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Home PTFE PCB Board Metal Based High Frequency PCB 3.0mm PTFE 1.0oz coating Immersion Gold

Metal Based High Frequency PCB 3.0mm PTFE 1.0oz coating Immersion Gold

Metal based substrate is a combination of metal based high frequency materials.  The intermediate medium is made of high frequency materials, one side is coated with copper foil, the other side is coated with copper base or aluminum base.

  • Item NO.:

    BIC-107-v20.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device


The PCB made on this kind of modified material, we can call it metal based high frequency PCB.


PTFE HF PCB


Parameters:


DK @ 10GHz & Tolerance: 2.20+/- 0.03

Thermal Change of DK (ppm/℃): -48

Loss Tangent, Df@10GHz: 0.001

Thermal Conductivity(W/mk): 0.35

Td(℃): 476

Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98

Density (g/cm3): 1.80

Volume Resisivity (Mohm.cm) 1x 10^8

Surface Resistivity (Mohm): 1 x 10^8

Moisture Absorption: 0.02

Peel Strength (N/cm) (1oz): 20

Flammability Rating: UL94 V0


PTFE HF PCB DK2.65



Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler:


Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler











Designator of Substrate Material Composition / Dielectric Layer Types DK @ 10GHz & Tolerance Thermal Change of Dk(ppm/℃) Loss Tangent, Df@10GHz Thermal Conductivity(W/mk) Td (℃) Coefficient of Thermal Expansion -50℃-260℃(ppm/℃) Density (g/cm3): Volume Resisivity (Mohm.cm) Surface Resistivity (Mohm) Moisture Absorption (%) Peel Strength (N/cm) (1oz) Flammability   Rating
X Y Z
F4BTMS PTFE/Ceramic/Superfine woven glass F4BTMS220 2.20±0.03 -48 0.0010 0.35 476 40 45 98 1.80 1X108 1X108 0.02 20 V-0
F4BTMS294 2.94±0.04 -20 0.0012 0.58 490 10 12 22 2.25 1X108 1X108 0.03 12 V-0
F4BTMS300 3.00±0.04 -20 0.0013 0.58 490 10 11 22 2.28 1X108 1X108 0.04 12 V-0



Designator of Substrate Standard Dielectric Thickness(Without the cladding) and Tolerance Available Copper Foil Standard Size
F4BTMS 0.127mm(5mil) ±0.0127mm(0.5mil)        0.254mm(10mil) ±0.02mm(1mil)            0.508mm(20mil) ±0.03mm(1.19mil)        0.762mm(30mil) ±0.04mm(1.58mil)      1.016mm(40mil) ±0.05mm(2mil)               1.524mm(60mil) ±0.05mm(2mil)            3.05mm(120mil) ±0.1mm(4mil)               5.08mm(200mil) ±0.127mm(5mil) Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us. 0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper 305mm x 460mm (12" x 18")      460mm x 610mm (18" x 24")      500mm x 600mm (19.7" x 23.6")       915mm x 1220mm (36" x 48")



PCB Capability:


PCB Capability


PCB Material:

Modified PTFE Copper Clad with Ceramic Filler


Designator:

F4BTMS220


Dielectric constant     @ 10GHz:

2.2



Layer count:

Single Layer


Copper weight:

0.5oz, 1oz


PCB thickness:

1.2mm - 9.0mm


0.047” - 0.354”


Solder mask:

Green, Red, Black, White, Blue etc.


PCB size:

≤400mm X 500mm


Surface finish:

Bare copper, HASL, ENIG, Immersion tin etc.



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