
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
Metal based substrate is a combination of metal
based high frequency materials. The
intermediate medium is made of high frequency materials, one side is coated with copper foil, the other side is coated with copper base or aluminum base.
Item NO.:
BIC-107-v20.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysMetal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device
The PCB made on this kind of modified material, we can call it metal based high frequency PCB.
Parameters:
DK @ 10GHz & Tolerance: 2.20+/- 0.03
Thermal Change of DK (ppm/℃): -48
Loss Tangent, Df@10GHz: 0.001
Thermal Conductivity(W/mk): 0.35
Td(℃): 476
Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98
Density (g/cm3): 1.80
Volume Resisivity (Mohm.cm) 1x 10^8
Surface Resistivity (Mohm): 1 x 10^8
Moisture Absorption: 0.02
Peel Strength (N/cm) (1oz): 20
Flammability Rating: UL94 V0
Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler:
Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler |
|
|
|
|
|
|
|
|
|
|
|
|
||||
Designator of Substrate | Material Composition / Dielectric Layer | Types | DK @ 10GHz & Tolerance | Thermal Change of Dk(ppm/℃) | Loss Tangent, Df@10GHz | Thermal Conductivity(W/mk) | Td (℃) | Coefficient of Thermal Expansion -50℃-260℃(ppm/℃) | Density (g/cm3): | Volume Resisivity (Mohm.cm) | Surface Resistivity (Mohm) | Moisture Absorption (%) | Peel Strength (N/cm) (1oz) | Flammability Rating | ||
X | Y | Z | ||||||||||||||
F4BTMS | PTFE/Ceramic/Superfine woven glass | F4BTMS220 | 2.20±0.03 | -48 | 0.0010 | 0.35 | 476 | 40 | 45 | 98 | 1.80 | 1X108 | 1X108 | 0.02 | 20 | V-0 |
F4BTMS294 | 2.94±0.04 | -20 | 0.0012 | 0.58 | 490 | 10 | 12 | 22 | 2.25 | 1X108 | 1X108 | 0.03 | 12 | V-0 | ||
F4BTMS300 | 3.00±0.04 | -20 | 0.0013 | 0.58 | 490 | 10 | 11 | 22 | 2.28 | 1X108 | 1X108 | 0.04 | 12 | V-0 |
Designator of Substrate | Standard Dielectric Thickness(Without the cladding) and Tolerance | Available Copper Foil | Standard Size | |
F4BTMS | 0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil) | Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us. | 0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper | 305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48") |
PCB Capability:
PCB Capability |
|
|
PCB Material: |
Modified PTFE Copper Clad with Ceramic Filler |
|
Designator: |
F4BTMS220 |
|
Dielectric constant @ 10GHz: |
2.2 |
|
|
||
Layer count: |
Single Layer |
|
Copper weight: |
0.5oz, 1oz |
|
PCB thickness: |
1.2mm - 9.0mm |
|
0.047” - 0.354” |
|
|
Solder mask: |
Green, Red, Black, White, Blue etc. |
|
PCB size: |
≤400mm X 500mm |
|
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin etc. |
|
BICHENG PCB WORSHOP:
MAJOR MATERIAL SUPPLIERS:
BICHENG PCB CERTIFICATE:
BICHENG MIAN COURIERS:
Previous:
PTFE High Frequency PCB 1.5mm DK 2.65 3oz Copper Coating Immersion GoldNext:
PTFE High Frequency PCB F4B ENIG Black Solder MaskIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Copper Coin Embedded PCB 6-Layer M6 and Isola 370HR Material Hybrid Board
Isola 370HR PCB 12-layer 1.6mm Thick ENIG High Tg FR-4 Multilayer Board
2-Layer 0.22mm Flexible Polyimide FPC PCB with 1.0mm FR-4 Stiffener ENIG
Wangling F4BM220 PCB 2-layer 6.0mm Thick ENIG F4BM Series High Frequency Laminates
RO3006 PCB 2-layer 10mil 0.254mm Rogers 3006 ENIG High Frequency Circuit Board
RO3210 PCB 4-layer 1.22mm Thick Rogers 3210 Laminate ENIG Multilayer Board
RO3010 PCB 4-layer 2.6mm Thick Rogers 3010 Immersion Tin Blind Vias
RO4003C PCB 3-layer 1.8mm Thick Rogers 4003C ENIG Blind Via Multilayer Board
© Copyright: 2025 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported