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20 mil RO4003C PCB
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TMM Series Laminate Materials

  • December 30. 2021
TMM Series Laminate Materials

TMM series temperature stable microwave composite circuit board materials are thermosetting resin polymer composite materials filled with ceramic powder, specially designed for high-reliability stripline and microstrip line applications. TMM series laminate materials are suitable for a wide dielectric constant Scope and surface coating requirements.

The electrical and mechanical properties of the TMM series laminate materials have been combined year after year, which helps to play the respective characteristics of ceramic and traditional PTFE microwave circuit laminates.
And there is no need for special cattle production technology to process such circuit board materials. For TMM series laminate materials that require metallized holes, there is no need for sodium naphthalene solution treatment before chemical copper formation.

TMM10 composite laminate material is one of the most used species.

The abnormally low thermal coefficient of the TMM series laminate materials (typical value is lower than the dielectric constant of 3OPPM/CO, which enables it to obtain consistent electrical performance in a wide temperature range.

TMM series laminate materials have isotropic thermal expansion coefficients, which are very compatible with copper and can be used to produce high-reliability metallized holes with low etching shrinkage values. In addition, the thermal conductivity of TMM series laminate materials is close to twice the value of traditional PTFE/ceramic laminate materials, so it is easy to remove heat.

TMM series laminate materials are based on thermosetting resin, so they will not become soft when heated. This feature can be used to link the component pins and the wire bonding during the electrical installation process, and there is no need to consider the drift of the bonding pad or the deformation of the substrate.
Based on it, so it won’t change when heated

TMM series laminate materials are easy to use the manufacturing process technology of flexible dielectric substrates to achieve the desired characteristics of many ceramic substrates.

TMM series temperature stable microwave laminate materials are suitable for electrolytic copper foil (ED) of 1/4 ounce to 2 fens/square foot, or directly bonded with brass or aluminum plates (BONDED). The thickness of the substrate ranges from 0.015 inches to 0.500 inches. Thicker substrates can also be used. When this kind of substrate is used in printed circuit production, it can resist the erosion of etching liquid and solvent. Therefore, all public printed circuit board (PWB) processes can be used for the production of TMM microwave laminates.

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