RT/duroid 6035HTC Rogers PCB 2-layer 60mil 1.524mm Immersion Silver No Solder Mask White Legend

RT/duroid 6035HTC Rogers PCB 2-layer 60mil 1.524mm Immersion Silver No Solder Mask White Legend

Introduction

In the rapidly evolving world of high-frequency and high-power RF/microwave electronics, selecting the right printed circuit board (PCB) material is critical to ensuring optimal performance, thermal management, and signal integrity. The 60 mil RT/duroid 6035HTC PCB double-sided is engineered to meet the demanding requirements of advanced RF applications, offering superior thermal conductivity, low insertion loss, and exceptional high-frequency stability.

This comprehensive product description explores the construction, material properties, key benefits, and applications of the Rogers RT/duroid 6035HTC PCB, providing engineers and procurement specialists with the technical insights needed to make an informed decision.

PCB Construction

The RT/duroid6035HTC PCB is a double-sided board constructed with meticulous attention to detail and quality:

PCB Stackup

The 2-layer rigid PCB stackup of the Rogers 6035HTC showcases a well-balanced composition:

PCB Statistics

Intricate and robust, the RT/duroid 6035HTC PCB comes equipped with:

Introduction of RT/duroid 6035HTC

The RT/duroid 6035HTC material from Rogers presents a leap forward in circuit materials technology, offering exceptional thermal conductivity, long-term stability, and enhanced performance for high-power applications. Its superior thermal properties, including a thermal conductivity nearly 2.4 times that of standard laminates, make it a go-to choice for demanding applications.Features and Benefits Unveiled

Features

The RT/duroid 6035HTC PCB is characterized by a host of features that set it apart in the realm of high-frequency circuitry:

1.High-Frequency Performance

• Dielectric Constant (Dk): 3.5±0.05 @ 10 GHz/23°C
• Dissipation Factor (Df): 0.0013 @ 10 GHz/23°C
• Thermal Coefficient of Dk: -66 ppm/°C (excellent stability over temperature)

2.Thermal Management Advantages

• Thermal Conductivity: 1.44 W/m/K (2.4×better than standard RT/duroid 6000)
• CTE (Coefficient of Thermal Expansion):
• X/Y-axis: 19 ppm/°C (matches copper, reducing stress)
• Z-axis: 39 ppm/°C (prevents delamination)
• Moisture Absorption: 0.06% (enhances reliability in humid environments)

Benefits

Embracing the RT/duroid 6035HTC PCB unlocks a world of benefits that redefine performance standards:

• -High thermal conductivity for enhanced efficiency.
• -Improved dielectric heat dissipation leading to lower operating temperatures.
• -Excellent high-frequency performance for precision in signal transmission.
• -Lower insertion loss and exceptional thermal stability, guaranteeing operational reliability.

Applications

The RT/duroid 6035HTC substrate PCBfinds its place in a myriad of high-power applications, including:

• - High power RF and microwave amplifiers
• - Power amplifiers
• -couplers, filters
• -combiners
• -power dividers

Elevate Your Designs with RT/duroid 6035HTC PCB

The RT/duroid 6035HTC high frequency PCB is a high-performance, double-sided circuit board optimized for high-power RF/microwave applications. With exceptional thermal conductivity, low signal loss, and outstanding thermal stability, it is the ideal choice for power amplifiers, RF filters, combiners, and other high-frequency systems.

Whether you are designing for telecom, aerospace, defense, or industrial applications, this Rogers circuit board PCB delivers reliability, efficiency, and superior performance under demanding conditions.

Contact us today to discuss your project requirements and leverage the power of RT/duroid 6035HTC technology!