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20 mil RO4003C PCB
20 mil RO4003C PCB
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Why Choose CLTE-AT Material for Automotive Radar and RF Circuit Designs?

  • January 22. 2026

Why Choose CLTE-AT Material for Automotive Radar and RF Circuit Designs?

 

This is a fundamental and highly practical question. The selection of CLTE-AT material for automotive radar and RF circuit designs is not based on a single factor, but rather because its comprehensive performance characteristics precisely meet the extreme and demanding requirements of these application fields. Rogers CLTE-AT achieves an optimal balance between performance, reliability, and commercial viability.

 

Here are the detailed technical reasons why CLTE-AT PCB is a premier choice for these designs:

 


1. Ultra-Low Signal Loss (Insertion Loss / Dissipation Factor)

Key Parameter: Exceptionally low Dissipation Factor (Df) of 0.0013, ranking among the best in commercial materials.

 

Impact on Design: Automotive radar (e.g., 77 GHz) and high-speed RF circuits operate at extremely high frequencies. Any signal loss introduced by the substrate material directly reduces system effective power, signal-to-noise ratio, and detection range/communication quality. The low-loss property of CLTE-AT ensures that valuable RF energy is maximized for signal transmission rather than being converted into heat, which is critical for improving radar detection accuracy and communication link budget.

 


2. Exceptional Electrical and Mechanical Stability vs. Temperature

Key Parameters: Stable Dielectric Constant (Dk tolerance±0.04), low Coefficient of Thermal Expansion (CTE: X/Y: 8 ppm/°C, Z: 20 ppm/°C), and a very low Temperature Coefficient of Dielectric Constant (TCEr).

 

Impact on Design: The automotive environment experiences an extremely wide temperature range (-40°C to +125°C or higher). The electrical properties (e.g., Dk) and physical dimensions of common materials can shift significantly within this range, leading to:

 

Frequency Drift: The operating frequency of the radar or the center frequency of filters shifts with temperature, causing performance failure.

 

Phase Misalignment: In phased-array radar antennas, temperature-induced phase changes can distort beam steering and shape.

 

Structural Reliability Issues: CTE mismatch can lead to solder joint fatigue and delamination.

CLTE-AT substrate's electrical phase stability and Dk stability ensure that radar and RF circuit performance remains consistent and predictable across the entire operating temperature range, which is a non-negotiable requirement for automotive safety systems.

 

CLTE-AT PCB



3. Superior Dimensional Stability for High-Precision Manufacturing

Key Feature: Woven glass reinforcement provides outstanding dimensional stability, especially critical for thin substrates (e.g., 0.13mm / 5 mil as in the example board).

 

Impact on Design: Modern RF circuits and radar modules often feature dense layouts with fine traces (e.g., 4/6 mil) and numerous vias. Any shrinkage, expansion, or warping of the board during manufacturing or operation can cause:

 

Registration Errors: Misalignment between layers, affecting impedance control and signal integrity.

 

Assembly Defects: Difficulty in placing and soldering miniature components accurately.

CLTE-AT's stability ensures high production yields and long-term reliability, which is essential for cost-effective, high-volume automotive production.

 


4. Excellent Thermal Management Capability

Key Parameter: Thermal conductivity of 0.64 W/mK, which is significantly higher than standard FR-4.

 

Impact on Design: Radar transceiver chips and RF power amplifiers generate substantial heat. Efficient heat dissipation is crucial to:

 

Prevent performance degradation due to overheating.

Extend component lifespan and system reliability.

 

Enable higher power handling in compact designs.


The higher thermal conductivity of CLTE-AT helps transfer heat away from active components more effectively than common alternatives, supporting robust power handling in confined spaces like automotive sensor modules.

 


5. Balanced Performance at a Commercial Cost Point

This is the defining advantage of CLTE-AT over its sibling, CLTE-XT. While CLTE-XT may offer marginally better RF performance, CLTE-AT provides the vast majority of the critical benefits—extremely low loss, superb stability, good thermal properties—at a more affordable commercial price. For high-volume automotive applications where cost is a major factor, CLTE-AT represents the "sweet spot."

 

Comparison in Context:

vs. Standard FR-4: FR-4 has high loss and poor stability at high frequencies, making it unsuitable for core radar/RF functions.

 

vs. Standard PTFE (Teflon) Laminate: Pure PTFE has excellent RF properties but poor mechanical stability, making it difficult to process and unreliable for automotive environments.

 

vs. CLTE-XT: CLTE-XT is the performance leader but comes at a premium. CLTE-AT delivers ~90-95% of the performance for a more accessible cost, making it the pragmatic choice for most commercial automotive and RF designs.

 

 

Conclusion

For automotive radar and critical RF circuit designs, engineers choose CLTE-AT high frequency PCB  material because it is a system-enabling solution. It directly addresses the triumvirate of challenges in these applications: preserving signal integrity at high frequencies, maintaining unwavering performance across harsh environmental conditions, and enabling reliable, high-yield manufacturing—all within a cost framework suitable for mass production. It is not just a PCB material; it is a foundational component for achieving the safety, reliability, and performance standards demanded by next-generation automotive and communication systems.

 

 

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