F4B High
Frequency PCB DK 2.2 PTFE PCB with 3.0mm Thick 1oz Copper and HASL Lead Free
for Patch Antenna
(PCB's are custom-made products, the picture
and parameters shown are just for reference)
There is a type of F4B high frequency
circuit board at 3.0mm thick.
F4B series high frequency material is mainly
PTFE glass fiber cloth and ceramic-filled PTFE glass fiber cloth etc. It is a
series of high frequency materials of Chinese brand, which is cheap in price
and stable in quality. It's widely applied to satellite communication,
navigation, radar, 4G communications, 5G communications and the like.
PCB Specifications
|
Layer count:
|
Double sided
|
|
Base material:
|
F4B DK 2.2
|
|
Dimension:
|
25 x 26mm
|
|
Finished
thickness
|
3.0mm ±10%
|
|
Finished Copper
weight:
|
1oz
|
|
SMOBC:
|
No
|
|
Surface finish:
|
HASL Pb free
|
The main specifications of this board is double
sided F4B substrate board, DK at 2.2, 61mm long by 62mm wide, finished
thickness at 3.0mm, finished copper at 1.0oz, no solder mask no silkscreen and
surface finish is OSP.
Let’s see the stack up.
Top layer and bottom layer are 1oz copper
finished. F4B dielectric material is in the middle of 2 layers copper, showing
dielectric constant at 2.2, 3.0mm thick.
This is the photo of this board. The basic
colour of F4B PCB is brown.
Our PCB Capability (PTFE)
|
PCB Material:
|
PTFE
|
|
Code:
|
F4B series
|
|
Dielectric
constant:
|
2.2, 2.55 and
2.65
|
|
2.17, 2.45, 2.75
and 3.0
|
|
Layer count:
|
1 Layer, 2
Layer, Multilayer, Hybrid type
|
|
Copper weight:
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0.5oz, 1oz, 2oz,
3oz
|
|
PCB thickness:
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0.17mm, 0.25mm,
0.5mm, 0.8mm, 1.0mm,
|
|
1.5mm, 2.0mm,
3.0mm, 4.0mm and 5.0mm, etc.
|
|
PCB Size:
|
≤400mm X 500mm
|
|
Surface finish:
|
Bare copper,
HASL, ENIG, Immersion tin etc.
|
|
|
|
The dielectric constant of F4B material is
wide, ranging 2.2 to 3.0 etc. Board thickness ranges 0.17mm to 5.0mm. We can
provide you with prototype service, small batches and mass production service.
Appendix: Data Sheet PTFE(F4B)
|
Name
|
Test condition
|
Unit
|
Value
|
|
Density
|
Normal state
|
g/ cm3
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2.1～2.35
|
|
Moisture
Absorption
|
Dip in the distilled
water of 20±2℃ for 24
hours
|
%
|
≤0.02
|
|
Operating
Temperature
|
High-low temperature
chamber
|
℃
|
-50℃～+260℃
|
|
Thermal
Conductivity
|
|
W/m/k
|
0.8
|
|
CTE （typical）
|
0～100℃ （εr ：2.1~2.3）
|
ppm/℃
|
25（x）
|
|
34（y）
|
|
252（z）
|
|
CTE （typical）
|
0～100℃ （εr ：2.3~2.9）
|
ppm/℃
|
14（x）
|
|
21（y）
|
|
173（z）
|
|
CTE （typical）
|
0～100℃ （εr ：2.9~3.5）
|
ppm/℃
|
12（x）
|
|
15（y）
|
|
95（z）
|
|
Shrinkage
Factor
|
2 hours in boiling
water
|
%
|
0.0002
|
|
Surface Resistivity
|
500V DC
|
Normal state
|
M·Ω
|
≥1×104
|
|
Constant
humidity and temperature
|
≥1×103
|
|
Volume Resistivity
|
Normal state
|
MΩ.cm
|
≥1×106
|
|
Constant
humidity and temperature
|
≥1×105
|
|
Pin Resistance
|
500V DC
|
Normal state
|
MΩ
|
≥1×105
|
|
Constant humidity and temperature
|
≥1×103
|
|
Surface dielectric strength
|
Normal state
|
d=1mm（Kv/mm）
|
≥1.2
|
|
Constant
humidity and temperature
|
≥1.1
|
|
Dielectric Constant
|
10GHZ
|
εr
|
2.20，2.55，2.65，3.0，3.5 （±2%）
|
|
Dissipation Factor
|
10GHZ
|
tgδ
|
2.2
|
≤7×10-4
|
|
2.55~2.65
|
≤1×10-3
|
|
3.0~3.5
|
≤1.5×10-3
|
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