing. They are highly suitable for flat and non-planar structures, including antennas, complex multi-layer PCBs with inner-layer connections, and microwave PCBs for aerospace designs in challenging environments.

 

 

 

 

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