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Home High Frequency PCB 4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C 12mil RO4450F

4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C 12mil RO4450F

The Rogers RO4003C series PCB is a glass-reinforced hydrocarbon laminate and is available in two versions.

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4 Layer High Frequency PCB On 2 Cores of 32mil 0.813mm RO4003C and 12mil RO4450F for Ultrahigh Frequency Coupler

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

There is a type of 4 layer high frequency PCB. This PCB is built on 2 sheets of 0.813mm (32mil) RO4003C cores with 1 sheet RO4450F prepreg for the application of ultrahigh frequency coupler. Following is the stack-up.

4 Layer stackup on 2 core RO4003C+1 Prepreg 4450F

In general, multilayer Rogers high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive. As is known to all, there’re 6 cores in RO4003C family, i.e. 8mil (0.203mm) to 60mil (1.524mm).














So it’s very interesting that stack-up of 4 layers can be done in many different ways.

The specifications of the board are as follows:

Base material: RO4003C 32mil + RO4450F 12mil PP

Layer count: 4 layers

Type: Castellation holes (half holes) on edge

Format: 113mm x 80mm = 1 type = 4 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 35 μm

Solder mask / Legend: no / no

Final PCB height: 2.1 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

You enjoy the features and benefits

1) Excellent high frequency performance due to low dielectric tolerance and loss;

2) AOI inspection;

3) Meeting your PCB needs from prototype to mass production;

4) 30000 square meter month capability;

5) 8000 types of PCB's per month;

6) More than 16 years of PCB experience;


GPS antenna, WiFi amplifier, Power amplifier, RF transceiver, TV antenna, Radar data acquisition converter,      Spread spectrum, Attenuator

Appendix: Properties of RO4003C

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z 10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
Z 10 GHz/23℃
2.5 GHz/23℃
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 1.7 x 1010 MΩ.cm COND A IPC-TM-650
Surface Resistivity 4.2 x 109 COND A IPC-TM-650
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650
Tensile Modulus 19,650(2,850)
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
MPa(ksi) RT ASTM D 638
Flexural Strength 276
IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃TMA A IPC-TM-650
Td 425 ℃TGA ASTM D 3850
Thermal Conductivity 0.71 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-free Process Compatible Yes

Thank you for your reading and you’re welcome to contact us for your PCB enquires.




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