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20 mil RO4003C PCB
20 mil RO4003C PCB
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What Makes the Rogers RO4003C PCB Stand Out from the Crowd?

  • June 05. 2023

What Makes the Rogers RO4003C PCB Stand Out from the Crowd?


When it comes to finding a reliable and high-quality PCB material, the 32 mil Rogers RO4003C material PCB stands out as an exceptional choice. This article will explore this advanced PCB material and provide insight into its features, benefits, and technical specifications.


32mil RO4003C material PCB


Features and Benefits of the Rogers RO4003C PCB

The Rogers RO4003C PCB has a minimum trace/space of 6/7 mils, a finished board thickness of 0.98 mm, and a finished Cu weight of 1 oz (1.4 mils) for all layers. Its surface finish is ENIG (Electroless Nickel and Immersion Gold), and it has no silkscreen on solder pads. This PCB has undergone a 100% electrical test, and slotted holes are plated through according to Gerber. The panelized solder paste stencil is supplied for the top side, and there are no blind or buried vias. Additionally, the Rogers RO4003C PCB has impressive component and pad counts, with 97 components, 163 total pads, 15 thru-hole pads, 67 top SMT pads, and 81 bottom SMT pads. It also has 100 vias and 70 nets, making it a versatile and efficient board for a wide range of applications.


Technical Specifications of the Rogers RO4003C PCB

The Rogers RO4003C substrate has a dielectric constant of 3.38±0.05 and a dissipation factor tan, δ of "0.0027/0.0021" at 10 GHz/23℃and 2.5 GHz/23℃, respectively. Its thermal coefficient of ε is +40 ppm/℃within the range of -50℃ to 150℃, and its volume resistivity is 1.7 x 1010 MΩ.cm (COND A). The surface resistivity is 4.2 x 109 MΩ (COND A), and the electrical strength is 31.2(780) Kv/mm (v/mil) at 0.51mm (0.020") thickness. The PCB has a Tg of >280℃TMA (A) and a Td of 425℃TGA, making it suitable for high-temperature applications. Its thermal conductivity is 0.71 W/M/K at 80℃, and its moisture absorption is 0.06% after 48hrs immersion at 50℃. The density is 1.79 gm/cm3 at 23℃, and the copper peel strength is "1.05 (6.0)" N/mm (pli) after solder float with 1 oz. EDC Foil.


Impedance Matching and Design Guidelines for the Rogers RO4003C PCB

While the Rogers RO4003C PCB does not come with impedance matching, it can support a range of design features, including blind and buried vias, controlled impedance, and fine pitch components. Designers should follow design guidelines to ensure optimal performance and reliability. The PCB is compatible with lead-free processes and can be manufactured using standard PCB fabrication techniques.


Applications of the Rogers RO4003C PCB

The Rogers RO4003C PCB is suitable for a wide range of applications, including wireless infrastructure, aerospace and defense, automotive, and industrial automation. Its high-temperature range and excellent electrical properties make it ideal for high-frequency applications and harsh environments.


Manufacturing Process and Lead-Free Compatibility of the Rogers RO4003C PCB

The Rogers RO4003C PCB is manufactured using a lead-free process, making it environmentally friendly and compliant with ROHS and WEEE regulations. Standard PCB fabrication techniques can be used to manufacture and assemble this PCB.


In conclusion, the high-performance Rogers RO4003C PCB is a versatile and can provide superior results for a wide range of applications. Its advanced features, excellent electrical properties, and lead-free compatibility make it an ideal choice for designers and manufacturers looking for reliable and high-quality PCB material. Choose the Rogers RO4003C PCB for your next project and experience the difference it can make.


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