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Metal based substrate is a combination of metal
based high frequency materials. The
intermediate medium is made of high frequency materials, one side is coated with copper foil, the other side is coated with copper base or aluminum base.
Item NO.:
BIC-107-v20.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysMetal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device
The PCB made on this kind of modified material, we can call it metal based high frequency PCB.
Parameters:
DK @ 10GHz & Tolerance: 2.20+/- 0.03
Thermal Change of DK (ppm/℃): -48
Loss Tangent, Df@10GHz: 0.001
Thermal Conductivity(W/mk): 0.35
Td(℃): 476
Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98
Density (g/cm3): 1.80
Volume Resisivity (Mohm.cm) 1x 10^8
Surface Resistivity (Mohm): 1 x 10^8
Moisture Absorption: 0.02
Peel Strength (N/cm) (1oz): 20
Flammability Rating: UL94 V0
Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler:
| Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler |
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| Designator of Substrate | Material Composition / Dielectric Layer | Types | DK @ 10GHz & Tolerance | Thermal Change of Dk(ppm/℃) | Loss Tangent, Df@10GHz | Thermal Conductivity(W/mk) | Td (℃) | Coefficient of Thermal Expansion -50℃-260℃(ppm/℃) | Density (g/cm3): | Volume Resisivity (Mohm.cm) | Surface Resistivity (Mohm) | Moisture Absorption (%) | Peel Strength (N/cm) (1oz) | Flammability Rating | ||
| X | Y | Z | ||||||||||||||
| F4BTMS | PTFE/Ceramic/Superfine woven glass | F4BTMS220 | 2.20±0.03 | -48 | 0.0010 | 0.35 | 476 | 40 | 45 | 98 | 1.80 | 1X108 | 1X108 | 0.02 | 20 | V-0 |
| F4BTMS294 | 2.94±0.04 | -20 | 0.0012 | 0.58 | 490 | 10 | 12 | 22 | 2.25 | 1X108 | 1X108 | 0.03 | 12 | V-0 | ||
| F4BTMS300 | 3.00±0.04 | -20 | 0.0013 | 0.58 | 490 | 10 | 11 | 22 | 2.28 | 1X108 | 1X108 | 0.04 | 12 | V-0 | ||
| Designator of Substrate | Standard Dielectric Thickness(Without the cladding) and Tolerance | Available Copper Foil | Standard Size | |
| F4BTMS | 0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil) | Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us. | 0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper | 305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48") |
PCB Capability:
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PCB Capability |
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PCB Material: |
Modified PTFE Copper Clad with Ceramic Filler |
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Designator: |
F4BTMS220 |
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Dielectric constant @ 10GHz: |
2.2 |
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Layer count: |
Single Layer |
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Copper weight: |
0.5oz, 1oz |
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PCB thickness: |
1.2mm - 9.0mm |
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0.047” - 0.354” |
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Solder mask: |
Green, Red, Black, White, Blue etc. |
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PCB size: |
≤400mm X 500mm |
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Surface finish: |
Bare copper, HASL, ENIG, Immersion tin etc. |
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MAJOR MATERIAL SUPPLIERS:
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