The board dimensions are 162mm x 102mm, with a finished board thickness of 0.98mm and a finished copper weight of 1.0 oz (1.4 mils) across all layers. The via plating thickness is 1 mil and the surface finish is Electroless Nickel and Immersion Gold (ENIG). The green top and bottom solder masks have been applied, and there is no silkscreen on either side of the board.

With a minimum trace/space of 5/6 mils and a minimum hole size of 0.5mm, high precision and accuracy are ensured. The PCB has also undergone 100% electrical testing to guarantee top-quality performance.

This PCB consists of 91 components, 153 total pads, 66 thru-hole pads, 87 top SMT pads, 0 bottom SMT pads, 122 vias, and 37 nets.

For your convenience, slotted holes defined in the Gerber are plated through, and the dimensions of the slots are defined by the side-by-side holes. All edges have been tab-routed and non-plated holes for breakouts have been included in the Gerbers. Breakouts are shown as per design FabDrawing.

In addition, IPC-4761 Type VII has been used to fill the 0.5mm vias with resin and cap them with copper, ensuring long-lasting durability and reliability.

In this article, we will provide a comprehensive guide to RO4003C PCBs, covering everything from design considerations to performance properties and applications.

What is RO4003C Material and Why is it Ideal for High-Frequency PCBs?

RO4003C material is a composite made of PTFE and ceramic fillers that provide low dielectric constant and low loss tangent, making it ideal for high-frequency applications. RO4003C has a dielectric constant of 3.38±0.05 at 10 GHz and a dissipation factor of 0.0027 at 10 GHz/23℃, which makes it suitable for RF/microwave communication systems, aerospace and defense electronics, and medical equipment design.

RO4003C PCB Design Considerations: Trace Width, Space, and Via Placement

When designing an RO4003C PCB, it is essential to consider trace width, space, and via placement to ensure optimal signal integrity. The minimum trace/space for an RO4003C PCB is 5/6 mils, and the minimum hole size is 0.5mm. Via plating thickness is 1 mil, and surface finish is Electroless Nickel and Immersion Gold (ENIG), providing excellent electrical performance and corrosion resistance.

The Importance of Surface Finish and Copper Weight in RO4003C PCBs

Surface finish and copper weight are critical factors that affect the performance and reliability of RO4003C PCBs. An ENIG surface finish provides excellent solderability and long-term reliability, while a base copperlayer of 18um with plating and a finished copper weight of 1 oz (1.4 mils) ensure good electrical conductivity and durability.

Electrical Testing and Quality Control for RO4003C PCBs

RO4003C PCBs undergo rigorous electrical testing and quality control measures to ensure they meet industry standards and customer specifications. Testing includes checks for dielectric constant, dissipation factor, electrical strength, and surface and volume resistivity.

RO4003C PCB Stackup: Layer Construction and Thickness

The layer construction and thickness of an RO4003C PCB play a crucial role in its performance and reliability. A 32mil 2-layer RO4003C material PCB offers a compact and lightweight solution that is ideal for applications where space is limited.

Understanding RO4003C PCB Properties: Dielectric Constant, Dissipation Factor, and Thermal Coefficient

RO4003C PCBs have unique properties that make them suitable for high-frequency applications. The dielectric constant, dissipation factor, and thermal coefficient are essential properties that affect the performance of an RO4003C PCB.

Mechanical Properties of RO4003C PCBs: Tensile and Flexural Strength, Dimensional Stability

The mechanical properties of an RO4003C PCB are critical to its durability and reliability. Tensile and flexural strength, as well as dimensional stability, are essential factors to consider when designing an RO4003C PCB.

RO4003C PCB Thermal Properties: Coefficient of Thermal Expansion, Thermal Conductivity, Tg, and Td

The thermal properties of an RO4003C PCB are essential for its thermal management and long-term reliability. The coefficient of thermal expansion, thermal conductivity, Tg, and Td are crucial properties to consider when designing an RO4003C PCB.

Moisture Absorption and Density of RO4003C PCBs

RO4003C PCBs have low moisture absorption and a density of 1.79 gm/cm3 at 23℃, making them suitable for applications where weight and size are critical factors.

Lead-Free Process Compatibility of RO4003C PCBs

RO4003C PCBs are compatible with lead-free processes, making them eco-friendly and in compliance with industry regulations.

In conclusion, RO4003C PCBs are a reliable and high-performing substrate that is suitable for a wide range of high-frequency applications. With its exceptional electrical performance, unique properties, and eco-friendly compatibility, RO4003C material is an excellent choice for designers and engineers looking to optimize their electronic systems' performance.

If you have any technical questions, Jane can be reached at sales20@bichengpcb.com.