4 Layer High Frequency PCB On 2 Cores of
32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler
(Printed
circuit boards are custom-made products, the picture and parameters shown are
just for reference)
There is a type of 4 layer high frequency PCB. This PCB is built on 2
sheets of 0.813mm (32mil) RO4003C cores with 1 sheet RO4450F prepreg for the
application of ultrahigh frequency coupler. Following is the stack-up.
In
general, multilayer Rogers high frequency PCBs are made from all high frequency
material inclusive of prepreg adhesive. As is known to all, there’re 6 cores in RO4003C family, i.e. 8mil (0.203mm) to 60mil (1.524mm).
|
RO4003C:
|
|
|
8mil
|
0.203mm
|
|
12mil
|
0.305mm
|
|
16mil
|
0.406mm
|
|
20mil
|
0.508mm
|
|
32mil
|
0.813mm
|
|
60mil
|
1.524mm
|
So
it’s very interesting that stack-up of 4 layers can be done in many different
ways.
The
specifications of the board are as follows:
Base
material: RO4003C 32mil + RO4450F 12mil PP
Layer
count: 4 layers
Type:
Castellation holes (half holes) on edge
Format:
113mm x 80mm = 1 type = 4 piece
Surface
finish: Immersion gold
Copper
weight: Outer layer 35 μm/ Inner layer 35 μm
Solder
mask / Legend: no / no
Final
PCB height: 2.1 mm
Standard:
IPC 6012 Class 2
Packing:
20 panels are packed for shipment.
Lead
time: 10 working days
Shelf
life: 6 months
You enjoy the features and benefits
1) Excellent
high frequency performance due to low dielectric tolerance and loss;
2) AOI
inspection;
3) Meeting
your PCB needs from prototype to mass production;
4) 30000
square meter month capability;
5) 8000
types of PCB's per month;
6) More
than 16 years of PCB experience;
Application
GPS
antenna, WiFi amplifier, Power amplifier, RF transceiver, TV antenna, Radar
data acquisition converter, Spread
spectrum, Attenuator
Appendix:
Properties of RO4003C
|
RO4003C
Typical Value
|
|
Property
|
RO4003C
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
3.38±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
3.55
|
Z
|
|
8 to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factortan,δ
|
0.0027
0.0021
|
Z
|
|
10
GHz/23℃
2.5 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of ε
|
+40
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
1.7 x 1010
|
|
MΩ.cm
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Surface Resistivity
|
4.2 x 109
|
|
MΩ
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Electrical Strength
|
31.2(780)
|
Z
|
Kv/mm(v/mil)
|
0.51mm(0.020")
|
IPC-TM-650
2.5.6.2
|
|
Tensile Modulus
|
19,650(2,850)
19,450(2,821)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Tensile Strength
|
139(20.2)
100(14.5)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Flexural Strength
|
276
(40)
|
|
MPa
(kpsi)
|
|
IPC-TM-650
2.4.4
|
|
Dimensional Stability
|
<0.3
|
X,Y
|
mm/m
(mil/inch)
|
after etch+E2/150℃
|
IPC-TM-650
2.4.39A
|
|
Coefficient of Thermal Expansion
|
11
14
46
|
X
Y
Z
|
ppm/℃
|
-55℃to288℃
|
IPC-TM-650
2.4.41
|
|
Tg
|
>280
|
|
℃TMA
|
A
|
IPC-TM-650
2.4.24.3
|
|
Td
|
425
|
|
℃TGA
|
|
ASTM
D 3850
|
|
Thermal Conductivity
|
0.71
|
|
W/M/oK
|
80℃
|
ASTM
C518
|
|
Moisture Absorption
|
0.06
|
|
%
|
48hrs
immersion 0.060"
sample Temperature 50℃
|
ASTM
D 570
|
|
Density
|
1.79
|
|
gm/cm3
|
23℃
|
ASTM
D 792
|
|
Copper Peel Stength
|
1.05
(6.0)
|
|
N/mm
(pli)
|
after
solder float 1 oz.
EDC Foil
|
IPC-TM-650
2.4.8
|
|
Flammability
|
N/A
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
Thank
you for your reading and you’re welcome to contact us for your PCB enquires.
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